BGA ReBalling Kit, How to ReBall, BGA, CSP, ReBall, Solder Balls, Solder Spheres

<


Solder Paste, No Clean, Tin, Lead, Lead-Free

PCB, Flux, Rework, Prototypes

Alcohol, Pump Bottle, Menda, Style

Flush Cutters, Micro Shears, Lead Cutters

Blunt Needles, Dispensing Needles, Tapered Tips

 

 Ball Grid Array Reballing  How to ReBall BGA's   ReBalling Stencils   BGA Spheres & Solder Balls. Helpful Tips.

BGA RE-BALLING QUALITY METHOD
This is the Original "Zephyrtronics Way" of Re-Balling Used Globally.

 
HOW TO:  

Reballing Ball Grid Arrays is easy, but quality is paramount. Here are ten simples steps! Note: We interchange the words "stencil" and "screen" here as they are both used in the industry.

 
     
reball 102

1.  Apply a thin film of a very tack, no clean flux (Zephlux (NCF-0014 ) over entire grid area of the BGA package using an anti-static foam swab as shown at left. Our tack flux "holds" your chip in position with the stencil (next step).

 
reball 2

2. Match the appropriate re-balling screen for your BGA pattern. Place your component (with the tack flux applied  as shown above) onto the underside of your reballing screen/stencil. Make sure your component and the stencil are squared. Do NOT use liquid (runny) fluxes or paste fluxes (stringy).

 
reball 3 copy

3. Ideally, position a "Re-Balling Pan"  under the Stencil. Place chip into Re-Balling Pan so that the handles of stencil lay directly above those of the Re-Balling Pan as shown at left. Note how well the "tack" flux holds chip and stencil together!

 
reball 4

4. Pour appropriate Solder Spheres onto Re-Balling Screen. Securing both handles of the stencil, rotate left & right dumping any excess spheres into the Tank. If your stencils don't have handles, you can secure the stencil with your Kapton® tape or other ways easily enough.

 
reball 5

5. Next up: the ZT-3 Air Pick with a Re-Balling Needle Tip (from our popular ZT-5-VPAK variety tip pack) to hold your Solder Spheres onto the end of the AirPick™. The AirPick™ features the unique "quick vacuum release" critical when trying to get the job done. 

 
reball 6

6. Now, use your ZT-3-AirPick to remove any extra, loose and "rolling around" Solder Spheres from out of the stencil. Also use your AirPick to fill in any holes on your Re-Balling Screen as shown here. The Zephyrtronics way of using a tank is helpful as it catches all the extra solder spheres.

 
REBALLER KIT

Make Your Own Kit

A Good BGA Re-Balling Set-Up or Station Should Include All of the Following:

• Solder Spheres for Re-Balling
   Vial of 10K -30 Mil Diameter
   Vial of 10K -25 Mil Diameter
   Vial of 10K -20 Mil Diameter
   Vial of 10K -12 Mil Diameter
• Re-Balling Stencil/Screen (BGA Pattern)
• Re-Balling Pan, • Re-Balling Platform
• Re-Balling Tank (If possible)
• Re-Balling Needle Tip Pack (ZT-5-VPAK)
•The ZT-1 AirBath™ Bottom-side Preheat
LowMelt® DeSolder Wire 487
AirPick
Vacuum Lifting System
• Zephlux™ Tacky Flux
• Non-Flammable Flux Remover
• Scrub Brushes
Foam Swabs
, ESD Safe & Solder Wick
• Set of Two Stainless Steel Tweezers

Be Sure You Verify if You are Working With Tin/Lead or Lead-Free Alloys.

 
reball 7  

7. Place the Re-Balling Platform (out of VO non-flammable glass fiber board) into your ABC-1 Board Cradle. Position the the Cradle in front of your ZT-7-MIL. Now, simply place the Re-Balling Pan and Re-Balling Screen on top of the ReBalling Platform.

Using a Zephyrtronics AirBath™ from below, preheat your chip (very important) at this stage. Remember, a BGA is essentially a very small and delicate PCB so preheat is really needed!

  reball 8

8. After a 1-2 minute preheat (soak) of the chip and spheres, you can next lower the Z-axis heating zone of the ZT-7-MIL down to where the hot air nozzle is approximately 1/8" or 3mm above the Re-Balling unit. Set your countdown timer to 1:20 to 1:30 for most chips. Set your top temperature to 230ºC to 250°C for most chips. Start the timer and the heating from above.

  reball 9

9. Yes! The picture at the left says it all. When the timer begins to beep, turn off top heater. As the Re-Balling unit cools, carefully separate the component out from the screen as shown in the photograph at the left. (Caution: The Re-Balling unit may still be hot.) Inspect your component and you are ready for final cleaning.

  reball 10   10.  Final Cleaning: Dip one of your Scrub Brushes into the non-flammable flux remover (NFR-0056, also included in the Kit!). Generously apply the flux-remover throughout the component until all of the old flux has been stripped away. Inspect.

