LOWMELT®
DE-SOLDER WIRE Low
Temp SMD & Thru-Hole Removal and BGA Pad Re-Dressing Solder You Choose! Now
Also Available in a Lead-Free and RoHS Compliant Formulation!
In Stock!
SMD
&
ThruHole Removal Below 150°C (302°F)
Remove
SMD's At Temps Under 150°C: Our
world-famous
LowMelt®removes SMD's
and Thru-Hole chips at temperatures
hundreds of degrees below other de-soldering
methods. Below 150°C! And
LowMelt®
is available
in both RoHS compliant (lead-free)
and in classic leaded alloys.
No
Nozzles! And LowMelt®DeSolder Wire removes most chips without
scorching, clumsy and pricey nozzles
for every SMD chip! That's right...absolutely
no nozzles! LowMelt®
de-solders through the decades-proven process of Co-Metalization
with either only a pre-heater placed below the PCB!
If you don't have a preheater, you can still desoldering
tool, use a simple soldering iron, a and rework bench should have LowMelt®
at the technician's fingertips when needed. It is an
essential for any electronic assembly or rework bench.
Simpler?
Safer? You bet!
So many benefits
with LowMelt®
1. Prevents burning, warping of PCBs
during rework. 2. Prevents lifting pads during rework.
3. No need for nozzles to remove SMD's. 4. No need for de-soldering tool for thru-hole removal again. 5.
Prevents high temp damage to semi-conductors and caps. 6. No need for sticky de-solder wick with BGA's.
7. De-clogs
your de-soldering tools quickly.
8. Re-dress
delicate BGA pads without wick or braid.
LowMelt®
& AirBath™
Synergy!
Zephyrtronics invented the synergistic combination of
LowMelt®
DeSolderalong with our
AirBath
Preheat
creating a truly
comprehensive, easy-to-perform benchtop
answer to SMD and thru-hole chip
removal. It's easy.
LowMelt®
Co-Metalization Process.
Lead-Free & Classic Lead Formulations:
LowMelt®
is available in
either our classic, leaded
LMSSeries
or in our lead-free,
ZLM
Series packed in convenient
storage tubes. (Ships with certs and MSDS)
De-Clogging DeSoldering Tools: Anyone
who has ever struggled cleaning desoldering
tools and orifices knows how difficult that
can be. Not any more! Just a
little
LowMelt®quickly unclogs the old hardened solder
inside.
Re-Dressing BGA Pads:
LowMelt®is ideal for re-dressing
BGA pads after chip removal eliminating the
problematic braided wick and hot
contact soldering irons that scratch and
hurt a BGA. Remember, the delicate pads on
a BGA chip are far weaker than even the pads
on a PCB which is what makes LowMelt®
such a valuable tool to have on hand at any
bench.
Note, LowMelt®
not for making
new solder joints, only for desoldering old
joints.
LowMelt®
& AirBaths™ Tested & Certified!
After
extensive testing and evaluation
of the Zephyrtronics
AirBath™
with
LowMelt®
DeSolder most U.S.
aerospace and defense
contractors have approved and
recommended their use.Indeed, one aerospace company
concluded its 108-page report:
"Finally, given the advantages
of lower temperatures for
rework, and the results of this
evaluation, the use of this
method and material for
reworking SMT and difficult
through-hole boards is
recommended...And
this
"new process significantly
reduces the necessary...actual
rework hot gas and/or solder
iron temperatures, and rework
time. Additionally, the chances
of board damage, pad and land
damage, and component lead
damage are significantly
reduced...results essentially
indicated that there were no
negative impacts on solder
joints or long-term reliability
given the use of this new
material and methodology."
See the
LowMelt®
Video Demo Below
Brief Historical Perspective of
LowMelt®
DeSolder: You may be surprised to
learn that a more primitive use of low
temperature solder alloys for component removal had
actually been around a very long time.
This brilliant concept was originally
pioneered by the late Joseph Funari in
the 1960's.
A decade later in the
1970's, William C. Ward of IBM,
explained and published Funari's
concepts in IBM's Technical Disclosure
Bulletins.
Moreover,
a Russian
patent was issued many decades ago combining both a
low melting point solder with a soldering iron to
remove electronic chips. How about that?
LowMelt®
DeSolder Comes of Age:
At
the 1996 Surface Mount International Exposition in Silicon
Valley, Zephyrtronics first introduced to the world a superior and synergistic combination of convective
bottom pre-heating AirBath™ coupled with a targeted application
of
low temperature
melting solder alloy. And the
rest is history.
During that same week,
Zephyrtronics was awarded
"The Best New Product" of the year
winning the prestigious Vision Award,
as the company's then jaw-dropping and
innovative process of co-metalization
and non-contact, "touch-free" rework
dazzled engineers and technicians around
the world. And how quickly the word
spread.
William C. Ward Article in IBM's
Technical Disclosure Bulletin: Low
Temp Alloys for Chip Removal
Yes, LowMelt®
Works With Soldering Irons, But Better
With Non-Contact Preheat
Many customers ask us: why don't we
recommend using an ordinary soldering
iron to mix the LowMelt®
directly into the chip's existing solder
joints to remove chips? Of course, this
technique -- as mentioned above -- has
been around since the 1960's, and yes,
LowMelt®
works well this way. It's just not the
best way.
Dr. Charles Hutchins, a
founder of Surface Mount Technology
Association, wrote most damage done to
PCB's during rework and repair resulted
from either high temperatures, excessive
hand pressure or a combination of both.
Using a soldering iron to rub the
LowMelt®
into the chip's leads brings both high
temps and hand pressure into the
equation. Yes, it "works", but we say
there's just a far better, non-touch
way.
Since the 1990's,
we've recommended using a
non-contact
AirBath
Pre-heater below the PCB
with LowMelt®
DeSolder Wire as shown the video
above. This superior method is what
NASA called "touch-free," and
maximizes the benefit of low
temperature rework.
Certainly, the proven synergy of LowMelt®
De-Soldering Wire and the AirBath™
preheating systems make it a natural for any
electronic benchtop where prototyping and/or
rework of PCB's is performed.
