SMD Removal Rework, LowMelt Desolder Wire, The Original LowMelt, Low Melt Removes Chip Quick, SMD Rework, SMT Rework, Low Temperature Rework, Low Melting Alloy, DSolder, D-Solder, Bismuth Solder, LowMelt DeSoldering
LowMelt® DeSolder Wire
Removes Chips Quick

 



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MADE IN THE U.S.A.

PCB Rework Kits, PCB Assembly Kits

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Solder Paste, No Clean, Tin, Lead, Lead-Free

 
SMD Removal      LowMelt® DeSolder   Removes Chip Quickly     Through Hole & SMT Removal    The Original! 
LOWMELT® DESOLDER WIRE
Extra Low Temp SMD & Thru-Hole Removal & BGA Pad Re-Dressing Solder for Your PCB's!
World Famous Brand!  Also Available in a Lead-Free, RoHS Compliant Formulation!  In-Stock!

SMD & ThruHole Removal Below 150°C (302°F)

Remove SMD's At Temps Below 150°C:  Yes, our world-famous LowMelt® removes SMD's and Thru-Hole chips at temperatures hundreds of degrees below other de-soldering methods. Below 150°C! And LowMelt® is available in both RoHS compliant (lead-free) and in classic leaded alloys.

No Nozzles!  And LowMelt® DeSolder Wire removes most chips without scorching, clumsy and pricey nozzles for every SMD chip! That's right...absolutely no nozzles! LowMelt® de-solders through Co-Metalization process with  only a pre-heater below the PCB! If you don't have a preheater, use your desoldering tool or a simple soldering iron. Rework benches should have LowMelt® at the technician's fingertips when needed. It is an essential for any electronic assembly or rework bench. And a little goes a really long way! Just a dab at the pin/lead interface removes large SMD's.

 
LowMelt, Desolder, Removes, Chip Quick, SMD Removal, PCB Rework, Desoldering, Bismuth, Solder, Low Melting, DeSolder Wire

The Original & World-Famous LowMelt® DeSolder Wire
for Easy Removal of SMD Chips! Zephyrtronics Original!

   
 

Simpler? Safer? You bet! So many benefits with LowMelt®  Lower heat.  Lessens PCB damage.

1. Prevents burning, warping PCB's in rework.
2. Prevents lifting pads during rework.
3. No need for nozzles to remove SMD's.
4. Remove thru-hole chips & connectors easier
5. Prevents high temp damage to I.C's & caps
6. Eliminates sticky de-solder wick with BGA's.
7. De-clogs your de-soldering tools quickly.
8. ReDress weak BGA pads without wick/braid.

LowMelt® & AirBath Synergy!  Zephyrtronics invented the synergistic combination of LowMelt® DeSolder together with our famous, trademark  AirBath Preheat: a truly comprehensive, easy-to-perform benchtop answer to SMD and thru-hole chip removal: LowMelt® Co-Metalization Process.

Lead-Free & Classic Lead Formulations: LowMelt® is available in either our classic, leaded LMS Series or in our lead-free, ZLM Series packed in convenient storage tubes. (Ships with certs and  MSDS)

RoHS, Lead-Free, Chip Quick, DeSolder
LowMelt®  Is RoHS Compliant

 

LOWMELT® DESOLDER WIRE

Description

Price

SMD Removal, Low Temp, Desoldering
Classic Tin/Lead
 LowMelt
®
De-Solder Wire

LMS-0030
LowMelt® De-Solder
30cm / 1 ft
$10.00

LMS-0061
LowMelt® De-Solder
61cm / 2 ft
$17.00

LMS-0137
LowMelt® De-Solder
137cm / 4.5 ft
$31.00

LMS-0243
LowMelt® De-Solder

243cm / 8 ft
$51.00

LMS-0487
LowMelt® De-Solder

487cm / 16 ft
$92.00

LMS-0975
LowMelt® De-Solder

975cm / 32 ft
$169.00

ZEROLEAD® LOWMELT® DESOLDER

Description

Price

Lead-Free Rework, Chip Quick, DeSolder
RoHS Compliant
Lead-Free, ZeroLead
® LowMelt®
De-Solder Wire

ZLM-0030
LowMelt® De-Solder
30cm / 1 ft
$13.00

ZLM-0061
 
LowMelt® De-Solder
61cm / 2 ft
$20.00

ZLM-0137
LowMelt® De-Solder
137cm / 4.5 ft
$31.50

ZLM-0243
LowMelt® De-Solder

243cm / 8 ft
$53.00

ZLM-0487
LowMelt® De-Solder

487cm / 16 ft
$97.95

ZLM-0975
LowMelt® De-Solder

975cm / 32 ft
$189.00

 
Still More Applications!

De-Clogging DeSoldering Tools: Ever struggled cleaning clogged desoldering tools? Problem solved. A little LowMelt® quickly unclogs away old hardened solder inside! Another Zephyrtronics first!

Re-Dressing BGA Pads Before Re-Balling: LowMelt
® is ideal for re-dressing BGA pads after chip removal! Better than using problematic braided wick and soldering irons that damage BGA's. Delicate BGA pads are weaker than pads on a PCB. Using LowMelt® with a preheated BGA is superior for removing old solder from BGA's before reballing BGA's. Note, LowMelt® is not for making new solder joints, only for desoldering.

