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TEL: 909-865-2595
FAX: 909-865-4998
david@zeph.com |
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Welcome to
Zephyrtronics! The World's First Low Temp Approach
to the Electronic Benchtop. |
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SMD SOLDERING AS IT SHOULD BE |
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Production-Quality Solder Joints Complete with Fillets at the Bench!
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Here’s How Simple High-Quality SMD Soldering Can Be...
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All Zephyrtronics Equipment is Designed, Engineered,
and Manufactured in the United States of America
1994
The "early days" of the company as David Jacks &
Randy Walston lay ground work, engineer, R&D, test &
evaluate & apply for patents on their new, milestone
low temp approach to benchtop soldering & rework.
1995
The Company introduces world’s first stand-alone,
bottom-side preheating system, The AirBath™.
1996
Zephyrtronics awarded the "Vision Award" for Best
New Product of the Year at the Surface Mount Int'l
Expo in Silicon Valley.
1997
SMT Magazine's editorial staff calls Zephyrtronics
one of the three most innovative companies
that year.
1998
U.S. Department of Defense selects Zephyrtronics as
supplier. Boeing tests & approves Zephyrtronics
AirBath™
& DeSolder for
SMD removal
1999
Raytheon recommends Zephyrtronics in written
report. National Semiconductor recommends
Zephyrtronics in published paper for
BGA rework
2000
Zephyrtronics continues
3-year string as fastest growing soldering
equipment manufacturer in the U.S.A. Also:
Introduction of dispensing
product line.
2001
Zephyrtronics saves Raytheon
$1 Million in rework scrap after Six Sigma Study.
2002
Our ZT-7-MIL is selected by The J.P.L. Mars Rover
Project for BGA tasks.
2003
International Rectifier recommends
Zephyrtronics for BGA rework.
2004
After smashing success of the Mars Rovers, NASA
issues 39-page touting Zephyrtronics for making
"mounting & removal of thru-hole and SMT/BGA easier
than routine bench methods"
2005
Zephyrtronics expands its leadership in preheating
with our
MegaGrid™
AirBath.
2006
Introduction of ZeroLead® branded lead-free solder
paste and ZeroLead® LowMelt® DeSolder Wire.
both are RoHS Compliant.
2007
Zephyrtronics launches
e-commerce site for the convenience of
our customers
all over the world. |
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Apply Bead of Solder Paste.
With the appropriate gage of
paste application tip (See
Selection Chart Below),
apply a continuous bead of
solder paste down the middle
of the pads (Recommended:
Zephpaste SPE-0012) as
shown here.
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Pick and Place Chip. Using an
ESD safe, and soft vacuum lifting device
such as the
ZT-3-MIL AIRPICK, lift and gently
place the selected SMD on top of the
bead of paste above the corresponding
pads. |
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Adjust Alignment if Needed. After
placing SMD, check so all leads and pads are
aligned. "Fine tune" with a stainless steel
SMD/Dental Probe as shown. Recommended (SMT
Probes SDP-1111).
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Always Preheat.
First, switch on the
ZT-1 AIRBATH to "Warm"
at recommended setting of
150°C. How long? The process
itself will tell you. When
bead of solder paste runs
(30-60 sec), flux has
activated and the PCB is
preheated.
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Using a Low Velocity Hot Air
Pencil with precision,
pin-pointed AirPencil, apply
heated airstream to shoulders of
the SMD's leads (not the pads).
Allow time so that all solder
wicks up creating shiny joints
with fillets one joint at a
time. Inspect.
(Recommended:
ZT-2-MIL AirPencil.) |
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Cool Down & Final Cleaning.
Flip rocker switch of
ZT-1 AirBath to "Cool" mode to cool
down PCB. Insert large anti-static foam
swab into flux remover. (Recommended:
Non-Flammable Flux Remover). |
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Step 8. |
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Swab PCB with Flux Remover.
As PCB cools under
ZT-1 AirBath, swab area
where SMD was placed and
reflowed to the pads with Flux
Remover as shown. Turn off
AirBath. Inspect. (For graphic
contrast, a white foam swab is
shown at left.). |
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Inferior Soldering Iron with Solder Wire
Vs
Superior Hot
Air Soldering & Solder Paste
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Above: An inferior "tack" solder joint made with the traditional,
contact soldering iron and solder wire. At best, only a tangential joint is achieved at the lead/pad interface. Such inferior joints are no more acceptable from the bench than they
are from a conveyor oven or wave solder machine. |
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Above: A superior solder joint for SMD's. Here's how:
A bead of solder paste is applied to the pads, followed by placement of the SMD onto the pad and seated into the paste.
Next, a brief preheating of the bottom side of the PCB is made.After 30-60 seconds, flux activation begins (solder bead begins to visibly level).
A localized, pin-pointed reflow of solder paste is made at each individual lead/pad interface with a low velocity hot air pencil. Solder wets and wicks up to the lead's toes, heels and sides with production quality fillets.
It's elementary: A solder joint made at the bench with the same materials and processes used in premium production conveyor ovens will be the same.
