Low Melt DeSolder Wire, Low-Temp SMD De-Soldering Removes Chip Quick & Easy




SMD Removal - Low Melt® DeSolder - Removes Chip Quick - Through Hole & SMT Removal - Low Melting Allow
		LOWMELT® DE-SOLDER WIRE
		LOWMELT® DE-SOLDER WIRE

	Low Temp SMD & Thru-Hole Removal and BGA Pad Re-Dressing Solder

		Now Available Also in a Lead-Free and RoHS Compliant Formulation!


			New! Order Securely On-Line.

	Rapid SMD & Thru-Hole Removal Below 150° C (302° F)

Remove Your SMD's At Temps Under 150°C: Our world-famous LowMelt® removes SMD's and Thru-Hole components at temperatures 300 to 400 degrees lower than other de-soldering methods. All below 150°C! And LowMelt® is available in both RoHS compliant (lead-free) and in classic leaded alloys.

No Nozzles! And LowMelt® will remove SMD's and Thru-Hole components without using a scorching, clumsy and expensive custom nozzle for every single SMD! That's right...absolutely No Nozzles!

The Science of LowMelt® Makes It Easy! LowMelt® allows rapid SMD and Thru-Hole removal through the decades-old process of solder Co-Metalization with either a just pre-heater placed below the PCB, or with a simple soldering iron, or with any heated desoldering tool or, yes, even under a hot air nozzle.

BGA Pad Re-Dressing! And LowMelt® DeSolder is ideal for re-dressing BGA pads after component removal that does not require the use of problematic wick and hot contact soldering irons that degrade and lift pads

Simpler? Safer? You bet! The LowMelt® process virtually guarantees:

1. You will never burn a PCB during rework again.
2. You will never lift a pad during rework again.
3. You will never need to use nozzles for SMD removal again.
4. You will never need a desoldering tool for thru-hole removal again.
5. You will never degrade your semi-conductors with high temps again.
6. You will never need to use contact soldering irons and wick with BGA's.

LowMelt® & AirBath™ Synergy! Zephyrtronics pulls it all together with its harmonic combination of both LowMelt® DeSolder and our ZT-1000 AirBath Preheaters creating a truly easy-to-perform, comprehensive benchtop answer to SMD and Thru-Hole chip removal.

How Does It Work? Click here to see the LowMelt® Process of Co-Metalization and Rapid SMD Removal in Less Than 180 Seconds.

Lead-Free & Classic Lead Formulations: LowMelt® DeSolder is available in either our classic, leaded LMS Series or in our lead-free, ZLM Series packed in our convenient storage tubes. (Each shipment includes a Cert of Compliance from our Quality Group and MSDS)

LOWMELT® DE-SOLDER WIRE
DESCRIPTION	ITEM	PRICE	BUY NOW
Classic, Traditional LowMelt® De-Solder Wire With Lead	LMS-0137 LOWMELT® DE-SOLDER WIRE ( 137cm / 4.5 ft )	$29.95
	LMS-0243 LOWMELT® DE-SOLDER WIRE ( 243cm / 8 ft )	$39.95
	LMS-0487 LOWMELT® DE-SOLDER WIRE ( 487cm / 16 ft )	$74.45
	LMS-0975 LOWMELT® DE-SOLDER WIRE ( 975cm / 32 ft )	$147.95
DESCRIPTION	ITEM	PRICE	BUY NOW
RoHS Compliant Lead-Free, ZeroLead® LowMelt® De-Solder Wire	ZLM-0137 LOWMELT® DE-SOLDER WIRE ( 137cm / 4.5 ft )	$32.95
	ZLM-0243 LOWMELT® DE-SOLDER WIRE ( 243cm / 8 ft )	$49.95
	ZLM-0487 LOWMELT® DE-SOLDER WIRE ( 487cm / 16 ft )	$96.95
	ZLM-0975 LOWMELT® DE-SOLDER WIRE ( 975cm / 32 ft )	$169.95

Video Demonstration: SMD Removal & LowMelt®

LowMelt® & Zephyrtronics AirBath™ Tested, Approved & Certified! Raytheon --- after extensive testing and evaluation of the Zephyrtronics AirBath combined with the LowMelt® DeSolder --- issued a comprehensive, 108-page report in 1999 entitled "New Rework Method".

