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BGA
Rework SMD, CSP, QFN
Soldering and De-Soldering
Hot Air Rework BGA
Alignment Lead-Free
Reflow |
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ZT-7 BGA, CSP & SMT HOT AIR REFLOW CENTER
Your
Comprehensive Solution for BGA, SMT,
QFN
and CSP Rework &
Repair, Reballing, BGA Alignment, Placement,
Preheat & Reflow at the Bench |
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The Zephyrtronics ZT-7
System "makes mounting and removal of through-hole
and surface mount components easier
than routine benchtop methods" and "minimizes thermal stresses due to
temperature differentials during assembly and
rework" and "enables the mounting of Ball Grid
Arrays and other hidden pin packages on site."
-- NASA Report, Jan. 9, 2004
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The sophisticated, and yet so affordable
ZT-7 System, performs like those other BGA
and SMD Rework Stations that cost as much as $20K to
$50K and, in many case, even outperforms them!
Align, place and solder your BGA's, SMD's, QFN's,
LGA's --- or de-solder and automatically lift them
from the PCB without lifting pads or ever thermally
damaging your substrate or adjacent chips!
The ZT-7
System
is the very same one used
by NASA and JPL for soldering on the two successful Mars Rovers launched in 2003,
and more recently with the Phoenix project.
NASA wrote: the Zephyrtronics system makes "mounting/removal of through-hole and surface mount components easier than routine benchtop methods" and "minimizes thermal stresses due to temperature differentials during assembly and rework" and "enables the mounting of
BGA's and other hidden pin packages on site.”
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Align,
Place and Solder All SMD's & BGA's or
DeSolder & Remove
All SMD's & BGA's in Mere Minutes |
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Zephyrtronics, winner of the coveted 1996 Vision
Award for "Best New Product of the Year" at the Surface
Mount International Expo in Silicon Valley has dominated
the BGA & SMD Bench market with the
ZT-7000 System.
With over ten years now in the field, its proven,
patented design makes both prototype work and rework a
breeze. |
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The Zephyrtronics ZT-7-000 BGA, SMT & CSP Comprehensive
Benchtop System Shown Above. |
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Video Demonstration: See the ZT-7
in Action As It DeSolders & Removes BGA's |
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More Details: |
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Uncanny Simplicity & Reliability: The amazingly easy-to-operate ZT-7-MIL
was developed for prototype work, low volume
production, secondary operations, and rework of
electronic PC board assemblies at the benchtop for BGA, CSP and/or SMT components.
With all of the critical process controls "built in," the Zephyrtronics ZT-7-MIL System was engineered to eliminate the worry over compressed air hook-ups, air pressure settings, external fanning equipment, external and awkward foot pedals. The ZT-7-MIL is a fully integrated system making the meticulous, temperature profiles of high volume production equipment now attainable right at the bench. |
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LEADLESS CHIP
CARRIERS
(LLC's)
Align, Place & Reflow
or Desolder & Remove
QUAD FLAT PACK (QFP's) and
SOL's
Align, Place & Reflow
or Desolder & Remove |
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BGA's and
GLOB TOPS
Align, Place & Reflow
or Desolder & Remove
SHIELDED
COMPONENTS
Align, Place & Reflow
or Desolder & Remove |
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Here’s Just a Few of the ZT-7’s Novel Features: This remarkable benchtop system features closed loop electronic digital temperature control; a digital countdown timer with audible beeper for process and profile uniformity;
a mobile heating zone with the unique capacity of both 1.) a "Z-Axis" which raises and lowers the heating zone to the targeted component on the substrate; and 2.) a "Y-Axis" which retracts and returns the heat zone before and after reflow allowing the technician to align, flux, prep, clean, inspect without the heat zone interfering. (Both the Z and Y axis travel are made via precision linear ball bearing slides which mean smooth, accurate and repeatable performance.
So Many Utilities: Whether the application is of
the highest reliability possible such as space and
military work or everyday rework of even commercial game
entertainment systems such as the
XBOX,
the ZT-7 is at work even as you read
this all over the world!
Unique Retractable Heat-Zone & Single-Spot Alignment:
Most noteworthy is our exclusive and patent protected
"Single Spot Alignment, Placement and Reflow Feature"
due to the fact that the ZT-7000 System NEVER requires movement of the PCB Assy. once your BGA or CSP has been aligned and placed. The ZT-7-MIL brings the heat zone to the target unlike most other BGA "machines" which have elaborate (and expensive!) vision alignment systems that constantly need calibrating and which remotely place the BGA or CSP, only to require the board and the loose components to be moved afterwards to a distant heat zone. (Who on earth thought of that??) And what's even better, the ZT-7-MIL is universal for both BGA's & CSP's (You don't need to buy two different machines!)
