PCB, Rework, SMD Preheater, BGA Preheating, SMT Preheat, PCB Pre-heater, Rework Pre-heating, Lead-Free Rework
 

How to Align a BGA       Placing the Ball Grid Array to the PCB        How to Prepare BGA Pads    Soldering BGA's

HOW TO ALIGN BGA'S and
HOW TO REDRESS BGA PADS



Zephyrtronics Equipment is Designed, Engineered, and Manufactured in the United States of America.
    ALIGNMENT   RE-DRESSING

BGA Alignment, Align, BGA, Hot Air Rework, Station
 
BGA Hot Air Nozzles Don’t be frightened by BGA’s because their balls are hidden underneath the package! Aligning BGA’s to the Pads and Reflowing them is Easy to Do!
   

The ZT-7000 Hot Air Comprehensive Benchtop System
 NASA & Zephyrtronics Show How To:
 

 ALIGN QUICKLY & EASILY  BGA’s & CSP’s PRECISELY TO PADS IN SECONDS!
  In the early 1990’s, the engineers at Zephyrtronics cleverly had the foresight to resolve the issue of placing BGA’s to the PCB pads. Their patented invention and method, now used successfully and repeatedly by thousands of engineers and technicians around the world, makes aligning the BGA component to the BGA pads:

1) Easy to Perform. (Little Skill Required)
2) Quick to Perform. It takes less than one minute!
3) Accurate & Repeatable Placement
4) Inexpensive and Kind to Your Budget!

Our patent-protected Zephyrtronics BGA Alignment Template Cube Invention eliminates the need for expensive so-called “split-beam” vision machines, cameras and monitors, all of which (by the way) must be continuously calibrated.

Below are photographs from Zephyrtronics and from NASA in a five step process for aligning and reflowing the BGA right to the corresponding PCB pads.
ZT7 Align Step 103   ZT7 Align Step 2   ZT7 Align Step 3
   

STEP 3: Moving the Adjustable Board Cradle (PCB fixture), next “Align the PCB’s pads for the targeted BGA to the Alignment Tool by adjusting the ABC-1 Circuit Board Cradle as necessary.”
--NASA '04.    Photo Courtesy of NASA

STEP 1:  First, insert the patented Alignment Cube into corresponding, non-heated nozzle.  Next, activate the ZT-7’s vacuum to secure Cube within the nozzle as shown above.

  

STEP 2: Lower “Z” Axis of ZT-7 To Where Alignment Cube Hovers Directly Over (NASA Recommends About 1mm Above) the Targeted BGA Pads on the PCB Below.

  
     

ZT7 Align Step 4b
ZT7 Align Step 4a     ZT7 Align Step 5
 

STEP 4B: NASA explains the alignment simplicity this way: “The alignment process is completed when the solder pads are just hidden on all directions. The drawing (above) shows what a properly aligned 5 x 5 BGA would look like. The solder pads (red) are just contained the Alignment Tool outline (blue).”-- NASA, '04. Illlustration courtesy of NASA from NASA Report describing the Zephyrtronics patented BGA alignment template and methodology.

  

STEP 4A: Square & Mate the Cube to Outside Perimeter of BGA Pads. The Nozzle’s X, Y and Theta are Now Precisely Relationed to Targeted Pads! Cube Temporarily “Holds Place” for the BGA. Raise “Z” Axis, Deactivate Vacuum Releasing Cube. The next helpful illustration expands on the alignment concept a bit more.

     STEP 5: Insert Your BGA/CSP into the Now-Aligned Nozzle Where the Cube Had Been. Activate Vacuum to secure BGA. Lower “Z” Axis and Nozzle Down to the Substrate. Release Vacuum. Your BGA is Positioned on to Corresponding Pads! You are now ready to reflow your BGA with your Zephyrtronics ZT-7 System. How easy is that?
That’s right, folks! You don’t need a ten-twenty thousand dollar “split-beam” vision alignment unit to accurately place BGA’s and CSP’s (micro BGA’s) to your PCB pads!  --- Back to the ZT-7BGA, SMT, CSP MicroBGA Hot Air Soldering & Desoldering Station. Prototype & SMD Rework, Repair System. Product Page Here  
How To:
 RE-DRESSING BGA & PADS WITHOUT SOLDERING IRONS & WICK		  
ZT7 Redress 1   ZT7 Redress 2

 
"Vision Award" Awarded to Zephyrtronics in Recognition of Its Breakthrough
"AirBath Device" for Preheating at the Benchtop		  

 

The Zephyrtronics
 AirBath is Featured
in Ray Prasad's
 Definitive Text
"Surface Mount Technology"

  

 

"Innovative...simpler, safer way to remove and repair sensitive devices" The Editorial Staff, SMT MAGAZINE

  

STEP 1:  BGA removal requires cleanup as unequal solder deposits will still remain at the vacated site. After your IC removal, slide the “Y” Axis of ZT-7 back out of way, and apply flux to pads. Preheat bottom of PCB at 150°C with AirBath.

  

STEP 2 (OPTION “A”): After a brief preheating (soaking) of your PCB, use a heated De-Soldering Tool with a “soft tip-pad interface” and suck up excessive solder from your pads. Preheating allows a lower, safer temp for all De-Soldering tasks.
ZT7 Redress 2b   ZT7 Redress 3

STEP 2 (OPTION “B”): Another popular method is to melt LowMelt® DeSolder into residual solder at pads. Remove all solder with either a foam swab or a “Solder Sucker”.

  

STEP 3:  Switch off ZT-7 and AirBath. Gently clean site with a foam swab and a Non-Flammable Flux Remover. Inspect. (Notice? No Wick!)
 

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