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david@zeph.com
 

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Welcome to Zephyrtronics! The World's First Low Temp Approach to the Electronic Benchtop.

 
The

®

AIRFOUNTAIN

               
PCB Connector Rework, PC/104 Connector Reflow System
Rapid & Effective Thru-Hole Hot-Air “Selective Soldering” Reflow System


All Zephyrtronics Equipment is Designed, Engineered, and Manufactured in the United States of America

 

1994
The "early days" of the company as David Jacks & Randy Walston lay ground work, engineer, R&D, test & evaluate & apply for patents on their new, milestone low temp approach to benchtop soldering & rework.

1995
The Company introduces world’s first stand-alone, bottom-side preheating system, The AirBath™. 

1996
Zephyrtronics awarded the "Vision Award" for Best New Product of the Year at the Surface Mount Int'l Expo in Silicon Valley.

1997
SMT Magazine's editorial staff calls Zephyrtronics one of the three most innovative companies  that year.

1998
 U.S. Department of Defense selects Zephyrtronics as supplier. Boeing tests & approves Zephyrtronics AirBath™
& DeSolder for
SMD removal

1999
Raytheon recommends Zephyrtronics in written report. National Semiconductor recommends  Zephyrtronics in published paper for
BGA rework

2000
Zephyrtronics continues
 3-year string as fastest growing soldering equipment manufacturer in the U.S.A. Also: Introduction of     dispensing product line.

2001
  Zephyrtronics saves Raytheon
$1 Million in rework scrap after Six Sigma Study.

2002
Our ZT-7-MIL is selected by The J.P.L. Mars Rover Project for BGA tasks.

2003
 International Rectifier recommends
Zephyrtronics for BGA rework.

2004
After smashing success of the Mars Rovers, NASA issues 39-page touting Zephyrtronics for making "mounting & removal of thru-hole and SMT/BGA easier than routine bench methods"

2005
Zephyrtronics expands its leadership in preheating
 with our
MegaGrid
™ AirBath.

2006
Introduction of ZeroLead® branded lead-free solder paste and ZeroLead® LowMelt® DeSolder Wire.  both are RoHS Compliant.

2007
Zephyrtronics launches
 e-commerce site for the convenience of
our customers
all over the world.

 

 

 

 

 

 

 

 

 

Hot Air Selective Soldering at the Benchtop! The ZT-6-MIL AirFountain® “Selective Soldering” Hot Air Reflow System is a faster and environmentally cleaner answer for selective soldering operations for “mixed technology” boards than older methods like “drag” and “dip” soldering units that can be messy or inconsistent. The ZT-6-MIL can also eliminate labor-intensive, secondary hand soldering tasks.

So Many Applications: The ZT-6 AirFountain® easily performs a wide range of preheating and reflow process applications ranging from Thru-Hole (Connectors, I.C.’s, Pin Grid Arrays) to SMD’s (QFP’s, PLCC’s, SO’s, Sockets) to even Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s) and PC/104 card. And the ZT-6-MIL doubles for a rapid means for De-Soldering operations when needed.

The Status Quo: Problems With Secondary Operations for Thru-Hole Connectors on SMT Assy's: A serious bottleneck to reflow production of “mixed assembly” PCB’s has been where a majority of your devices are SMT—but where a thru-hole connector still must also be reflowed. Many times, thru-hole devices are reflowed “off-line” in secondary operations.

  airfountain-lead-free  
   

The Patented ZT-6 AirFountain® is a Multi-Purpose Unit Providing Both Hot Air Solder Reflow for Secondary "Off Line" Production of PCB's and For DeSoldering Thru-Hole I.C.'s, Pin Grid Arrays & Connectors During Rework. The ZT-6 is Also a Powerful Prheating Device for Your PCB's.

   
         

features-_-benefits

 

The most common “off-line” selective soldering approaches are with (1) hand soldering which is costly and time-consuming with unpredictable results from technician to technician; or with (2) either “solder dipping” or “solder dragging” within hot pots or fountains of molten metal where the board must be masked and care must be taken to prevent bridging or spilling and where pin lengths can be limiting. Further, maintaining precision solder fountain heights is maddening, not to mention the thankless job of perpetually cleaning away dross from these devices!

A Clean & Rapid Solution for Your “Selective Soldering” Thru-Hole Soldering Operations: The ZT-6-MIL AirFountain® can provide simultaneous reflow of hundreds of thru-hole pins or leads in less than one single minute in most cases. And it is important to point out just how clean the entire process is because reflow is achieved with selectively applied gentle forced-convection (hot air) from below. (See the illustrated flow charts below to appreciate how fast, easy and clean this process can be). Also of importance, it is possible to not only easily comply with, but also to even exceed the requirements of IPC Standard B-610 with regards to 75% fill and pin coverage!

