Low
Temp SMD & Thru-Hole Removal and BGA Pad Re-Dressing Solder
You Choose! Now Also
Available
in a Lead-Free and RoHS Compliant Formulation!
In Stock!
SMD
&
ThruHole Removal Below 150°C (302°F)
Remove
Your SMD's At Temps Under 150°C: Our
world-famous
LowMelt®removes SMD's
and Thru-Hole components at temperatures
hundreds of degrees lower than other de-soldering
methods. All below 150°C! And
LowMelt®
is available
in both RoHS compliant (lead-free)
and in classic leaded alloys.
No
Nozzles! And LowMelt®DeSolder Wire removes SMD's and Thru-Hole components without any
need for scorching, clumsy and expensive custom nozzles
for every SMD chip! That's right...absolutely
no nozzles! LowMelt®
allows rapid SMD and Thru-Hole removal
through the decades-proven process of solder Co-Metalization
with either a just pre-heater placed below the PCB, or
with a simple soldering iron, or with any heated
desoldering tool or, yes, even under a hot air nozzle.
Every lab and rework bench should have LowMelt®
at the technician's fingertips when needed as it is an
essential part of any electronic assembly or rework
bench.
Simpler?
Safer? You bet!
So many benefits
with LowMelt®
1. You'll never burn a PCB
during rework again. 2. You'll never lift a pad during rework again.
3. You'll never need to use nozzles for SMD removal again. 4. You'll
never need a de-soldering tool for thru-hole removal again. 5. You'll
never degrade your semi-conductors with high temps again. 6. You'll
never need to use sticky de-solder wick with BGA's.
7. You'll be able to de-clog
your de-soldering tool quickly now.
8. You'll be able to re-dress
delicate BGA pads without wick or braid.
LowMelt®
& AirBath™
Synergy!
Zephyrtronics pulls it all together in
the synergistic combination of
LowMelt®
DeSolderalong with our
AirBath
Preheaters creating a truly
easy-to-perform, comprehensive benchtop
answer to SMD and Thru-Hole chip
removal.
Lead-Free & Classic Lead Formulations:
LowMelt®
is available in
either our classic, leaded
LMSSeries
or in our lead-free,
ZLM
Series packed in our convenient
storage tubes. (Each shipment includes a
Certificate of Compliance and MSDS)
Other
Applications!LowMelt®is also ideal for re-dressing BGA pads after
chip removal eliminating use of
problematic braided wick and hot contact
soldering irons that can hurt the BGA.
And
LowMelt®
is extremely helpful at de-clogging desoldering tools. Note,
LowMelt®
is not for making new solder joints,
only for desoldering old joints.
See the
LowMelt®
Video Demonstration Below:
LowMelt®
& Zephyrtronics AirBath™ Tested,
Approved & Certified!
After
extensive testing and evaluation
of the Zephyrtronics
AirBath
combined with the
LowMelt®
DeSolder numerous U.S.
aerospace and defense
contractors approved and
recommended their use.
Indeed, one aerospace company
concluded its 108-page report
this way:
"Finally, given the advantages
of lower temperatures for
rework, and the results of this
evaluation, the use of this
method and material for
reworking SMT and difficult
through-hole boards is
recommended."
This
"new process significantly
reduces the necessary...actual
rework hot gas and/or solder
iron temperatures, and rework
time. Additionally, the chances
of board damage, pad and land
damage, and component lead
damage are significantly
reduced...results essentially
indicated that there were no
negative impacts on solder
joints or long-term reliability
given the use of this new
material and methodology."
A Brief Historical Perspective of
LowMelt®
DeSolder:
While a more primitive usage of low
temperature solder alloys for component removal has
been around since the 1960's within the electronic
industry, only recently has the process that was
originally pioneered and described by the late
Joseph Funari, and subsequently explained in the
1970's by William C. Ward
of IBM truly come of age. Indeed, even a Russian
patent was issued many decades ago combining both a
low melting point solder with a soldering iron to
remove electronic chips.
William C. Ward Article in IBM's
Technical Disclosure Bulletin On Low
Temp Alloys for Chip Removal
LowMelt®
Also
Works With Soldering Irons, But Much
Better With Non-Contact AirBath Preheat
Below PCB.
Many of our customers often ask us: why
don't we recommend using an ordinary
soldering iron to mix the LowMelt®
directly into the chip's existing solder
joints to remove chips? This technique --
as mentioned above -- has been around
since the 1960's, and yes, LowMelt®
works well this way. But, we just
don't believe it is the best way.
Dr. Charles Hutchins, a founder of
Surface Mount Technology Association,
wrote that most damage done to PCB's
during rework and repair was a result of
either high temperatures, excessive hand
pressure or the combination of both.
Using a soldering iron to rub the
LowMelt®
into the chip's leads brings both high
temps and hand pressure into the
equation. Yes, it "works", but we say
there's just a far better, non-touch way.
Since the 1990's, we've recommended
using a
non-contact
AirBath
Pre-heater just below the
PCB when using LowMelt®
DeSolder Wire as shown the video
above. This superior method is what
NASA called "touch-free," and
maximizes the benefit of low
temperature rework.
Also noteworthy, Boeing early on tested and approved the
synergistic Zephyrtronics AirBath and LowMelt®
in their rework applications.
At
the 1996 Surface Mount International Exposition in Silicon
Valley, the superior and synergistic combination of convective
bottom pre-heating AirBath™ coupled with a targeted application
of
low temperature
melting solder alloy was first demonstrated to the
world resulting in an instant recognition by industry leaders,
and the patented AirBath concept from
Zephyrtronics was chosen as "The Best
New Product" of the year winning the prestigious Vision Award
for its contribution to Surface Mount Technology.
Certainly, the proven synergy of LowMelt®
De-Soldering Wire and the AirBath™
preheating systems make it a natural for any
electronic benchtop where prototyping and/or
rework of PCB's is performed.