Quick, Easy & Accurate BGA Alignment: To
learn how to precisely align and place BGA’s & CSP’s to the substrate pads,
to see how NASA "explains" this simple
method of placing BGA's to the pads; and to learn how to redress your BGA & CSP pads
without de-soldering wick, click
on this link:
Re-Dressing Your BGA Pads.
Semi-Automatic De-Soldering: For de-soldering and
removing components, there is
a semi-automatic spring-activated vacuum probe that lifts up the BGA, CSP or SMD up off the board once
the solder reflows taking any guesswork out of the program and insuring that you will not lift a pad.
The solder reflows and the chip pops up
into the nozzle! Video Demonstration!
Witness the actual desoldering process
as the BGA reflows and lifts off of the
PCB in this short, helpful
Video: DeSoldering
& Removing a BGA.
The Demo is a "How To" that shows board
prep, aligning, flux application, chip
removal, cleaning and touches on
inspecting the PCB and familiarizes you
with the ZT-7 in action! |
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SMT SOCKETS
Align, Place & Reflow
or Desolder & Remove
CHIP SCALE PACKAGES (CSP's)
Align, Place & Reflow
or Desolder & Remove |
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PLCC'S and SOJ's
Align, Place & Reflow
or Desolder & Remove
Re-Ball
Your
BGA’S & CSP’S
(Click
Here for Details) |
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Extra Low Velocity Hot Air Flow from
ZT-7 Reflow Nozzles:
The
ZT-7 has
less than 20 CFM
of air velocity from its Nozzles.
Why is that important? Three critical
reasons: 1.) Our extra-low velocity
heated air from the Nozzle prevents
unwanted adjacent component reflow.
Because caps and resistors typically
surround a BGA or SMD, our extra-low air
velocity is a key advantage! 2.)
Extra-low velocity heated air will not
blow or scatter solder around the PCB
unlike other hot air systems; and 3.)
Our less-than-20 CFM of air velocity at
the nozzle helps prevent hydroplaning of
small chips during reflow; your chip
stays put and is not blown out of
alignment--a common problem with other "BGA
machines".
Our Secret? The low velocity air
flow at the nozzle is only possible
because Zephyrtronics has ample
preheating air flow from below the PCB
from our AirBaths. High volume, low temp
preheat air flow from below translates
into easy reflow from above with only
minimal air velocity at the nozzle. And
this is where nearly all the other SMT &
BGA machines on the market really get it
wrong because they have ineffective
preheating (weak IR or hot plates) and
therefore must compensate with high
velocity air from their nozzles to
achieve solder reflow. QFN's and
E-Pads? Of course, our AirBath
preheating advantage makes working with
those pesky QFN packages easy as can be.
Yes, those "e-pads" or "thermal pads" or
"belly slugs" on the bottom side of the
chip are no problem with your ZT-7
System! And this really becomes
especially important if you are thinking
of using lead-free solders. |
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Patented BGA Alignment
Template
Eliminates
Need for Cameras &
Expensive Split-Beam Vision
& Makes BGA Placing
So Easy to Do! |
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The ZT-7 Handles Large
PCB's
Up to 20 1/2" (52 cm) Deep |
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Extra Large PC Boards Are No Problem!
One question we hear a lot is: What is the maximum PCB
size that your system can handle? The ZT-7
System easily accommodates PCB's up to
as large as 20.5 inches (52 cm) in depth (and without limitation in length).
That means that there are no "special models"
or "wide body models" as are required with other
manufacturers of hot air reflow
equipment. And of course, smaller
PCB assemblies are no problem either.
The Modularity of Zephyrtronics:
Perhaps best of all, the
ZT-7
System
was designed to work in concert with
any of our popular
ZT-1000 Series of
AirBath Bottom-Side Preheating Systems
and
the
ABC-1 Board Cradles.
Please note that all of our ZT-1000 Series of
AirBaths will nest perfectly with the
ZT-7 bringing all of the many utilities
of our award-winning AirBaths to your
ZT-7
System.
And, of course, this also allows for technicians to
build up their system as their chip application needs
and budgets require. To see more on the modularity of
the
ZT-7
System
see our
short
Video: DeSoldering
& Removing a BGA. |
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Easy 360° Nozzle Theta Rotation
Adjustment: The ZT-7
features two
independent and 360° adjustments for
both the nozzle and for the chip vacuum
probe. Ideal when working with angled
and/or skewed chips.
A Vast and Wide Selection of
SMD & BGA Nozzles Available at Low, Low Cost:
Since we are "the
factory", we have been fabricating nozzles for the ZT-7
since 1998 and have a very large stock of
nozzles from as large as 50mm x 50mm to as tiny as 2mm x
2mm IN STOCK!! Even Custom Nozzles are no problem and
require as little as 10 days and cost no more than our
standard stock nozzle. A partial list (we have far too
many to list) of our nozzles are
provided here:
BGA/CSP Nozzles &
SMT Nozzles.
