TM
The Zephyrtronics ZT-7-000 BGA, SMT & CSP Comprehensive Benchtop System.
Video!  See the ZT-7 System in Action!

Program Up to 31 Custom Thermal Profiles! The ZT-7 does not rely on do-it-yourself, unrepeatable, unreliable, external "taping" thermocouples to your PCB. Temperature control is integrated into the system with full closed-loop sensing. The easy-to-access front panel controller permits up to 31 custom thermal profiles with multiple ramp, soak and final solder reflow functions, all storable for different PCB's!

Leadless Chip
Carrier (LLC's)
Align, Place, Solder
Desolder & Remove

Shielded Chips
Align, Place, Solder Desolder & Remove

SMT Sockets
Align, Place, Solder,
 Desolder & Remove


Chip Scale (CSP's)
Align, Place, Solder
Desolder & Remove

How to Align BGA's to the PCB Pads? With our exclusive and patent protected Single-Spot, Single Axis Alignment, Placement & Reflow. The ZT-7 System NEVER requires moving the PCB once your BGA or SMD is aligned and placed and each ZT-7 ships with The BGA Primer for how to quickly and precisely align and place BGA’s to substrate pads and how NASA "explains" this simple method of placing BGA's to pads...and how to redress pads without solder wick, see Re-Dressing Your BGA Pads.

Auto-Lift De-Soldering: For de-soldering and removing chips, a semi-automatic spring-activated vacuum probe lifts BGA's and SMD's up off a PCB as solder melts taking out the guesswork -- so you won't lift pads. When the solder melts, the chip pops up into the nozzle! See this actual BGA desoldering process in this short, helpful Video: DeSoldering & Removing a BGA. The video shows actual board prep, aligning, flux application, automatic chip removal, cleaning and touches on inspecting the PCB and familiarizes you with the ZT-7 in action!

Forced Hot Air Convection is Superior to IR for PCB Prototyping, Rework & Repair:  There are many problems with infrared (IR) for PCB's, which is why it really never caught on and why so many of these "systems" have been relegated to landfills. Some drawbacks (many enumerated in articles and white papers at electronic expos) range from serious chip shadowing and lack of true thermal ramping because repeatable temperature control is not likely with IR. IR "systems" depend on technician guess work, including an idiotic requirement of taping thermocouples to your PCB to achieve sensing feedback. But the ZT-7 has built-in, closed-loop, temperature sensing during both preheat and solder reflow. No "taping" of thermocouples or using aluminum foil is required. Learn of the many problems with IR systems here Pitfalls of IR Preheat & Reflow System Video.

The ZT-7 is not limited to only surface mount devices, but excels with difficult thru-hole (PTH) de-soldering tasks with connectors, sockets, metal shields and PGA's. So versatile!

BGA's & Glob Tops
Align, Place, Solder Desolder & Remove

Quad Flat Packs
(QFP's) & SOL's
Align, Place, Solder
Desolder & Remove

PLCC'S and SOJ's
Align, Place, Solder Desolder & Remove


Re-Ball Your
BGA’S & CSP’S
Click  for Details

Ultra Low Air Velocity From Nozzles. The ZT-7 has less than 18 CFM of air velocity at the nozzle. This is critical for three reasons:

1.) Our low velocity heated air from the nozzle prevents unwanted adjacent chip reflow. Because caps and resistors surround BGA's, low air velocity is a key advantage!

2.) Our low velocity heated air won't blow or scatter solder about unlike other hot air stations.

3.) Our less-than-18 CFM air velocity helps prevent hydroplaning small chips. Aligned chips stay put.

What's Our Secret? Low velocity nozzle air flow is only possible because Zephyrtronics has ample preheating air flow from below the PCB with our AirBaths™. High volume, low temp preheated air flow from below permits minimal air velocity above from the nozzle. Other rework machines get this so wrong. Ineffective preheat requires wrongly compensating with higher temps and nozzle air velocity. Very bad.

What about QFN's and E-Pads? Those pesky QFN packages and their "e-pads" or "thermal pads" or "belly slugs" on the chip's bottom are easy to work with with the ZT-7! And this is a big advantage when using lead-free solders.

Easy Nozzle Docking With 360° Nozzle Theta Rotation Adjustment: Insert and remove nozzles from the dock without screwdrivers or tools. Nozzles slide into the tray and lock in place. The ZT-7 features two 360° adjustments for both nozzle and the vacuum probe. Ideal for angled and/or skewed chips.

Vast SMD & BGA Nozzles Available at Low Cost: Since we are "the factory", we have been fabricating nozzles since 1998 and have thousands of various styles from 50mm x 50mm to 2mm x 2mm in stock. And custom nozzles require less than 10 days and cost no more than our regular nozzles.

See Our Enviable Nozzle Catalog Here: BGA/CSP Nozzles or SMT Nozzles. And all very low priced!

All Zephyrtronics nozzles are permanently "stamped" with both the part number and the size of the nozzle for your quick reference! Who else does that for you?

Critical Post-Cooling Feature: The ZT-1 AirBath is not just a preheater, but also has a "Post Cooling" mode. Post-cooling BGA's an absolute requirement so molten balls/pads interface cool quickly preventing bridges and "opens". For more info: Two Critical Processes: Pre-Heating & Post Cooling.