SMD Removal Rework, LowMelt Desolder Wire, Low Melt Removes Chip Quick, SMD Rework, SMT Rework, Low Temperature Rework, Low Melting Alloy, DSolder, D-Solder, Bismuth Solder, LowMelt DeSoldering
LowMelt DeSolder Wire
Removes Chips Quick

 



Zephyrtronics Equipment is Engineered and Manufactured in the United States of America.

PCB Rework Kits, PCB Assembly Kits

Hot Air Pencil, Hot Air Soldering

Forced Convection, Preheating

Lead-Free Solder Paste, RoHS

Rework Flux, PCB Flux, Soldering Flux

Blunt Needles, Industrial Needles, Dispensing

Alcohol Pump Bottles

Fume, Extraction, Bench, Desk

SMD Removal    Low Melt® DeSolder    Removes Chip Quick  Through Hole & SMT Removal     Low Melting Alloy

LOWMELT® DE-SOLDER WIRE
Low Temp SMD & Thru-Hole Removal and BGA Pad Re-Dressing Solder
You Choose! Now Also Available in a Lead-Free and RoHS Compliant Formulation!    In Stock!

LowMelt, Desolder, Removes, Chip Quick, SMD Removal, PCB Rework, Desoldering, Bismuth, Solder, Low Melting, DeSolder Wire

SMD & ThruHole Removal Below 150°C (302°F)

 

Remove SMD's At Temps Under 150°C:  Our world-famous LowMelt® removes SMD's and Thru-Hole chips at temperatures hundreds of degrees below other de-soldering methods. Below 150°C! And LowMelt® is available in both RoHS compliant (lead-free) and in classic leaded alloys.

No Nozzles!  And LowMelt® DeSolder Wire removes most chips without scorching, clumsy and pricey nozzles for every SMD chip! That's right...absolutely no nozzles! LowMelt® de-solders through the decades-proven process of Co-Metalization with either only a pre-heater placed below the PCB! If you don't have a preheater, you can still desoldering tool, use a simple soldering iron, a and rework bench should have LowMelt® at the technician's fingertips when needed. It is an essential for any electronic assembly or rework bench.

 
 

Simpler? Safer? You bet! So many benefits with LowMelt®

1. Prevents burning, warping of PCBs during rework.
2. Prevents lifting pads during rework.
3. No need for nozzles to remove SMD's.
4. No need for de-soldering tool for thru-hole removal again.
5. Prevents high temp damage to semi-conductors and caps.
6. No need for sticky de-solder wick with BGA's.
7. De-clogs your de-soldering tools quickly.
8. Re-dress delicate BGA pads without wick or braid.

LowMelt® & AirBath Synergy!  Zephyrtronics invented the synergistic combination of LowMelt® DeSolder along with our AirBath Preheat creating a truly comprehensive, easy-to-perform benchtop answer to SMD and thru-hole chip removal. It's easy. LowMelt® Co-Metalization Process.

Lead-Free & Classic Lead Formulations: LowMelt® is available in either our classic, leaded LMS Series or in our lead-free, ZLM Series packed in convenient storage tubes. (Ships with certs and  MSDS)

RoHS
 

LOWMELT® DESOLDER WIRE

Description

Price

SMD Removal
Classic Tin/Lead
 LowMelt
®
De-Solder Wire

LMS-0030
LowMelt® De-Solder
30cm / 1 ft
$10.00
LMS-0061
LowMelt® De-Solder
61cm / 2 ft
$17.00
LMS-0137
LowMelt® De-Solder
137cm / 4.5 ft
$29.95
LMS-0243
LowMelt® De-Solder

243cm / 8 ft
$39.95
LMS-0487
LowMelt® De-Solder

487cm / 16 ft
$74.45
LMS-0975
LowMelt® De-Solder

975cm / 32 ft
$147.95

ZEROLEAD® LOWMELT® DESOLDER

Description

Price

Lead-Free Rework
RoHS Compliant
Lead-Free, ZeroLead
® LowMelt®
De-Solder Wire

ZLM-0030
LowMelt® De-Solder
30cm / 1 ft
$12.00
ZLM-0061
 
LowMelt® De-Solder
61cm / 2 ft
$19.00
ZLM-0137
LowMelt® De-Solder
137cm / 4.5 ft
$32.95
ZLM-0243
LowMelt® De-Solder

243cm / 8 ft
$49.95
ZLM-0487
LowMelt® De-Solder

487cm / 16 ft
$84.95
ZLM-0975
LowMelt® De-Solder

975cm / 32 ft
$166.95
 
Still More Applications!

De-Clogging DeSoldering Tools: Anyone who has ever struggled cleaning desoldering tools and orifices knows how difficult that can  be. Not any more! Just a little LowMelt® quickly unclogs the old hardened solder inside.

Re-Dressing BGA Pads: LowMelt
® is ideal for re-dressing BGA pads after chip removal eliminating the problematic braided wick and hot contact soldering irons that scratch and hurt a BGA. Remember, the delicate pads on a BGA chip are far weaker than even the pads on a PCB which is what makes LowMelt® such a valuable tool to have on hand at any bench. Note, LowMelt® not for making new solder joints, only for desoldering old joints.

De-Soldering Thru-Hole Connectors & Chips? Absolutely!