This only requires the following:
a) solder paste (not wire)
b) convective preheating prior to
reflow
c) convective reflow (hot air pencil)
not messy contact (soldering iron)
For a more in depth look at SMD soldering, please refer to
"Making High Quality Solder Joints at the Bench". |
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Zephyrtronics
Popular
No Clean
Solder Paste
6 Month Shelf
No Refrigeration
Available in
UnLeaded & Leaded Alloys!
Click Photo |
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Notes:
The above example is made with a "gull winged " SOIC
20. This same method works equally well with the "J"
leaded PLCC's. For finer pitched components, such as
the popular QFP 100 and the QFP 208, a slight
variation in technique is easily made with equally,
if not even more effective results (call
Zephyrtronics for details...we can't teach our
competitors all of our tricks).
For SMD
Component Removal, please be sure to see LowMelt®
Process of Co-Metalization and Rapid SMD Removal in
Less Than 180 Seconds and learn more about the
history and benefits of the popular Zephyrtronics
LowMelt DeSolder®.
Please note: Zephyrtronics has conveniently packaged
all of the above described chemicals, Zephpaste
Solder Paste, Anti-Static Swabs, SMT/Dental Probes,
LowMelt®
DeSolder and more in the
LMK-1000 SMD Benchtop Kit our Blueprint for the
Bench™, or best of all, please visit our
"Systems Section" in this Website where our more
popular, comprehensive benchtop systems are
graphically presented. |
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©1996 - 2007 Zephyrtronics®. All rights reserved. The information you receive online from Zephyrtronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners. |
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BACK TO THE TOP OF THE PAGE |
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SMD Rework,
SMT Rework
AirBath Air Bath,
SMD Rework Stations,
Hot
Air Pencil Soldering,
BGA
Rework Stations,
CSP
Rework Stations,
Preheating Systems,
PCB Preheaters,
Pre-Heat SMT/ SMD,
Low Temp Rework,
SMT DeSoldering Tools,
Vacuum Pickup Tools,
Circuit Board Holders,
PCB Fixtures,
Board Cradles,
Rework Solder Paste,
No-Clean Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental Probes,
SMT, SMD Rework Kit,
BGA Rework Kit,
LMK Kit,
BGA Re-Balling Kit,
SMD Tweezers,
Power Palm Plunger
How To - SMT, CSP, BGA
Rework
How To - BGA Alignment;
How To - SMT Rework;
How To
- PCB Preheating,
How To
- BGA & CSP Rework;
How To
- Quickly Solder SMD Packages Effectively;
How To - CSP Alignment;
How To - Lead-Free Rework;
How To - SMD Removal Economical;
How To - SMD Removal Professional;
How To - Hot Air Pencil / AirPencil Soldering;
How To - SMD Quick Chip Removal;
How To - BGA Re-Balling;
How To - Rework PLCC, QFP, QFN, LCC, SOIC, SOL, Shielded SMD, TSOP;
How To - Solder & Rework Ceramic Capacitors;
How To - Solder & Rework Glass Diodes
Soldering,
De-Soldering
Soldering Accessories,
Solder Wire,
No-Clean Solder Wire,
Eutectic Solder Wire,
Solder Wire Dispenser,
Solder Paste,
Lead-Free Solder Paste,
Flux,
Solder Paste Dispensers,
Low
Melt®
DeSolder Wire,
De-Solder Wire,
Soldering Irons,
Digital Soldering Station,
MIL-Spec Soldering Station,
ESD Soldering Station,
Soldering Tips,
Thru-Hole DeSoldering Tools,
DeSoldering Tips,
Tips for DeSoldering,
De-Solder Wick,
Smoke Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-heating Systems,
Preheat Thru-Hole,
PCB Pre-heaters,
Flux Solvent,
How To - Connector Rework;
How To - PC/104 Soldering and Rework;
How To - Thru-Hole / Through Hole Desolder /
De-Solder;
How
To - Low Melt®
Desolder Wire;
How To- Stop Lifting Pads;
How To- Desolder / De-Solder Heavy Ground
Planes;
How To - Lead-Free Soldering and De-Soldering;
Pre-Heaters for
Lead-Free Rework and Soldering
Dispensing
Dispensing Systems,
Dispensing Syringes,
Dispensing Barrels,
Tapered Dispensing Tips,
Blunt Needles,
Stainless Steel Needles,
Dispensing Needles,
Industrial Needles,
Dispensing Tips,
Dispensing Accessories,
Solder Paste in Syringe,
Paste Rack Solder Paste Holder™,
Dispensing Supplies,
Power Palm Plunger,
Manual Dispensing,
Automatic Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder Paste,
Solder Wire,
LowMelt®,
No-Clean Flux,
BGA Flux,
Rework Tack Flux,
Non-Flammable Flux Remover,
Inspection Equipment,
Magnification Equipment,
Magnifying Worklight,
ESD Magnifier,Pen
Vac,
SMT Tweezers,
Fume Extraction,
SMD Tweezers,
PC Board Fixtures,
Hot Air Tips,
AirTips,
Replacement Soldering Sponges,
Iron Plated Soldering Tips,
Foam Swabs,
Anti-Static Foam Swabs,
Thru-Hole Brushes,
LMK Rework Kits,
X-BOX 360 Repair |
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