Note: If you are re-using the same BGA, but need to remove the old solder, use the ZT-1 AirBath™ together with our famous LowMelt® DeSolder Wire. Oh, yeah. Ideal application.

Ten Easy to Follow Steps for High Quality Re-Balling!
We've made it easy for you! Don't be shy! Give us a call or e-mail us today at david@zeph.com with any questions. We are always happy to assist you.

 

BGA Rework

 
  ©1996 - 2011, 2012, 2013-2017, 2018, 2019, 2020 by Zephyrtronics®. All rights reserved. The information, text, images, photographs, charts, graphs you receive online from Zephyrtronics® are protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" and "Post Cooler" and "AirBath" and "SolderGlide" and "SolderMill" and "Just So Superior" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners.  
   

Click Here to Go Directly to Our Easy-to-Navigate and Illustrated Product Directory.

   
 

SMD Rework, SMT Rework
AirBath Air Bath, SMD Rework Stations, Hot Air Pencil Soldering, BGA Rework Stations, CSP Rework Stations, Preheating Systems, PCB Preheaters, Pre-Heat SMT/ SMD, Low Temp Rework, SMT DeSoldering Tools, Vacuum Pickup Tools, Circuit Board Holders, PCB Fixture & PCB Holders &, Board Cradles, Rework Solder Paste, No-Clean Solder Paste, Low Melt
® De-Solder Wire, DeSolder Wire, Hot Air Rework Stations, Fume Extractors, SMT Dental Probes, SMT, SMD Rework Kit, BGA Rework Kit, LMK Kit, BGA Re-Balling Kit, SMD Tweezers, Power Palm Plunger, QFP Lead Straightener

How To - SMT, CSP, BGA Rework
How To - BGA Alignment; How To - SMT Rework; How To - PCB Preheating, How To - BGA & CSP Rework; How To - Quickly Solder SMD Packages Effectively; How To - CSP Alignment; How To - Lead-Free Rework; How To - SMD Removal Economical; How To - SMD Removal Professional; How To - Hot Air Pencil / AirPencil Soldering; How To - SMD Quick Chip Removal; How To - BGA Re-Balling; How To - Rework PLCC, QFP, QFN, LCC, SOIC, SOL, Shielded SMD, TSOP; How To - Solder & Rework Ceramic Capacitors; How To - Solder & Rework Glass Diodes; How to Repair Smartphones, Tablets and Laptops

Soldering, De-Soldering
Soldering Accessories, Solder Wire, No-Clean Solder Wire, Eutectic Solder Wire, Solder Wire Dispenser, Solder Paste, Lead-Free Solder Paste, Flux, Solder Paste Dispensers, Low Melt
® DeSolder Wire, De-Solder Wire, Soldering Tips, Thru-Hole DeSoldering Tools, DeSoldering Tips, Tips for DeSoldering, De-Solder Wick & DeSoldering Braid, Smoke Extractors, Fume Extractor Filters, Carbon Activated Filters, SolderMill™, Solder Sucker / DeSolder Pump, Pre-heating Systems, Preheat Thru-Hole, PCB Pre-heaters, Flux Solvent, How To - Connector Rework; How To - PC/104 Soldering and Rework; How To - Thru-Hole / Through Hole Desolder / De-Solder; How To - Low Melt® Desolder Wire; How To- Stop Lifting Pads; How To- Desolder / De-Solder Heavy Ground Planes; How To - Lead-Free Soldering and De-Soldering; Pre-Heaters for Lead-Free Rework and Soldering

Dispensing Equipment, Gear, Supplies, Dispensing Bottles & Dispensing Accessories
Dispensing Systems, Dispensing Syringes, Dispensing Barrels, Tapered Dispensing Tips, Blunt Needles,
Dispensing Bottles, Stainless Steel Needles, Dispensing Needles, Industrial Needles, Dispensing Tips, Industrial Dispensing Tapered Tips and Needles, Dispensing Accessories, Flux Bottles, Solder Paste in Syringe, Paste Rack Solder Paste Holder, Dispensing Supplies, Power Palm Plunger, Manual Dispensing, Alcohol Pump Bottles, Automatic Dispensing, Squeeze Bottles, Wash Bottles, Brush Bottles, Spout Bottles, Pump Bottles

Benchtop Accessories, Bench Supplies, Benchtop Tools
SMD Solder Paste, Solder Wire, LowMelt®, No-Clean Flux, BGA Flux, Rework Tack Flux, Non-Flammable Flux Remover, Pen Vac, SMT Tweezers, Fume Extraction, SMD Tweezers, PC Board Fixtures, Hot Air Tips, AirTips, Replacement Soldering Sponges, Iron Plated Soldering Tips, Foam Swabs, Anti-Static Foam Swabs, Thru-Hole & Solvent Brushes, Helping Hands, LMK Rework Kits,
X-BOX 360 Repair, Wire Strippers & Wire Cutters, Flush Cutters, Micro Shears & Needle Nose Piers, Straightening Tool for QFP Leads, ESD Wrist Straps, ESD Wrist Strap Tester   

Updated for April 22, 2020