How to Align a BGA       Placing the Ball Grid Array to the PCB        How to Prepare BGA Pads    Soldering BGA's

The ZT-7 Hot Air Comprehensive Benchtop System

 HOW TO QUICKLY & EASILY  BGA’s & CSP’s PRECISELY TO PADS IN SECONDS!

STEP 1:
Insert the patented Alignment Cube into corresponding, non-heated nozzle.  Next, activate the ZT-7’s vacuum to secure Cube within the nozzle as shown above.

STEP 2:
Lower “Z” Axis of ZT-7 To Where Alignment Cube Hovers Directly Over (NASA Recommends About 1mm Above) the Targeted BGA Pads on the PCB Below.

STEP 3:
Moving the Adjustable Board Cradle (PCB fixture), next “Align the PCB’s pads for the targeted BGA to the Alignment Tool by adjusting the ABC-1 Circuit Board Cradle as necessary.”
 ---NASA, 2004

Photograph Courtesy of NASA

STEP 4A: Square & Mate Cube to Outside Perimeter of BGA Pads. The Nozzle’s X, Y and Theta are Now Precisely Relationed to Targeted Pads! Cube Temporarily “Holds Place” for the BGA. Raise “Z” Axis, Deactivate Vacuum Releasing Cube.

STEP 4B:
NASA explains the simplicity this way: “ The alignment process is completed when the solder pads are just hidden on all directions. The drawing (above) shows what a properly aligned 5 x 5 BGA would look like. The solder pads (red) are just contained the Alignment Tool outline (blue).”
--NASA, 2004.
Graphic illustration courtesy of NASA from NASA Report describing the Zephyrtronics patented BGA alignment invention and patented Method.

STEP 5:
Insert Your BGA/CSP into the Now-Aligned Nozzle Where the Cube Had Been. Activate Vacuum to secure BGA. Lower “Z” Axis and Nozzle Down to the Substrate. Release Vacuum. Your BGA is Positioned on to Corresponding Pads! You are now ready to reflow your BGA with your Zephyrtronics ZT-7 System.

How easy is that?

That’s right, folks! You don’t need a ten-twenty thousand dollar “split-beam” vision alignment unit to accurately place BGA’s and CSP’s (micro BGA’s) to your PCB pads!  --- Back to the ZT-7BGA, SMT, CSP MicroBGA Hot Air Soldering & Desoldering Station. Prototype & SMD Rework, Repair System. Product Page Here.

STEP 1:
BGA removal requires cleanup as unequal solder deposits remain at vacated site. After IC removal, slide the “Y” Axis of ZT-7 back out of way, apply flux to pads. Preheat bottom of PCB at 150°C with AirBath.

STEP 2 (OPTION “A”):
After a brief preheating/soaking, use a heated De-Soldering Tool with a “soft tip-pad interface” and suck up excessive solder from pads. Preheating allows a lower, safer temp for De-Soldering.

STEP 2 (OPTION “B”):
Melt LowMelt® DeSolder into residual solder at pads. Remove all solder with either a foam swab or a “Solder Sucker”.

All Zephyrtronics Equipment is Designed, Engineered, and Manufactured in the United States of America.

1994
The "early days" of the company as David Jacks & Randy Walston lay ground work, engineer, R&D, test & evaluate & apply for patents on their new, milestone low temp approach to benchtop soldering & rework.

1995
The Company introduces world’s first stand-alone, bottom-side preheating system, The AirBath™. 

1996
Zephyrtronics awarded the "Vision Award" for Best New Product of the Year at the Surface Mount Int'l Expo in Silicon Valley.

1997
SMT Magazine's editorial staff calls Zephyrtronics one of the three most innovative companies  that year. Boeing chooses our AirBaths for the International Space Station Project.

1998
 U.S. Department of Defense selects Zephyrtronics as supplier. Boeing tests & approves Zephyrtronics AirBath™
& DeSolder for
SMD removal

1999
Raytheon recommends Zephyrtronics in written report. National Semiconductor recommends  Zephyrtronics
in published paper for
BGA rework

2000
Zephyrtronics continues
 3-year string as fastest growing soldering equipment manufacturer in the U.S.A. Also: Introduction of     dispensing product line.

2001
  Zephyrtronics saves Raytheon $1 Million in rework scrap after Six Sigma Study.

2002
Our ZT-7-MIL is selected by The J.P.L. Mars Rover Project for BGA tasks.

2003
 International Rectifier recommends
Zephyrtronics
for BGA rework.

2004
After smashing success of the Mars Rovers, NASA issues 39-page touting Zephyrtronics for making "mounting & removal of thru-hole and SMT/BGA easier than routine bench methods"

2005
Zephyrtronics expands its leadership in preheating
 with our
MegaGrid™ AirBath.

2006
Introduction of ZeroLead® branded lead-free solder paste and ZeroLead® LowMelt® DeSolder Wire.  both are RoHS Compliant.

2007
Zephyrtronics launches
 e-commerce site for the convenience of
our customers
all over the world.

________________

1996 "Vision Award" Awarded to Zephyrtronics in Recognition of Its Breakthrough
"AirBath Device"
 for Preheating at
 the Benchtop

The Zephyrtronics
 AirBath is Featured
in Ray Prasad's
 Definitive Text
"Surface Mount Technology"

"Innovative...simpler, safer way to remove and repair sensitive devices" The Editorial Staff, SMT MAGAZINE

Welcome to Zephyrtronics! The World's First Low Temp Approach to the Electronic Benchtop.