LowMelt® & AirBaths™ Tested & Certified!  After extensive testing and evaluation of the Zephyrtronics AirBath with LowMelt® DeSolder most U.S. aerospace and defense contractors have approved and recommended their use.Indeed, one aerospace company concluded its 108-page report:

"Finally, given the advantages of lower temperatures for rework, and the results of this evaluation, the use of this method and material for reworking SMT and difficult through-hole boards is recommended...And this "new process significantly reduces the necessary...actual rework hot gas and/or solder iron temperatures, and rework time. Additionally, the chances of board damage, pad and land damage, and component lead damage are significantly reduced...results essentially indicated that there were no negative impacts on solder joints or long-term reliability given the use of this new material and methodology."

 

See the LowMelt® Video Demo Below

 

 

Brief Historical Perspective of LowMelt® DeSolder: You may be surprised to learn that a more primitive use of low temperature solder alloys for component removal had actually been around a very long time. This brilliant concept was originally pioneered by the late Joseph Funari in the 1960's.

A decade later in the 1970's, William C. Ward of IBM, explained and published Funari's concepts in IBM's Technical Disclosure Bulletins. Moreover, a Russian patent was issued many decades ago combining both a low melting point solder with a soldering iron to remove electronic chips. How about that?

 

LowMelt® DeSolder Comes of Age: At the 1996 Surface Mount International Exposition in Silicon Valley, Zephyrtronics first introduced to the world a superior and synergistic combination of convective bottom pre-heating AirBath™ coupled with a targeted application of low temperature melting solder alloy. And the rest is history.

During that same week, Zephyrtronics was awarded "The Best New Product" of the year winning the prestigious Vision Award, as the company's then jaw-dropping and innovative process of co-metalization and non-contact, "touch-free" rework dazzled engineers and technicians around the world. And how quickly the word spread.

 

William C. Ward Article in IBM's Technical Disclosure Bulletin: Low Temp Alloys for Chip Removal

Yes, LowMelt® Works With Soldering Irons, But Better With Non-Contact Preheat

Many customers ask us: why don't we recommend using an ordinary soldering iron to mix the LowMelt
® directly into the chip's existing solder joints to remove chips? Of course, this technique -- as mentioned above -- has been around since the 1960's, and yes, LowMelt® works well this way. It's just not the best way.

Dr. Charles Hutchins, a founder of Surface Mount Technology Association, wrote most damage done to PCB's during rework and repair resulted from either high temperatures, excessive hand pressure or a combination of both. Using a soldering iron to rub the LowMelt® into the chip's leads brings both high temps and hand pressure into the equation. Yes, it "works", but we say there's just a far better, non-touch way.

Since the 1990's, we've recommended using a non-contact AirBath Pre-heater below the PCB with LowMelt® DeSolder Wire as shown the video above. This superior method is what NASA called "touch-free," and maximizes the benefit of low temperature rework.

Certainly, the proven synergy of LowMelt® De-Soldering Wire and the AirBath™ preheating systems make it a natural for any electronic benchtop where prototyping and/or rework of PCB's is performed.

 

LOWMELT® DESOLDER WIRE

Description

Price

SMD Removal
Classic Tin/Lead
 LowMelt
®
De-Solder Wire

LMS-0031 LOWMELT®
31cm /1 ft
$10.00
LMS-0061 LOWMELT®
61cm / 2 ft
$17.00
LMS-0137 LOWMELT®
137cm / 4.5 ft
$29.95
LMS-0243 LOWMELT®
243cm / 8 ft
$39.95
LMS-0487 LOWMELT®
487cm / 16 ft
$74.45
LMS-0975 LOWMELT®
975cm / 32 ft
$147.95

ZEROLEAD® LOWMELT® DESOLDER

Description

Price

Lead-Free Rework
RoHS Compliant
Lead-Free, ZeroLead
® LowMelt®
De-Solder Wire

ZLM-0031 LOWMELT®
31cm / 1 ft
$12.00
ZLM-0061 LOWMELT®
61cm / 2 ft
$19.00
ZLM-0137 LOWMELT®
137cm / 4.5 ft
$32.95
ZLM-0243 LOWMELT®
243cm / 8 ft
$49.95
ZLM-0487 LOWMELT®
487cm / 16 ft
$96.95
ZLM-0975 LOWMELT®
975cm / 32 ft
$169.95
   

   
 

©1996 - 2011, 2012, 2013 by Zephyrtronics®. All rights reserved. The information, text, images, photographs, charts, graphs you receive online from Zephyrtronics® are protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "Post Cooler" and "AirBath" and "SolderGlide" and "SolderMill" and "Just So Superior" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners.

 

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LOWMELT® DE-SOLDER WIRE

 

SMD Rework, SMT Rework
AirBath Air Bath, SMD Rework Stations, Hot Air Pencil Soldering, BGA Rework Stations, CSP Rework Stations, Preheating Systems, PCB Preheaters, Pre-Heat SMT/ SMD, Low Temp Rework, SMT DeSoldering Tools, Vacuum Pickup Tools, Circuit Board Holders, PCB Fixture & PCB Holders &, Board Cradles, Rework Solder Paste, No-Clean Solder Paste, Low Melt
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How To - SMT, CSP, BGA Rework
How To - BGA Alignment; How To - SMT Rework; How To - PCB Preheating, How To - BGA & CSP Rework; How To - Quickly Solder SMD Packages Effectively; How To - CSP Alignment; How To - Lead-Free Rework; How To - SMD Removal Economical; How To - SMD Removal Professional; How To - Hot Air Pencil / AirPencil Soldering; How To - SMD Quick Chip Removal; How To - BGA Re-Balling; How To - Rework PLCC, QFP, QFN, LCC, SOIC, SOL, Shielded SMD, TSOP; How To - Solder & Rework Ceramic Capacitors; How To - Solder & Rework Glass Diodes

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Updated May 21, 2013