LOWMELT® DESOLDER WIRELow Temp SMD & Thru-Hole Removal and BGA Pad Re-Dressing Solder
You Choose! Now Also Available in a Lead-Free and RoHS Compliant Formulation! In-Stock!
ThruHole Removal Below 150°C (302°F)
SMD's At Temps Under 150°C: Our
and Thru-Hole chips at temperatures
hundreds of degrees below other de-soldering
methods. Below 150°C! And
in both RoHS compliant (lead-free)
and in classic leaded alloys.
Nozzles! And LowMelt®DeSolder Wire removes most chips without
scorching, clumsy and pricey nozzles
for every SMD chip! That's right...absolutely
no nozzles! LowMelt®
de-solders through the decades-proven process of Co-Metalization
with either only a pre-heater placed below the PCB!
If you don't have a preheater, you can still desoldering
tool, use a simple soldering iron, a and rework bench should have LowMelt®
at the technician's fingertips when needed. It is an
essential for any electronic assembly or rework bench.
Desoldere Wire Aids in Easy Removal
of SMD Chips!
Safer? You bet!
So many benefits
1. Prevents burning, warping PCB's
in rework. 2. Prevents lifting pads during rework.
3. No need for nozzles to remove SMD's. 4. Remove thru-hole chips &
connectors easier 5.
Prevents high temp damage to I.C's & caps 6. Eliminates sticky de-solder wick with BGA's.
your de-soldering tools quickly.
weak BGA pads without wick/braid.
Zephyrtronics invented the synergistic combination of
DeSolderalong with our
creating a truly
comprehensive, easy-to-perform benchtop
answer to SMD and thru-hole chip
removal. It's easy.
Lead-Free & Classic Lead Formulations:
is available in
either our classic, leaded
or in our lead-free,
Series packed in convenient
storage tubes. (Ships with certs and MSDS)
De-Clogging DeSoldering Tools: Anyone
who has ever struggled cleaning desoldering
tools and orifices knows how difficult that
can be. Not any more! Just a
LowMelt®quickly unclogs the old hardened solder
Re-Dressing BGA Pads:
LowMelt®is ideal for re-dressing
BGA pads after chip removal eliminating the
problematic braided wick and hot
contact soldering irons that scratch and
hurt a BGA. Remember, the delicate pads on
a BGA chip are far weaker than even the pads
on a PCB which is what makes LowMelt®
such a valuable tool to have on hand at any
not for making
new solder joints, only for desoldering old
Thru-Hole Connectors & Chips?
& AirBaths™ Tested & Certified!
extensive testing and evaluating Zephyrtronics'
DeSolder aerospace and
defense contractors approved and
recommended them. One
concluded in a 108-page report:
"Finally, given the advantages
of lower rework temperatures, and the results of this
evaluation, the use of this
method and material for
reworking SMT and difficult
through-hole boards is
"new process significantly
reduces the necessary...actual
rework hot gas and/or solder
iron temperatures and rework
time. Additionally, the chances
of board damage, pad and land
damage, and component lead
damage are significantly
indicated there were no
negative impacts on solder
joints or long-term reliability
given the use of this new
material and methodology."
Video Demo Below
Historical Perspective of LowMelt®
DeSolder: You may be surprised to
learn that a more primitive use of low
temperature solder alloys for component removal had
actually been around a very long time.
This brilliant concept was originally
pioneered by the late Joseph Funari in
A decade later in the
1970's, William C. Ward of IBM,
explained and published Funari's
concepts in IBM's Technical Disclosure
there was a very clever Russian
patent also issued many decades ago combining both a
low melting point solder with a soldering iron to
remove electronic chips. How about that?
DeSolder Comes of Age:
the 1996 Surface Mount International Exposition in Silicon
Valley, Zephyrtronics first introduced to the world a superior and synergistic combination of convective
bottom pre-heating AirBath™ coupled with a targeted application
melting solder alloy. And the
rest is history.
The same week,
Zephyrtronics was awarded
"Best New Product" of the year
winning the prestigious Vision Award,
as the company's then jaw-dropping and
innovative process of co-metalization
and non-contact, "touch-free" rework
dazzled engineers and technicians. And how quickly the word
William C. Ward Article in IBM's
Technical Disclosure Bulletin: Low
Temp Alloys for Chip Removal
Works With Soldering Irons, But Better
With Non-Contact Preheat:
Customers ask us: why not
recommend using ordinary soldering
irons to mix the LowMelt®
directly into the chip's existing solder
joints to remove chips? Of course, this
technique -- as mentioned above -- has
been around since the 1960's, so
works this way. But...
Dr. Charles Hutchins, a
founder of Surface Mount Technology
Association (SMTA), wrote most PCB damage during rework and repair
results from either high temperatures, excessive
hand pressure or a combination of both.
Of course, a soldering iron introduces
high temps, hand pressure and contact
into the equation.
So, Yes, It "Works", but we say
there's just a far better, lower
temperature and 100% non-contact
method. Since the 1990's,
Zephyrtronics, pioneer in this
technology synergy, has recommended using a
Pre-heater beneath the PCB in
LowMelt®DeSolder Wire as shown the video
above. This superior method is what NASA
called "touch-free," and maximizes the
benefit of low temperature rework.
Certainly, the proven synergy of
De-Soldering Wire and the
AirBath™ preheating systems make it
a natural for any electronic
benchtop where prototyping and/or
rework of PCB's is performed.