LOWMELT®
DE-SOLDER
WIRE Low
Temp SMD & Thru-Hole Removal and BGA Pad Re-Dressing
Solder
Zephyrtronics Equipment is Engineered and
Manufactured in the United States of America.
Order Securely
On-Line
1996 "Vision Award"
Awarded to Zephyrtronics for
the AirBath™
"Best New Product of the Year"
Zephyrtronics is Spotlighted in Ray
Prasad'sText
"Surface Mount Technology"
"Innovative...simpler, safer way to
remove and repair sensitive devices" The Editorial
Staff, SMT MAGAZINE
Now Available
Also in a Lead-Free and RoHS Compliant Formulation!
In Stock!
SMD
&
ThruHole Removal Below 150°C (302°F)
Remove
Your SMD's At Temps Under 150°C: Our
world-famous
LowMelt®removes SMD's
and Thru-Hole components at temperatures
300 to 400 degrees lower than other de-soldering
methods. All below 150°C! And
LowMelt®
is available
in both RoHS compliant (lead-free)
and in classic leaded alloys.
No
Nozzles! And LowMelt® DeSolder Wire
will remove SMD's and Thru-Hole components without any
need for scorching, clumsy and expensive custom nozzles
for every SMD chip! That's right...absolutely
no nozzles! LowMelt®
allows rapid SMD and Thru-Hole removal
through the decades-old process of solder Co-Metalization
with either a just pre-heater placed below the PCB, or
with a simple soldering iron, or with any heated
desoldering tool or, yes, even under a hot air nozzle.
Every lab and rework bench should have a tube of
LowMelt® at the technician's fingertips when needed. Our
customers believe it's that essential.
Simpler?
Safer? You bet!
Just some of the
benefits of LowMelt®
1. You'll never burn a PCB
during rework again. 2. You'll never lift a pad during rework again.
3. You'll never need to use nozzles for SMD removal again. 4. You'll
never need a de-soldering tool for thru-hole removal again. 5. You'll
never degrade your semi-conductors with high temps again. 6. You'll
never need to use sticky de-solder wick with BGA's.
7. You'll be able to de-clog
your de-soldering tool quickly now.
8. You'll be able to re-dress
delicate BGA pads without wick or braid.
LowMelt®
& AirBath™
Synergy!
Zephyrtronics pulls it all together in
the synergistic combination of both LowMelt®
DeSolderalong with our
ZT-1000 AirBath
Preheaters creating a truly
easy-to-perform, comprehensive benchtop
answer to SMD and Thru-Hole chip
removal.
Lead-Free & Classic Lead Formulations:
LowMelt®
DeSolder is available in
either our classic, leaded
LMSSeries
or in our lead-free,
ZLM
Series packed in our convenient
storage tubes. (Each shipment includes a
Cert of Compliance from our Quality
Group and MSDS)
And BGA Pad Re-Dressing!
LowMelt®
DeSolder
is ideal during BGA rework when
re-dressing BGA pads after chip removal. Using
LowMelt®
eliminates the use of problematic wick and hot contact
soldering irons that degrade and lift pads.
See the
LowMelt®
Video
Demonstration Below:
LowMelt® & Zephyrtronics
AirBath™ Tested, Approved &
Certified!
Raytheon---after
extensive testing and evaluation
of the
Zephyrtronics AirBath
combined with the
LowMelt®
DeSolder --- issued a
comprehensive, 108-page report
in 1999 entitled "New Rework
Method".
The Raytheon Test Report of our
submitted
Zephyrtronics AirBath and
LowMelt®
DeSolder for SMD removal
concluded,
"Finally, given the advantages
of lower temperatures for
rework, and the results of this
evaluation, the use of this
method and material for
reworking SMT and difficult
through-hole boards is
recommended."
This
"new process significantly
reduces the necessary...actual
rework hot gas and/or solder
iron temperatures, and rework
time. Additionally, the chances
of board damage, pad and land
damage, and component lead
damage are significantly
reduced...results essentially
indicated that there were no
negative impacts on solder
joints or long-term reliability
given the use of this new
material and methodology."
A Brief Historical Perspective of
LowMelt® DeSolder:
While a more primitive usage of low
temperature solder alloys for component removal has
been around since the 1960's within the electronic
industry, only recently has the process that was
originally pioneered and described by the late
Joseph Funari, and subsequently explained in the
1970's by William C. Ward
of IBM truly come of age. Indeed, even a Russian
patent was issued many decades ago combining both a
low melting point solder with a soldering iron to
remove electronic chips.
William C. Ward Article in IBM's
Technical Disclosure Bulletin On Low
Temp Alloys for Chip Removal
LowMelt®
Also
Works With Soldering Irons, But Much
Better With Non-Contact AirBath Preheat
Below PCB.
Many of our customers often ask us: why
don't we recommend using an ordinary
soldering iron to mix the LowMelt®
directly into the chip's existing solder
joints to remove chips? This technique --
as mentioned above -- has been around
since the 1960's, and yes, LowMelt®
works well this way. But, we just
don't believe it is the best way.
Dr. Charles Hutchins, a founder of
Surface Mount Technology Association,
wrote that most damage done to PCB's
during rework and repair was a result of
either high temperatures, excessive hand
pressure or the combination of both.
Using a soldering iron to rub the
LowMelt®
into the chip's leads brings both high
temps and hand pressure into the
equation. Yes, it "works", but we say
there's just a far better, non-touch way.
Since the 1990's, we've recommended
using a
non-contact
AirBath
Pre-heater just below the
PCB when using LowMelt® DeSolder
Wire as shown the video above. This
superior method is what NASA called
"touch-free," and maximizes the
benefit of low temperature rework.
"Given the advantages of lower temperatures for
rework, and the results of this evaluation, the use
of this method and material for reworking SMT and
difficult through-hole boards is recommended."
--Raytheon®
Report
Also noteworthy, Boeing early on tested and
approved the synergistic Zephyrtronics AirBath and
LowMelt® in their rework applications.
At
the 1996 Surface Mount International Exposition in Silicon
Valley, the superior and synergistic combination of convective
bottom pre-heating AirBath™ coupled with a targeted application
of
low temperature
melting solder alloy was first demonstrated to the
world resulting in an instant recognition by industry leaders,
and the patented AirBath concept from
Zephyrtronics was chosen as "The Best
New Product" of the year winning the prestigious Vision Award
for its contribution to Surface Mount Technology
The Zephyrtronics AirBath &
LowMelt® DeSolder Test Results:
"No damage
is incurred at the substrate, solder pads, component
leads during the process...The Zephyrtronics AirBath
System is certified."
---
Boeing®,
1998
Certainly, the proven synergy of LowMelt® De-Soldering Wire and
the AirBath™ preheating systems make it a natural for any
electronic benchtop where prototyping and/or rework of PCB's is
performed.