The Raytheon Test Report of our submitted Zephyrtronics AirBath and LowMelt® DeSolder for SMD removal concluded, "Finally, given the advantages of lower temperatures for rework, and the results of this evaluation, the use of this method and material for reworking SMT and difficult through-hole boards is recommended."

This "new process significantly reduces the necessary...actual rework hot gas and/or solder iron temperatures, and rework time. Additionally, the chances of board damage, pad and land damage, and component lead damage are significantly reduced...results essentially indicated that there were no negative impacts on solder joints or long-term reliability given the use of this new material and methodology."

Moreover, The Boeing® Corporation in 1998 also subjected both the Zephyrtronics AirBath and DeSolder Wire to extensive testing concluding "the Zephyrtronics AirBath System is certified."

A Brief Historical Perspective: While a more primitive usage of low temperature solder alloys for component removal has been around since the 1960's within the electronic industry, only recently has the process that was originally pioneered and described by the late Joseph Funari and subsequently, by William C. Ward of IBM truly come of age. Indeed, even a Russian patent was issued many decades ago combining both a low melting point solder with a soldering iron to remove electronic components.

Still, while using a hot soldering iron (with typical temperatures of 700° F or higher) to "mix" low temperature alloys into existing solder joints usually will work in removing most surface mount devices, caution dictates that any extended time of application of the hot soldering iron directly to the delicate pads and leads of an SMD can be damaging to the chip's leads and hurt the pads, thereby diminishing the benefits of using a low temp alloy for de-soldering in the first place.

Indeed, Dr. Charles Hutchins, a founder of Surface Mount Technology Association wrote that most all damage done to PCB's during rework and repair was the direct result of either high temperatures, excessive hand pressure or the combination of both.

IBMtech

"Given the advantages of lower temperatures for rework, and the results of this evaluation, the use of this method and material for reworking SMT and difficult through-hole boards is recommended." --Raytheon® Report

William C. Ward Article in IBM's Technical Disclosure Bulletin Teaches Low Temp Allows for Chip Removal

At the 1996 Surface Mount International Exposition in Silicon Valley, the superior and synergistic combination of convective bottom pre-heating AirBath™ coupled with a targeted application of low temperature melting solder alloy was first demonstrated to the world resulting in an instant recognition by industry leaders, and the patented AirBath concept from Zephyrtronics was chosen as "The Best New Product" of the year winning the prestigious Vision Award for its contribution to Surface Mount Technology.

Certainly, the proven synergy of LowMelt® De-Soldering Wire and the AirBath™ preheating systems make it a natural for any electronic benchtop where prototyping and/or rework of PCB's is performed.

The Zephyrtronics AirBath & LowMelt® DeSolder Test Results:
"No damage is incurred at the substrate, solder pads, component leads during the process...The Zephyrtronics AirBath System is certified." --- Boeing®, 1998

LOWMELT® DE-SOLDER WIRE
DESCRIPTION	ITEM	PRICE	BUY NOW
Classic, Traditional LowMelt® De-Solder Wire With Lead	LMS-0137 LOWMELT® DE-SOLDER WIRE ( 137cm / 4.5 ft )	$29.95
	LMS-0243 LOWMELT® DE-SOLDER WIRE ( 243cm / 8 ft )	$39.95
	LMS-0487 LOWMELT® DE-SOLDER WIRE ( 487cm / 16 ft )	$74.45
	LMS-0975 LOWMELT® DE-SOLDER WIRE ( 975cm / 32 ft )	$147.95
DESCRIPTION	ITEM	PRICE	BUY NOW
RoHS Compliant Lead-Free ZeroLead® LowMelt® De-Solder Wire	ZLM-0137 LOWMELT® DE-SOLDER WIRE ( 137cm / 4.5 ft )	$32.95
	ZLM-0243 LOWMELT® DE-SOLDER WIRE ( 243cm / 8 ft )	$49.95
	ZLM-0487 LOWMELT® DE-SOLDER WIRE ( 487cm / 16 ft )	$96.95
	ZLM-0975 LOWMELT® DE-SOLDER WIRE ( 975cm / 32 ft )	$169.95

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©1996 - 2008 Zephyrtronics®. All rights reserved. The information you receive online from Zephyrtronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners.

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