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TEL: 909-865-2595
FAX: 909-865-4998
david@zeph.com
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Welcome to
Zephyrtronics! The World's First Low Temp Approach
to the Electronic Benchtop. |
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The |
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AIRFOUNTAIN |
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PCB Connector Rework, PC/104 Connector Reflow System |
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Rapid & Effective Thru-Hole Hot-Air “Selective Soldering” Reflow System |
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All Zephyrtronics Equipment is Designed, Engineered,
and Manufactured in the United States of America
1994
The "early days" of the company as David Jacks &
Randy Walston lay ground work, engineer, R&D, test &
evaluate & apply for patents on their new, milestone
low temp approach to benchtop soldering & rework.
1995
The Company introduces world’s first stand-alone,
bottom-side preheating system, The AirBath™.
1996
Zephyrtronics awarded the "Vision Award" for Best
New Product of the Year at the Surface Mount Int'l
Expo in Silicon Valley.
1997
SMT Magazine's editorial staff calls Zephyrtronics
one of the three most innovative companies
that year.
1998
U.S. Department of Defense selects Zephyrtronics as
supplier. Boeing tests & approves Zephyrtronics
AirBath™
& DeSolder for
SMD removal
1999
Raytheon recommends Zephyrtronics in written
report. National Semiconductor recommends
Zephyrtronics in published paper for
BGA rework
2000
Zephyrtronics continues
3-year string as fastest growing soldering
equipment manufacturer in the U.S.A. Also:
Introduction of dispensing
product line.
2001
Zephyrtronics saves Raytheon
$1 Million in rework scrap after Six Sigma Study.
2002
Our ZT-7-MIL is selected by The J.P.L. Mars Rover
Project for BGA tasks.
2003
International Rectifier recommends
Zephyrtronics for BGA rework.
2004
After smashing success of the Mars Rovers, NASA
issues 39-page touting Zephyrtronics for making
"mounting & removal of thru-hole and SMT/BGA easier
than routine bench methods"
2005
Zephyrtronics expands its leadership in preheating
with our
MegaGrid™
AirBath.
2006
Introduction of ZeroLead® branded lead-free solder
paste and ZeroLead® LowMelt® DeSolder Wire.
both are RoHS Compliant.
2007
Zephyrtronics launches
e-commerce site for the convenience of
our customers
all over the world.
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Hot Air Selective Soldering at the Benchtop! The
ZT-6-MIL AirFountain®
“Selective Soldering” Hot Air Reflow System is a faster and environmentally cleaner answer for selective soldering operations for “mixed technology” boards than older methods like “drag” and “dip” soldering units that can be messy or inconsistent. The ZT-6-MIL can also eliminate labor-intensive, secondary hand soldering tasks.
So Many Applications: The
ZT-6 AirFountain® easily performs a wide range of preheating and reflow process applications ranging from Thru-Hole (Connectors, I.C.’s, Pin Grid Arrays) to SMD’s (QFP’s, PLCC’s, SO’s, Sockets) to even Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s) and PC/104 card. And the
ZT-6-MIL doubles for a rapid means for De-Soldering operations when needed.
The Status Quo: Problems With Secondary Operations for Thru-Hole Connectors on SMT Assy's: A serious bottleneck to reflow production of “mixed assembly” PCB’s has been where a majority of your devices are SMT—but where a thru-hole connector still must also be reflowed. Many times, thru-hole devices are reflowed “off-line” in
secondary operations. |
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The
Patented ZT-6 AirFountain® is a Multi-Purpose Unit
Providing Both Hot Air Solder Reflow for Secondary "Off
Line" Production of PCB's and For DeSoldering Thru-Hole
I.C.'s, Pin Grid Arrays & Connectors During Rework. The
ZT-6 is Also a Powerful Prheating Device for Your PCB's. |
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The most common “off-line” selective soldering approaches are with (1) hand soldering which
is costly and time-consuming with unpredictable results from technician to technician; or with (2) either “solder dipping” or “solder dragging” within hot pots or fountains of molten metal where the board must be masked and care must be taken to prevent bridging or spilling and where pin lengths can be limiting. Further, maintaining precision solder fountain heights
is maddening, not to mention the thankless job of perpetually cleaning away dross from these devices!
A Clean & Rapid Solution for Your “Selective Soldering” Thru-Hole Soldering Operations: The
ZT-6-MIL AirFountain® can provide simultaneous reflow of hundreds of thru-hole pins or leads in less than one single minute in most cases. And it is important to point out just how clean the entire process is because reflow is achieved with selectively applied gentle forced-convection (hot air) from below. (See the illustrated flow charts below to appreciate how fast, easy and clean this process can be). Also of importance, it is possible to not only easily comply with, but also to even exceed the requirements of IPC Standard B-610 with regards to 75% fill and pin coverage!
De-Soldering Is Now Cleaner Than With A Solder Fountain! How About De-Soldering Hundreds of Thru-Hole Joints Simultaneously Within Less Than One Minute? The
ZT-6-MIL AirFountain® targets its temperature controlled, clean, forced-convection exactly where you need it...selectively! De-Soldering never was this easy. And it doesn’t require much imagination to see the advantages of the
ZT-6
AirFountain® over a smelly, dirty and dross filled Solder Fountain...not much imagination at all!
