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All Zephyrtronics Equipment is Engineered and Manufactured in the United States of America.
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XBox 360 Ring of Death Repair: Your Solution for BGA, SMT
& CSP
Rework, Reflow, Repair & Reballing Made Easy for
You
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XBOX 360 REPAIR
SYSTEMS
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ZEPHYRTRONICS
ZT-7 PROFESSIONAL HOT AIR
REFLOW CENTER |
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Soldering and De-Soldering the GPU, CPU & the Samsung
"Memory Chip"
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Red rings? Error codes? Ring of Death? Repairing
the wildly popular Microsoft®
Xbox 360 printed
circuit board (PCB) is now easier than ever with
the
Zephyrtronics ZT-7 Hot Air
Soldering Benchtop System.
The ZT-7 System makes either 1.) just reflowing
the chips; or 2.) de-soldering and removing the
GPU, CPU and Memory Chips and then replacing and
re-soldering them back to the printed circuit
boards (PCB's) to correct the error codes a
breeze. And best of all, the ZT-7 System is also
very affordable and is manufactured by
Zephyrtronics in the U.S. and has a two year
limited warranty.
First,
don't be fooled by IR systems that might repair
the PCB temporarily, but that can actually do more
harm than good to the board and chips. You want
complete reflow of the entire ball of solder (inside
and outside) on every connection, and not what is
called "tangential reflow" that will later open up
again if the board flexes, especially when the XBox®
is being used again. To learn more about the many
pitfalls, drawback and limitations with IR systems,
please you will want to watch the
Video
Comparisons & Demonstrations: 4 Methods of
Preheating & Solder Reflow which
illustrates the advantages of heated air or forced
convection and why it has long been the "industry
standard" in PCB work worldwide.
Second, make
sure that the PCB holding fixture is independent
from both the lower pre-heater and from the upper
reflow heater.
If one is
trying to repair or reflow a large quantity of
PCB's, then speed is important. So having to wait
for a large PCB (like the XBox 360) to first
preheat, and then later to cool down for a long time
before moving on to the next PCB wastes a lot of
time and money and profit. Check out this short
video so you will understand why this is so
important. You'll be glad you did:
Video: The ABC's of PCB
Holding Fixtures.
By the
way, the ZT-7 System is equally effective for
repairing the PlayStation®
which you can learn about at this direct link:
PlayStation Rework Station.
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Understanding the GPU, CPU, Memory Chips
and Ball Grid Arrays (BGA's):
Q: What are
these chip packages that Microsoft®
and Sony®
call the GPU, the CPU, and the Memory
Chips? And why do they look so different
from other components?
A: These are electronic chips that are
packaged in what are called Ball Grid
Array formats (BGA's). They are a
relatively new form of Surface Mount
Devices (SMD) and are similar to other
components in that they have an
integrated circuit (die) within the
package and that they have connections
to be soldered. However, instead of
leads at the side of the chip, the
connections are balls underneath the
chip (See Below):
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Above left: Bottom side of a QFP Surface
Mount Chip with the leads at the side
for soldering to the PCB.
Above right: Bottom side of a Ball Grid
Array (BGA) Chip with solder spheres
(balls) at the bottom for soldering to
the PCB.
Many chips on the XBOX 360®
and PlayStation®
Printed Circuit Boards are packaged in
the BGA format shown above including the
GPU, CPU and Memory Chips. Indeed, most
consumer electronic PCB's today
incorporate more and more BGA style
chips as they are more robust in
construction and have faster gate speed
for processing.
Once a BGA is placed and soldered to the
PCB, you can no longer "see" any
connections (balls): they are underneath
the chip and not visible to the eye.
Finally, the XBOX and PlayStation®
PCB's chips are all soldered with
lead-free solder, not the more
traditional solder. Lead-free solder
requires higher than traditional
temperatures so PCB preheat
imperative.
Good News! Believe it or not, BGA's are
surprisingly easy to remove and replace
with the right equipment and the proper
procedures. And Zephyrtronics has built
into the popular ZT-7 System so many
great features including effective
preheating of those lead-free solder
joints so as to make your job now much
easier to perform. |
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At the
left, you can see the XBOX 360 printed circuit board
populated with its components including the critical
GPU, CPU and Memory Chip chips. And shown below is
the XBOX CPU component which is Ball Grid Array
(BGA) styled package (see the yellow highlighted
sidebar for further explanation). |
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Because BGA's such as the chip shown below
have less metal content than the old
traditional components with leads,
these chips
are far more sensitive to high temperatures
requiring that the PCB be preheated before
any rework can be performed so as not to
damage them during your rework or repair. |
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XBox 360 GPU BGA |
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Effective, PCB pre-heating is a critical
requirement for success and quality
soldering during rework of the XBox 360
chips and boards. And this is where many
systems "repair stations" fail miserably
because they have ineffective IR preheating
below the PCB and therefore require
unacceptable higher final solder reflow
temperatures from above which permanently
damage the chip itself. And if the chip is
damaged, it then will have to be completely
removed, replaced and re-soldered. |
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Even worse,
there are still other "repair stations" where the upper heat is so
ineffective, that the machines require that the entire PCB be heated
underneath to over 200°C for over twenty minutes! Worse, the manufacturers
of these "machines" advise the user to cover the chips with foil during the
process. Are they crazy? Of course, this nonsense would never be permitted
in any reputable PCB manufacturing or repair company. Never. |
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ZT-7 Benchtop System |
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The
ZT-7 is the
very same soldering system that was used by
NASA to place and solder the critical,
high-reliability I.C.'s on the two Mars
Rovers whose mission was so successful in
2003 and 2004.