De-Soldering Is Now Cleaner Than With A Solder Fountain! How About De-Soldering Hundreds of Thru-Hole Joints Simultaneously Within Less Than One Minute? The ZT-6-MIL AirFountain® targets its temperature controlled, clean, forced-convection exactly where you need it...selectively! De-Soldering never was this easy. And it doesn’t require much imagination to see the advantages of the ZT-6 AirFountain® over a smelly, dirty and dross filled Solder Fountain...not much imagination at all!

The ZT-6-MIL AirFountain® is loaded with many premium features including Digital Closed Loop, Microprocessor Temperature Control with Set/Read Functions and an Easy-to-Operate, Digital Count-Down Timer with Audible Beeping to insure tight reflow process control. Moreover, the ZT-6-MIL also features its own internal air supply so that no hoses, fittings, compressed air, or hook-ups are required. This remarkable production machine can be readily used at the production floor, the test lab, an engineer’s desk, or even in an executive conference room!

The construction of the ZT-6-MIL is ESD Safe and is assembled within a durable, yet lightweight steel casing. The ZT-6-MIL AirFountain® is also MIL-Spec compliant and is currently being used by the U.S. Department of Defense in applications ranging from high reliability (aerospace and military concerns) to commercial (consumer product and appliance manufacturing). Unlike older methods such as messy solder-pot-dipping, time-consuming hand-soldering and problematic desoldering operations, the ZT-6-MIL, with its clean, non-contact convective reflow, makes thru-hole connector work, secondary operations, and even rework a breeze!

A Brief History: The ZT-6-MIL AirFountain® was originally developed to address problems with the required secondary operations for a difficult SMT PCB Assy. that had a 4-row thru-hole connector with 104 gold pins where solder was not touch the gold pins. This made hand-soldering tedious and impractical due to the difficulty of reaching within 4 rows of pins and of avoiding contaminating the gold pins with solder. However, the ZT-6-MIL easily resolved the issue reflowing all pins in seconds!

Newer Applications From Versatility: It didn't take too long before many  more utilities for the ZT-6-MIL became readily apparent for many PCB tasks. The ZT-6-MIL brings a wide range of applications from Thru-Hole to SMT; from Preheating to Reflow; and from Soldering to De-Soldering tasks. Also, the ZT-6-MIL easily transforms into a powerful bottomside preheating unit by lowering the temp to traditional "soak levels" of 100°C to 170°C. With so many utilities and applications, shouldn't there be a AirFountain® at your bench?

ZT-6-MIL HOT AIRFOUNTAIN

F E A T U R E S

 • Rapid Connector & IC Reflow &  Extraction for Hi Volume Rework!

 • Cleaner than Solder Pots & Fountains

 • Great for DeSoldering Pin Grid Array's

 • Digital Count-Down Timer & Display

 • Heats to 400°C or 750°F

S P E C I F I C A T I O N S

DIMENSIONS

  18.5 "x 7 .5" x 9" (47cm x 19cm x 23cm)

WEIGHT

  15.5 lbs (7. 0 kg)

TEMP CONTROL

Closed Loop Feedback. Easy to Use Microprocessor Programming & Digital Set/Read Functions

ELECTRICAL RATING

  120 VAC / 60 Hz / 1,500 Watts

POWER CONNECTION

  IEC Style Power Cord & Receptacle

TEMP RANGE

  Ambient (R23) to 400°C (752°F)

AIR SUPPLY

  Self-Contained. No Air Hook-Ups Required.

CONSTRUCTION

  Lightweight, Yet Durable Steel. ESD Safe.

TIMING FEATURES

  Digital Countdown Timer with Audible Beeper

MIL-SPEC COMPLIANT AND APPROVED FOR SPACE APPLICATIONS

newfountain_spec_1_copy02

Learn "How To: Simultaneously Solder and/or De-Solder Hundreds of Thru-Hole Joints in Less Than One Minute."

              
Click Here to see some of the methods to solder and de-solder thru-hole devices.

ZT-6-MIL AIRFOUNTAIN®

DESCRIPTION

ITEM #

PRICE

BUY NOW

airfountain_web_small02

ZT-6 AIRFOUNTAIN®

ZT-6

$4,985.00

A  C C  E S  S O  R I  E S

abc-6_small

ABC-6 ADJUSTABLE BOARD CRADLE

ABC-6

$249.99

case_small_copy

ZT-6-009 CUSTOM HARD SHELL CASE
FOR THE ZT-6 SYSTEM

ZT-6-009

$495.00

fountainhead_small

ALL FOUNTAINHEADS® NOW ONLY...

 

$89.00

FILTER_WEB_small

ZT-4-MIL AIRPLUS FUME AND
SMOKE EXTRACTOR

ZT-4-MIL

$175.00

 

HOME

SOLDERING EQUIPMENT
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US

CONTACT
US

 
©1996 - 2007 Zephyrtronics®. All rights reserved. The information you receive online from Zephyrtronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners.
 

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