Zephyrtronics | ZT-6 AIRFOUNTAIN®

ZT-6 AIRFOUNTAIN®
Rapid & Effective Thru-Hole Hot-Air “Selective Soldering” Reflow System

Yes! You Can Simultaneously Solder or DeSolder Hundreds of Thru-Hole Joints In Less Than One Minute!

METHOD ONE:

“Solder Pre-forms” for Selective Soldering Mixed Boards.

STEP 1: Assemble the “Solder Pre-form” onto the connector (on thru-hole component)
as shown.

STEP 2: Insert conn-ector (with pre-forms attached) into board from above as shown.

METHOD TWO:

“Paste-in-Hole”, “Pin-in-Paste” “Intrusive Reflow Soldering” for Selective Soldering Mixed Boards.

STEP 1: Carefully dispense the determined amount of Solder Paste to the thru-hole pad and barrel. A good rule of thumb: have a minimum pin-to-hole ratio of 0.3.

STEP 2: Insert conn-ector from above into the board as shown.

METHOD THREE:

“Solder Washers” for Selective Soldering Mixed Boards.

STEP 1: Assemble the Solder Washers onto the connector (or thru-hole component)
as shown.

STEP 2: Insert the connector (with Solder Washers over pins) into the board from below (so washers do not fall off). Washers will be sand-wiched between conn-ector body and substrate.


	SOLDERING THRU-HOLE JOINTS

S T E P S 3 & 4 F O R A L L M E T H O D S :

STEP 3: Position PCB onto the ZT-6 with connector leads into opening of cor-responding FountainHead®. (Approx. one minute for reflow using the Digital Countdown Timer). Use ABC-6 to support larger PCB assemblies

STEP 4: After count-down, gently remove PCB from AirFountain® and cool PCB rapidly. Clean and inspect. Ready for next board! Turn off ZT-6 when finished

DE-SOLDERING THRU-HOLE JOINTS

STEP 1: Turn on ZT-6 AirFountain® and set temperature to your determined reflow setting. Position PCB onto the ZT-6 with connector pins inside of opening of corresponding FountainHead®.

STEP 3: Remove PC Board from off of the ZT-6 AirFountain®. Clean and inspect. Turn off the ZT-6 AirFountain®.

STEP 2: After count-down of approximately 30 to 60 seconds (use Digital Countdown Timer), extract the connector (or thru-hole component) with a proper extracting tool from out of the PC board.

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DISCLAIMER

The ZT-6 AirFountain® can and does provide rapid and simultaneous reflow of multi-pinned thru-hole devices without reflowing adjacent components, but Zephyrtronics always recommends a brief pre-heating stage of the PCB assembly prior to the reflow stage at the ZT-6 AirFountain®. Please see our very effective, award-winning AirBath Preheating Systems. Remember, preheating will yield shorter duration at reflow and lower reflow temperatures.

These illustrations are only intended to give a brief understanding of how the ZT-6 AirFountain® operates and its capacities, utilities and features. As with all soldering equipment, operators and technicians must read and review owners manuals and be trained before operating equipment.

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