Good enough for NASA, yet easy enough to
repair an XBox 360 PCB! And at a great
price! Click here to learn more detail about
the
ZT-7 Hot Air Station. |
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Helpful Rework Guide:
Zephyrtronics ships every ZT-7 with a
detailed and helpful owners manual along
with the 39-page report by NASA for its
employees which features approximately 300
photographs filled with technical tips and
techniques. In addition, for those reworking
and repairing XBox360®
modules, Zephyrtronics also includes a
step-by-step illustrated guide for removing
and replacing the components and even
practice printed circuit boards and chips!
A
Word of Warning from NASA About IR Rework
Systems:
"Hot
plates and infrared pre-heaters are not
recommended...The reason that they
should not be used is that the thermal
reaction times, energy transfer rates and
efficiency are never consistent."
The Zephyrtronics ZT-7 System uses no IR
whatsoever, but the decades-long proven
industry standard of forced convection hot
air.
The
ZT-7 is
easy to operate with digital,
closed-loop, programmable
temperature control and digital countdown
timing, bottom-side preheat and thermal
profiling for quality work.
The ZT-7 is not limited to just
the XBox PCB's, but is ideal for
reworking smart-phones, laptops, plasma television PCB's,
prototype and small production runs.
For more specifications, technical
information and product details regarding
our popular XBox®
or PlayStation®
repair stations, click here to see the full,
webpage on the
ZT-7 Hot Air BGA & SMT
PCB Center.
Or call us at our factory in Los Angeles
County Monday-Friday 8-6PM (Pacific Time) at
(909) 865-2595 or e-mail us at
david@zeph.com. We're
here and happy to help.
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ZT-7-XBOX REWORK COMPREHENSIVE SYSTEM |
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Description
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Item |
Price |
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The
ZT-7-XBOX
Comprehensive
System
BGA & SMT Hot Air Bench Top Reflow System
Includes:
The
ZT-7-MIL BGA & SMD
Hot Air Repair Center (shown above)
Plus
The
ZT-1-BGS-DPU
BigGrid™ AirBath Preheating System
The
ABC-1 Adjustable Board Cradle
The
ZLK-XBOX Benchtop Supply Kit
Note: The ZLK-XBOX Kit Includes the
ZeroFlex™ PC Board Brace
Plus All of the Following XBox Hot Air Nozzles:
ZT-7-3021 (31 X 31MM), ZT-7-3007 (35 X
35MM),
ZT-7-3082 (11 X 14MM) and
ZT-7-3005 (23 X 23MM)
Plus All the Essential XBox
Repair Supplies & Tools
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-1
ZLK-XBOX
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$6,010
LIMITED
TIME
OFFER!
$4,995
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The
ZT-7-XBOX-ZF
Comprehensive System BGA & SMT
Hot Air Bench Top Reflow System
Includes:
The
ZT-7-MIL BGA & SMD
Hot Air Repair Center (shown above)
Plus
The
ZT-1-BGS-DPU
BigGrid™ AirBath Preheating System
The
ABC-XYZ Adjustable Board Cradle
The
ZLK-XBOX Benchtop Supply Kit
Note: The ZLK-XBOX Kit Includes the
ZeroFlex™ PC Board Template
Plus All of the Following XBox Hot Air Nozzles:
ZT-7-3021 (31 X 31MM), ZT-7-3007 (35 X
35MM),
ZT-7-3082 (11 X 14MM) and
ZT-7-3005 (23 X 23MM)
Plus All the Essential XBox
Repair Supplies & Tools
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ZT-7-MIL
ZT-1-BGS-DPU
ABC-XYZ
ZLK-XBOX
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$6,510
LIMITED
TIME
OFFER!
$5,495
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XBOX Zero Flex Template
Thick, Machined Metal Plate With
Reciprocal Studs for PCB Holes
Thick Metal Plate Prevents PC Board
Flexing During Rework
Openings Permit PCB Quicker & More
Uniform Preheat From Below
Works With
ABC-XYZ Board
Cradle
(Note: ZeroFlex™ Template is Included
In ZLK-XBOX Kit)
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ZT-7-ZF-XB |
$125 |
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©1996 - 2011, 2012, 2013 by Zephyrtronics®. All rights reserved.