Will LowMelt® De-Solder Thru-Hole Connectors & Chips? Absolutely!

 
     

LowMelt® & AirBaths™ Tested & Certified!  After extensive testing and evaluating Zephyrtronics' AirBath and LowMelt® DeSolder aerospace and defense contractors approved and recommended them. One concluded in a 108-page report:

"Finally, given the advantages of lower rework temperatures, and the results of this evaluation, the use of this method and material for reworking SMT and difficult through-hole boards is recommended...this "new process significantly reduces the necessary...actual rework hot gas and/or solder iron temperatures and rework time. Additionally, the chances of board damage, pad and land damage, and component lead damage are significantly reduced...results essentially indicated there were no negative impacts on solder joints or long-term reliability given the use of this new material and methodology."

See the LowMelt® Video Demo Below

 
 
 

History of the LowMelt® DeSolder Wire: The Real Story

 

Brief Historical Perspective of LowMelt® DeSolder: You may be surprised to learn that a more primitive use of low temperature solder alloys for component removal had actually been around a very long time. This brilliant concept was originally pioneered by the late Joseph Funari in the 1960's.

A decade later in the 1970's, William C. Ward of IBM, explained and published Funari's concepts in IBM's Technical Disclosure Bulletins. Moreover, there was a very clever Russian patent also issued many decades ago combining both a low melting point solder with a soldering iron to remove electronic chips. How about that?

LowMelt® DeSolder Comes of Age: At the 1996 Surface Mount International Expo at the San Jose Convention Center in Silicon Valley, Zephyrtronics first introduced to the world its superior, synergistic combination of non-contact, convective bottom-side  AirBath™ preheat  with a targeted application of low temperature melting solder alloy. The rest is history!

And at that same Expo, Zephyrtronics was awarded "Best New Product" of the year winning the prestigious Vision Award there, as the company demonstrated its new jaw-dropping, innovative co-metalization "touch-free" process dazzling the crowds. How quickly the word spread.

 

How to Use LowMelt® DeSolder Wire

 

William C. Ward Article in IBM's Technical Disclosure Bulletin: Low Temp Alloys for Chip Removal

Yes, LowMelt® Works With Soldering Irons, But Better With Non-Contact Preheat: Customers ask us: why not recommend using ordinary soldering irons to mix the LowMelt® directly into the chip's existing solder joints to remove chips? Of course, this technique -- as mentioned above -- has been around since the 1960's, so LowMelt® works this way. But...

Dr. Charles Hutchins, a founder of Surface Mount Technology Association (SMTA), wrote most PCB damage during rework and repair results from either high temperatures, excessive hand pressure or a combination of both. Of course, a soldering iron introduces high temps, hand pressure and contact into the equation.

 

So, Yes, It "Works", but we say there's just a far better, lower temperature and 100%  non-contact method.  Since the 1990's, Zephyrtronics, pioneer in this technology synergy, has recommended using a non-contact AirBath Pre-heater beneath the PCB in conjunction with LowMelt® DeSolder Wire as shown the video above. This superior method is what NASA called "touch-free," and maximizes the benefit of low temperature rework.

Certainly, the proven synergy of LowMelt® De-Soldering Wire and the AirBath™ preheating systems make it a natural for any electronic benchtop where prototyping and/or rework of PCB's is performed.

LOWMELT® DESOLDER WIRE

Description

Price

SMD Removal
Classic Tin/Lead
 LowMelt
®
De-Solder Wire

LMS-0030 LOWMELT®
31cm /1 ft
$10.00

LMS-0061 LOWMELT®
61cm / 2 ft
$17.00

LMS-0137 LOWMELT®
137cm / 4.5 ft
$31.00

LMS-0243 LOWMELT®
243cm / 8 ft
$51.00

LMS-0487 LOWMELT®
487cm / 16 ft
$92.00

LMS-0975 LOWMELT®
975cm / 32 ft
$169.00

ZEROLEAD® LOWMELT® DESOLDER

Description

Price

Lead-Free Rework
RoHS Compliant
Lead-Free, ZeroLead
® LowMelt®
De-Solder Wire

ZLM-0030 LOWMELT®
31cm / 1 ft
$13.00

ZLM-0061 LOWMELT®
61cm / 2 ft
$20.00

ZLM-0137 LOWMELT®
137cm / 4.5 ft
$31.50

ZLM-0243 LOWMELT®
243cm / 8 ft
$53.00

ZLM-0487 LOWMELT®
487cm / 16 ft
$97.95

ZLM-0975 LOWMELT®
975cm / 32 ft
$189.00

   
   
 

©1996 - 2011, 2012, 2013, 2014, 2015, 2016, 2017, 2018, 2019, 2020 - 2023 by Zephyrtronics®. All rights reserved. The information, text, images, photographs, charts, graphs you receive online from Zephyrtronics® are protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "Post Cooler" and "AirBath" and "SolderGlide" and "SolderMill" and "ZeroTouch" and "Just So Superior" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *Above names are the registered property of their respective owners.

 
   

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LOWMELT® DE-SOLDER WIRE

 
 

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Updated for September 26, 2023