The ZT-6-MIL
AirFountain® is loaded with many premium features including Digital Closed Loop, Microprocessor Temperature Control with Set/Read Functions and an Easy-to-Operate, Digital Count-Down Timer with Audible Beeping to insure tight reflow process control. Moreover, the
ZT-6-MIL also features its own internal air supply so that no hoses, fittings, compressed air, or hook-ups are required. This remarkable production machine can be readily used at the production floor, the test lab, an engineer’s desk, or even in an executive conference room!
The construction of the
ZT-6-MIL is ESD Safe and is assembled within a durable, yet lightweight steel casing. The
ZT-6-MIL AirFountain® is also MIL-Spec compliant and is currently being used by the U.S. Department of Defense in applications ranging from high reliability (aerospace and military concerns) to commercial (consumer product and appliance manufacturing). Unlike older methods such as messy solder-pot-dipping, time-consuming hand-soldering and problematic desoldering operations, the
ZT-6-MIL, with its clean, non-contact convective reflow, makes thru-hole connector work, secondary operations, and even rework a breeze!
A Brief History: The
ZT-6-MIL AirFountain® was originally developed to address problems with the required secondary operations for a difficult SMT PCB Assy. that had a 4-row thru-hole connector with 104 gold pins where solder was not touch the gold pins. This made hand-soldering tedious and impractical due to the difficulty of reaching within 4 rows of pins and of avoiding contaminating the gold pins with solder.
However, the
ZT-6-MIL easily resolved the issue reflowing all pins in seconds!
Newer Applications From Versatility:
It didn't take too long before many more utilities for the
ZT-6-MIL became readily apparent for many PCB tasks. The
ZT-6-MIL brings a wide range of applications from Thru-Hole to SMT; from Preheating to Reflow; and from Soldering to De-Soldering tasks. Also, the
ZT-6-MIL easily transforms into a powerful bottomside preheating unit by lowering the temp to traditional "soak levels" of 100°C to 170°C. With so many utilities and applications, shouldn't there be a
AirFountain® at your bench?
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ZT-6-MIL HOT AIRFOUNTAIN™
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F E A T U R E S
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• Rapid Connector & IC Reflow & Extraction for Hi Volume Rework!
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• Cleaner than Solder Pots & Fountains
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• Great for DeSoldering Pin Grid Array's
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• Digital Count-Down Timer & Display
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• Heats to 400°C or 750°F
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S P E C I F I C A T I O N S
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DIMENSIONS
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18.5 "x 7 .5" x 9" (47cm x 19cm x 23cm)
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WEIGHT
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15.5 lbs (7. 0 kg)
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TEMP CONTROL
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Closed Loop Feedback. Easy to Use Microprocessor Programming & Digital Set/Read Functions
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ELECTRICAL RATING
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120 VAC / 60 Hz / 1,500 Watts
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POWER CONNECTION
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IEC Style Power Cord & Receptacle
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TEMP RANGE
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Ambient (R23) to 400°C (752°F)
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AIR SUPPLY
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Self-Contained. No Air Hook-Ups Required.
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CONSTRUCTION
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Lightweight, Yet Durable Steel. ESD Safe.
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TIMING FEATURES
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Digital Countdown Timer with Audible Beeper
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MIL-SPEC COMPLIANT AND APPROVED FOR SPACE APPLICATIONS
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ZT-6-MIL
AIRFOUNTAIN® |
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DESCRIPTION |
ITEM # |
PRICE |
BUY NOW |
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ZT-6 AIRFOUNTAIN® |
ZT-6 |
$4,985.00
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A C C E S S O R I E S |
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ABC-6
ADJUSTABLE BOARD CRADLE |
ABC-6 |
$249.99
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ZT-6-009 CUSTOM HARD SHELL CASE
FOR THE ZT-6 SYSTEM |
ZT-6-009 |
$495.00
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ALL
FOUNTAINHEADS® NOW ONLY... |
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$89.00
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ZT-4-MIL AIRPLUS FUME AND
SMOKE EXTRACTOR |
ZT-4-MIL |
$175.00 |
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| ©1996 - 2007 Zephyrtronics®. All rights reserved. The information you receive online from Zephyrtronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners. |
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BACK TO THE TOP OF THE PAGE |
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SMD Rework,
SMT Rework
AirBath Air Bath,
SMD Rework Stations,
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Air Pencil Soldering,
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How To - SMT, CSP, BGA
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How To - BGA Alignment;
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How To
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How To
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How To
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How To - CSP Alignment;
How To - Lead-Free Rework;
How To - SMD Removal Economical;
How To - SMD Removal Professional;
How To - Hot Air Pencil / AirPencil Soldering;
How To - SMD Quick Chip Removal;
How To - BGA Re-Balling;
How To - Rework PLCC, QFP, QFN, LCC, SOIC, SOL, Shielded SMD, TSOP;
How To - Solder & Rework Ceramic Capacitors;
How To - Solder & Rework Glass Diodes
Soldering,
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How To - Connector Rework;
How To - PC/104 Soldering and Rework;
How To - Thru-Hole / Through Hole Desolder /
De-Solder;
How
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How To- Stop Lifting Pads;
How To- Desolder / De-Solder Heavy Ground
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How To - Lead-Free Soldering and De-Soldering;
Pre-Heaters for
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ESD Magnifier,Pen
Vac,
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PC Board Fixtures,
Hot Air Tips,
AirTips,
Replacement Soldering Sponges,
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Foam Swabs,
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X-BOX 360 Repair |
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