BGA Rework      SMD, CSP, QFN Soldering & De-Soldering       Hot Air Rework      BGA Alignment      Lead-Free Reflow

#1 Hot Air Benchtop Rework System in the World!

ZT-7 HOT AIR BENCH SYSTEM

• Low Cost & Dependable (10 Years!)
• Aligns & Solders BGA's, QFN's & SMD's
• Automatic Vacuum Pick-Up Removes Chips
• Patented, Unique Retractable Heating Zone
• Powerful for Your Lead-Free Applications
• Ideal for Rework & Prototyping
• Sets Up in Minutes, No Air Hookups Needed!
• Minimal Training Needed. Easy to Use!
• Z Axis, Up & Down Heat Zone
• Space Saving, Compact & Modular Design
• Place & Remove, Solder & De-Solder Chips
• Controlled Thermal Ramping: Top & Bottom
• Post-Reflow Cooling Integrated in System
• ZT-7 System Includes:
               Top Side Hot Air Reflow Unit
                Bottom Side Powerful Preheat
                Adjustable PCB Holding Fixture
                Digital Countdown Timer
                Digital Temp Feedback Control
                Bonus: 100 Piece Supply Kit!
• Over 2,000 Watts of Power!!!
• Forced Convection Superior to Ineffective IR
• Loaded With Features & Benefits.

The ZT-7 is your economical bench-top rework and prototyping system with process controls and precision features "built-in". The system mirrors larger, high-end multi-zone reflow ovens. The system steps up the technician from labor-intensive soldering and de-soldering methods and awkward hand held tools, making processing BGA's, SMD's and QFN's a breeze. More details, specifications, chip capacities, pricing and more here.

39-Page Rework Guide
 by NASA With
 300 Photographs
 Ships With Every
 ZT-7 System