All Zephyrtronics nozzles are
permanently "stamped" with both the part
number and the size of the nozzle for
your quick reference!
Critical Post-Cooling Feature: beyond the many benefits of bottom side convective preheating, the ZT-1 AirBath provides the essential "Post Cooling" of the PCB
assembly after reflow. Post-cooling after reflow of Ball Grid Arrays & Chip Scale Packages is an absolute requirement to insure that the molten ball/pad interface cools quickly to avoid unwanted bridging and "opens". (Note: The importance of preheating and post-cooling at the benchtop and it many benefits is taught in our technical paper:
Two Critical PCB Rework Processes: Pre-Heating and Post Cooling.) |
Front-Access Nozzle Dock
Makes Changing Nozzles Quick & Easy.
Nozzles "Lock In" Securely! |
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 ...And
The ZT-7 Excels with Your RoHS Compliant, Lead-Free
Solder Alloys! Because every
ZT-7000 Benchtop Hot Air System includes
the popular
ZT-1-BGS-DPU "Big Grid" Pre-Heating AirBath,
working with lead-free alloys is a breeze.
Unlike other "systems", with the
ZT-7,
one need not
remove adjacent chips around the BGA before
attempting to solder or desolder. The powerful
capacity of the
AirBath
Bottom-Side Preheating System is the
key element here. Learn more here about the
RoHS Lead Free Mandate.
Production Quality Profiles Right at the Bench:
Because the exit air temperatures of the
ZT-7 and the
ZT-1 are both electronically maintained
by easy-to-use digital controllers on their front
panels, technicians can confidently expect the same
thermal profiles at the bench that are achieved with
high end, high volume production reflow equipment
such as conveyor ovens, IR/Vapor systems and wave
solder machines. Now, aren't you glad you didn't buy
one of those other machines that don't work?
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The ZT-7 Selected by NASA & JPL
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Don't let the simplicity and affordability of the ZT-7 lead you to underestimate its capacity, its power, its utility or its quality performance. This is the very same ZT-7 chosen by both NASA and JPL for soldering the BGA's and SMD's on the two high-reliability and highly successful Mars Rovers. Even the largest full metal-topped BGA's used on both of the Mars Rovers were soldered with the Zephyrtronics ZT-7 Hot-Air Reflow Center!
Indeed, NASA engineers prepared a 39 page document touting the ZT-7 system in a report for its employees which includes nearly 300 color photographs of how to
set up and and technical tips for using the Zephyrtronics ZT-7. Zephyrtronics now includes this helpful report inside of every ZT-7 that we ship to our customers along with the Zephyrtronics detailed ZT-7 Owners Manual. We don't know of any other manufacturer of SMT or BGA reflow machines that can make that claim.
Additionally, the ZT-7 is used by engineers and technicians at Raytheon® at their Tomahawk and Patriot Missile projects and is also currently in use by Boeing®, Harvard, M.I.T., Sony®, Intel®, International Rectifier®, National Semiconductor, Xilinx®, LSI Logic®, Motorola®, Agilent® and many more of the world's most prestigious commercial, academic, military, medical and electronic campuses. It may very well be the number one selling SMT & BGA benchtop system sold in North America.
Easy to use? Absolutely. Affordable? Definitely. Dependable quality in performance? Well, the solder joints that were made with the Zephyrtronics ZT-7 by JPL employees were catapulted out of the atmosphere at 4 million Newtons (900,000 pounds) of thrust, traveled over 500 million kilometers (310 million miles) at times as fast as 25,000 miles per hour, endured extreme thermal conditions coupled with exposure to gamma rays, survived the landing impact onto the red planet's surface and thereby permitting the two Rovers to perform admirably on the rugged terrain of Mars. How's that for quality solder joints?
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Launch of first
Rover, Spirit: June 10, 2003
Spirit's arrival on Mars:
Jan. 3, 2004 |
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39-Page
Rework Guide by NASA With 300 Photographs Ships With
Every ZT-7 System |
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Launch of second
Rover, Opportunity: July 7, 2003
Opportunity's arrival on Mars: January 24, 2004 |
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Photography Courtesy
of NASA & JPL |
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And don’t overlook that the ZT-7-MIL is also your
BGA Re-Balling solution.
The ZT-7 BGA, CSP & SMT Hot Air Bench Top Reflow System is available from Zephyrtronics today.
Because the ZT-7000 is modular in construction, the ZT-1-BGS-DPU, the ZT-1-HIS-DPU, and the ABC-1 can
all be purchased separately or as a complete system
as shown below. For more detailed information on
Zephyrtronics most popular systems, see our
Zephyrtronics Systems Section. Little
wonder why the ZT-7000 has been the system of choice
now for over a decade!
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