The information, text, images, photographs, charts, graphs you
receive online from Zephyrtronics® are protected by the
copyright laws of the United States. The copyright laws prohibit
any copying, redistributing, retransmitting, or repurposing of
any copyright-protected material. Zephyrtronics is the
registered trademark property of JTI, Inc. "The Science of
Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux"
and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post
Cooling" and "Post Cooler" and "AirBath" and "SolderGlide" and
"SolderMill" and "Just So Superior" are the protected trademark
property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air
Fountain" and "Fountainhead" are the registered trademark
properties of JTI Inc. *The above names are the registered
property of their respective owners. |
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Click link
below to return to the top of the page |
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CLICK HERE to
Go Directly to Our Easy-to-Navigate and Illustrated Product Directory. |
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SMD
Rework,
SMT Rework
AirBath Air Bath,
SMD Rework Stations,
Hot Air Pencil Soldering,
BGA Rework Stations,
CSP Rework Stations,
Preheating Systems,
PCB Preheaters,
Pre-Heat SMT/ SMD,
Low Temp Rework,
SMT DeSoldering Tools,
Vacuum Pickup Tools,
Circuit Board Holders,
PCB Fixture & PCB Holders
&,
Board Cradles,
Rework Solder Paste,
No-Clean Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder Wire,
Hot Air Rework Stations,
Fume Extractors,
SMT Dental Probes,
SMT, SMD Rework Kit,
BGA Rework Kit,
LMK Kit,
BGA Re-Balling Kit,
SMD Tweezers,
Power Palm Plunger,
QFP Lead Straightener
How
To - SMT, CSP, BGA Rework
How To - BGA Alignment;
How To - SMT Rework;
How To - PCB Preheating,
How To - BGA & CSP Rework;
How To - Quickly Solder
SMD Packages Effectively;
How To - CSP Alignment;
How To - Lead-Free Rework;
How To - SMD Removal
Economical;
How To - SMD Removal
Professional;
How To - Hot Air Pencil /
AirPencil Soldering;
How To - SMD Quick Chip
Removal;
How To - BGA Re-Balling;
How To - Rework PLCC, QFP,
QFN, LCC, SOIC, SOL, Shielded SMD, TSOP;
How To - Solder & Rework
Ceramic Capacitors;
How To - Solder & Rework
Glass Diodes;
How to Repair Smartphones,
Tablets and Laptops
Soldering,
De-Soldering
Soldering Accessories,
Solder Wire,
No-Clean Solder Wire,
Eutectic Solder Wire,
Solder Wire Dispenser,
Solder Paste,
Lead-Free Solder Paste,
Flux,
Solder Paste Dispensers,
Low Melt®
DeSolder Wire,
De-Solder Wire,
Soldering Tips,
Thru-Hole DeSoldering
Tools,
DeSoldering Tips,
Tips for DeSoldering,
De-Solder Wick &
DeSoldering Braid,
Smoke Extractors,
Fume Extractor Filters,
Carbon Activated Filters,
SolderMill™,
Solder Sucker / DeSolder
Pump,
Pre-heating Systems,
Preheat Thru-Hole,
PCB Pre-heaters,
Flux Solvent,
How To - Connector Rework;
How To - PC/104 Soldering
and Rework;
How To - Thru-Hole /
Through Hole Desolder / De-Solder;
How To - Low Melt®
Desolder Wire;
How To- Stop Lifting Pads;
How To- Desolder /
De-Solder Heavy Ground Planes;
How To - Lead-Free
Soldering and De-Soldering;
Pre-Heaters for Lead-Free Rework and Soldering
Dispensing Equipment, Gear, Supplies, Dispensing
Bottles & Dispensing Accessories
Dispensing Systems,
Dispensing Syringes,
Dispensing Barrels,
Tapered Dispensing Tips,
Blunt Needles,
Dispensing Bottles,
Stainless Steel Needles,
Dispensing Needles,
Industrial Needles,
Dispensing Tips,
Industrial Dispensing
Tapered Tips and Needles,
Dispensing Accessories,
Flux Bottles,
Solder Paste in Syringe,
Paste Rack Solder Paste
Holder™,
Dispensing Supplies,
Power Palm Plunger,
Manual Dispensing,
Alcohol Pump Bottles,
Automatic Dispensing,
Squeeze Bottles, Wash
Bottles, Brush Bottles, Spout Bottles, Pump
Bottles
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder Paste,
Solder Wire,
LowMelt®,
No-Clean Flux,
BGA Flux,
Rework Tack Flux,
Non-Flammable Flux Remover,
Inspection Equipment,
Magnification Equipment,
Magnifying Worklight,
ESD Magnifier,
Pen Vac,
SMT Tweezers,
Fume Extraction,
SMD Tweezers,
PC Board Fixtures,
Hot Air Tips,
AirTips,
Replacement Soldering
Sponges,
Iron Plated Soldering Tips,
Foam Swabs,
Anti-Static Foam Swabs,
Thru-Hole & Solvent
Brushes,
Helping Hands,
LMK Rework Kits,
X-BOX 360 Repair,
Wire Strippers & Wire
Cutters,
Flush Cutters, Micro
Shears & Needle Nose Piers,
Straightening Tool for
QFP Leads,
ESD Wrist Straps,
ESD Wrist Strap Tester
Updated May 21, 2013 |
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