BGA RE-BALLING KIT

1

First apply a thin film of tacky Zephlux (NCF-0014 included in the Kit!) over the grid area of the Ball Grid Array or Chip Scale Package using an anti-static foam swab (SFS-A-0050 included in kit!) shown at left.

2

Choose the appropriate Re-Balling Screen (from the  Kit) for your BGA pattern and solder sphere count. Place your fluxed component on the underside of your Re-Balling Screen. Make sure that your component and the Screen are perfectly square.

LMK-4000 . . . . . . . . ONLY $495

3

Every LMK-4000 BGA Re-Balling Kit Includes All of the Following:

• Solder Spheres for Re-Balling
   Vial of 10K -30 Mil Diameter
   Vial of 10K -25 Mil Diameter
   Vial of 10K -20 Mil Diameter
   Vial of 10K -12 Mil Diameter
• Re-Balling Stencil
• Re-Balling Pan
• Re-Balling Platform
• Re-Balling Tank
• Re-Balling Needle Tip Pack (ZT-5-VPAK)
• LowMelt® DeSolder Wire 487
• Solder Wick
• Zephlux™ Tacky Flux
• Non-Flammable Flux Remover
• Thru-Hole Brushes
• Foam Swabs, ESD Safe
• Set of Two Stainless Steel Tweezers

Lead-Free Solder Spheres Are Available for Your RoHS Compliant Needs, Too!
 

Now, position your Re-Balling Pan (included in kit!) under the Re-Balling Screen. Place the component into the Re-Balling Pan so that the handles of the Re-Balling Screen lie directly above those of the Re-Balling Pan. As shown at left.

4

Remove lid from Re-Balling Tank (included in your Kit). Place Re-Balling Pan unit into the grooves of your Re-Balling Tank. Pour appropriate Solder Spheres (included in kit!) onto Re-Balling Screen. Holding both handles, rotate left & right dumping any excess spheres into the Tank.

5

Either turn on your ZT-3 Air Pick, place a Re-Balling Needle Tip (our popular ZT-5-VPAK variety tip pack is included in the kit!) of a smaller size then your Solder Spheres on the end of the AirPick.

6

Now, use your ZT-3-AirPick to remove any extra Solder Spheres that you have left. Also use your AirPick to fill in any holes on your Re-Balling Screen as shown here.

7

Place the Re-Balling Platform (included in Kit!) into your ABC-1 Board Cradle. Position the the Cradle in front of your ZT-7-MIL. Now, simply place the Re-Balling Pan and Re-Balling Screen on top of the ReBalling Platform using the convenient handles as shown in the photo at the left.

8

Next lower the Z-axis heating zone of the ZT-7-MIL down to where the hot air nozzle is approximately 1/8" or 3mm above the Re-Balling unit. Set the countdown timer to 1:20. Set your top temperature to t230ºC. Start the timer and the heating from above.

9

When the timer begins to beep, turn off top heater. As the Re-Balling unit cools, carefully separate the component out from the screen as shown in the photograph at the left. (Caution: The Re-Balling unit may still be hot.) Inspect your component and you are ready for final cleaning.

10

Final Cleaning: Dip one of your Thru-Hole Brushes (included in Kit!) into the non-flammable flux remover (NFR-0056, also included in the Kit!). Generously apply the flux-remover throughout the component until all of the old flux has been stripped away. Inspect.

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