BGA ReBalling Kit, How to ReBall, BGA, CSP, ReBall, Solder Balls, Solder Spheres


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Reballing Kit   How to ReBall BGA's   ReBalling Stencils   BGA Spheres and Solder Balls

The LMK-4000 Is Your Comprehensive Solution to Reballing Your BGA's


Here's just how easy it is to re-ball your BGA's yourself. Our LMK-4000 Kit is used around the globe everyday to repair BGA's. Here's Ten Simple Steps!

reball 102

1.  First, apply a thin film of a very tacky, no clean flux (Zephlux (NCF-0014 included in the Kit!) over the entire grid are a of the Ball Grid Array or Chip Scale Package using an anti-static foam swab (SFS-A-0050 included in kit!) shown at left.

reball 2

2. Choose the appropriate Re-Balling Screen (from your  Kit) for your BGA pattern. Place your fluxed component on the underside of your Re-Balling Screen. Make sure that your component and the Screen are squared. We probably have the Screen/Stencil for your particular BGA here in our factory. If not, we can in a very short time.

reball 3 copy

3. Now, position your Re-Balling Pan (included in kit!) under the Re-Balling Screen. Place the component into the Re-Balling Pan so that the handles of the Re-Balling Screen lie directly above those of the Re-Balling Pan. As shown at left.

reball 4

4. Remove lid from Re-Balling Tank (included in your Kit). Place Re-Balling Pan unit into the grooves of your Re-Balling Tank. Pour appropriate Solder Spheres (included in kit!) onto Re-Balling Screen. Holding both handles, rotate left & right dumping any excess spheres into the Tank.

reball 5

5. Either turn on your ZT-3 Air Pick, place a Re-Balling Needle Tip (our popular ZT-5-VPAK variety tip pack is included in the kit!) of a smaller size then your Solder Spheres on the end of the AirPick.

reball 6

6. Now, use your ZT-3-AirPick to remove any extra Solder Spheres that you have left. Also use your AirPick to fill in any holes on your Re-Balling Screen as shown here.


LMK-4000 . . . . . . . . ONLY $495

Every LMK-4000 BGA Re-Balling Kit Includes All of the Following:

• Solder Spheres for Re-Balling
   Vial of 10K -30 Mil Diameter
   Vial of 10K -25 Mil Diameter
   Vial of 10K -20 Mil Diameter
   Vial of 10K -12 Mil Diameter
• Re-Balling Stencil/Screen (Your BGA Pattern)
• Re-Balling Pan
• Re-Balling Platform
• Re-Balling Tank
• Re-Balling Needle Tip Pack (ZT-5-VPAK)
LowMelt® DeSolder Wire 487
• Solder Wick
• Zephlux™ Tacky Flux
• Non-Flammable Flux Remover
• Thru-Hole Brushes
Foam Swabs, ESD Safe
• Set of Two Stainless Steel Tweezers

Lead-Free Solder Spheres Are Available for Your RoHS Compliant Needs, Too!

reball 7  

7. Place the Re-Balling Platform (included in Kit!) into your ABC-1 Board Cradle. Position the the Cradle in front of your ZT-7-MIL. Now, simply place the Re-Balling Pan and Re-Balling Screen on top of the ReBalling Platform using the convenient handles as shown in the photo at the left.

  reball 8

8. Next lower the Z-axis heating zone of the ZT-7-MIL down to where the hot air nozzle is approximately 1/8" or 3mm above the Re-Balling unit. Set the countdown timer to 1:20. Set your top temperature to 230ºC. Start the timer and the heating from above.

  reball 9

9. Yes! The picture at the left says it all. When the timer begins to beep, turn off top heater. As the Re-Balling unit cools, carefully separate the component out from the screen as shown in the photograph at the left. (Caution: The Re-Balling unit may still be hot.) Inspect your component and you are ready for final cleaning.

  reball 10   10.  Final Cleaning: Dip one of your Thru-Hole Brushes (included in Kit!) into the non-flammable flux remover (NFR-0056, also included in the Kit!). Generously apply the flux-remover throughout the component until all of the old flux has been stripped away. Inspect.

We've made it easy for you! Don't be shy! Give us a call or e-mail us today at with any questions you might still have. We are always happy to assist you. We probably have the ReBalling Stencil for your chip right here in our factory.


BGA Rework

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Updated for February 7, 2017