Welcome to
Zephyrtronics! The World's First Low Temp Approach
to the Electronic Benchtop.
The
®
LOWMELT
DE-SOLDER PROCESS
Low Temperature SMD and Thru-Hole Removal
Now Available
Also in a Lead-Free and RoHS Compliant Formulation!
All Zephyrtronics Equipment is Designed, Engineered,
and Manufactured in the United States of America
1994
The "early days" of the company as David Jacks &
Randy Walston lay ground work, engineer, R&D, test &
evaluate & apply for patents on their new, milestone
low temp approach to benchtop soldering & rework.
1995
The Company introduces world’s first stand-alone,
bottom-side preheating system, The AirBath™.
1996
Zephyrtronics awarded the "Vision Award" for Best
New Product of the Year at the Surface Mount Int'l
Expo in Silicon Valley.
1997
SMT Magazine's editorial staff calls Zephyrtronics
one of the three most innovative companies
that year.
1998
U.S. Department of Defense selects Zephyrtronics as
supplier. Boeing tests & approves Zephyrtronics
AirBath™
& DeSolder for
SMD removal
1999 Raytheon recommends Zephyrtronics in written
report. National Semiconductor recommends
Zephyrtronics in published paper for
BGA rework
2000
Zephyrtronics continues
3-year string as fastest growing soldering
equipment manufacturer in the U.S.A. Also:
Introduction of dispensing
product line.
2001
Zephyrtronics saves Raytheon
$1 Million in rework scrap after Six Sigma Study.
2002
Our ZT-7-MIL is selected by The J.P.L. Mars Rover
Project for BGA tasks.
2003 International Rectifier recommends
Zephyrtronics for BGA rework.
2004 After smashing success of the Mars Rovers, NASA
issues 39-page touting Zephyrtronics for making
"mounting & removal of thru-hole and SMT/BGA easier
than routine bench methods"
2005
Zephyrtronics expands its leadership in preheating
with our
MegaGrid™
AirBath.
2006
Introduction of ZeroLead® branded lead-free solder
paste and ZeroLead® LowMelt® DeSolder Wire.
both are RoHS Compliant.
2007 Zephyrtronics launches
e-commerce site for the convenience of
our customers
all over the world.
Step
1
Step 2A
Always Preheat First. Place your PCB into your fixture above the
ZT-1 AIRBATH
as shown at the left. Begin the preheat process by flipping the rocker switch
the "Warm." mode (Recommended setting: 150°C)
Dip Swab Into Flux.
As PCB pre-heats, insert a small anti-static foam swab into flux as shown. (Recommended:
A thin anti-static foam swab and tack flux
NCF-0014 No-Clean Flux).
Step 2B
Step 3A
Apply Flux. Make application of flux to each lead/land interface of the targeted SMD to be removed. (Note: For graphic contrast, a white foam swab is shown at left).
Select LOWMELT®. Take a single strand of certified
LOWMELT® DeSolder wire from out of its tube as shown in the right photo. (Note: Only use certified Zephyrtronics alloy.)
Step 3B
Step 3C
Apply LOWMELT®.Using economy and in a random manner, melt
LOWMELT® into existing joints of the SMD only as each lead requires. Co-metalization begins.
Because no two PCB's are the same and some joints will always have more solder than others, some leads will need more
LOWMELT®. Typically (not always), an SMD's four corners need a bit more.
Step 4
Step
5A
Lift and Remove SMD. Using a soft suction lifting device such as the ZT-3-MIL AIRPICK, lift SMD up and off of the PCB. (Note: Use of the ESD safe ZT-3 guarantees no lifting of pads.)
Easy Clean Up.Dip Swab Into Flux. Maintaining pre-heating at 150°C, insert anti-static foam swab into flux as shown. (Recommended: the
SFL Anti-Static Swab and
a tack flux
NCF-0014 NoClean Flux).
Step
5B
Step
5C
Remove Excess Solder. Using fluxed swab, gently push residual solder into a single sphere and remove with solder sucker or push up onto a card. (For graphic contrast, white foam swab is shown at left.)
Repeat Step 5b. A good rule of thumb is to repeat the cleaning with a new, large
foam swab dipped again in the flux. This second flux swabbing
will polish your pads in preparation for new SMD placement
Step 6A
Step
6B
Cool Down & Final Cleaning. Flip rocker switch of
ZT-1 AirBath to "Cool" mode to cool down PCB. Insert large anti-static foam swab into flux remover. (Recommended:
A Non-Flammable Flux Remover NFR-0056.)
Swab PCB with Flux Remover. As PCB cools under
ZT-1 AirBath, swab area where SMD was removed with Flux Remover as shown.
Step 7
Video
Demonstration: SMD Removal & LowMelt®
Inspect. Inspect your substrate and pads. Turn off
ZT-1 AirBath. Note: the entire removal process was with non-contact warm air below 150°C.
Now that you have successfully removed your SMT component, it's just as easy to place and solder a new one back onto the pads. For SMD placement and soldering, please be sure to see our full color, step-by-step Process Guide at "SMD Soldering As It Should Be".
Click to learn more about the history and benefits of the popular Zephyrtronics
LowMelt® DeSolder.
Please note: Zephyrtronics has packaged all of the above described chemicals, anti-static swabs,
LowMelt®DeSolder and more in our
LMK Benchtop Kits...our BluePrint for the Bench™
The Amazing
LowMelt®DeSolder is available right now in our convenient storage/shipping tubes (shown at right) in either of the two following popular quantities (Each shipment includes a Certificate of Metallurgical Compliance from the Zephyrtronics Quality Group and MSDS).
LOWMELT®
DE-SOLDER WIRE
DESCRIPTION
ITEM
PRICE
BUY NOW
Classic,
Traditional
LowMelt®
De-Solder Wire
With Lead
LMS-0137 LOWMELT® DE-SOLDER WIRE ( 137cm / 4.5 ft )
$29.95
LMS-0243 LOWMELT® DE-SOLDER WIRE ( 243cm / 8 ft
)
$39.95
LMS-0487 LOWMELT® DE-SOLDER WIRE
(
487cm / 16 ft )
$74.45
LMS-0975 LOWMELT® DE-SOLDER WIRE (
975cm / 32 ft )
