xbox rework, repair, x-box gpu, cpu, bga soldering & desoldering

XBox 360 Repair Hot Air Nozzles XBox PCB Rework Rework Nozzles BGA, CSP, SMD, CSP, QFN Nozzles

XBOX 360 REPAIR KIT & SUPPLIES

For All Zephyrtronics ZT-7 Hot Air Systems

Zephyrtronics Equipment is Engineered and Manufactured in the United States of America.

Soldering and De-Soldering the GPU, CPU & the Samsung "Memory Chip" & More!

The ZLK-XBox Rework Kit Includes:
Four Hot Air Nozzles for the Microsoft® & Samsung® Memory Chips and the GPU & CPU Chips,
Plus Helpful Ball to Pad Interface Tapes to Position the Chip to the PCB pads, Lead-Free LowMelt® DeSolder Wire, No Clean Flux, Non-Flammable Flux Remover, Swabs & more

Here's your ZLK-XBOX PCB Rework & Repair Kit which comes included at no extra charge with our ZT-7-XBOX Comprehensive Hot Air Bench Top Reflow System.

The ZLK-XBOX PCB Rework Kit is packed with the essentials you need for reworking the X-Box 360 PCB's. Each kit includes the fundamental small bench top tools, high quality cleaning and preparation materials, including our popular premium ZeroLead® LowMelt® Desolder wire, along with the four most critical hot air reflow nozzles for your ZT-7-XBOX Comprehensive Hot Air Bench Top Reflow System and more all into a convenient, durable and space saving storage case.

And in this very helpful kit you will also find and assortment of foam swabs, alignment probes, no-clean flux, non-flammable flux remover and much, much more!! The chart below provides the itemized contents of the kit that also includes our popular ball-to-pad interface tapes to position the new chips back to the exact location before soldering! Look at what all you get!

The ZLK-XBOX KIT AND ITS CONTENTS

DESCRIPTION
Click on Photos For More Details of Each Specific Product

Price
If Purchased
Separately

KIT PRICE
& CONTENTS
INCLUDED

DURABLE PLASTIC STORAGE
CASE PACKED WITH ALL OF THE ITEMS BELOW!

$1,168.62
(If Purchased Individually)

Only
$795.00

RoHS COMPLIANT LEAD-FREE ZEROLEAD® LOWMELT® DESOLDER WIRE

975 cm/ 16 ft in Tube

$169.95

YES
Included In Kit

XBox 360, Repair, Hot Air, Nozzle, GPU, Chip

ZT-7-3007 Precision Hot Air Nozzle
for the ZT-7-XBOX Reflow System
for X-Box 360 GPU Component
(35mm x 35mm BGA Nozzle)

$149.00

YES
Included

XBox 360, Repair, Hot Air, Nozzle, CPU, Chip

ZT-7-3021 Precision Hot Air Nozzle
for the ZT-7-XBOX Reflow System
for X-Box 360 CPU Component
(31mm x 31mm BGA Nozzle)

$149.00

YES
Included

XBox 360, Repair, Hot Air, Nozzle, Memory, Chip

ZT-7-005 Precision Hot Air Nozzle
for the ZT-7-XBOX Reflow System
for X-Box 360 Microsoft® Memory Chip
(23mm x 23mm BGA Nozzle)

$149.00

YES
Included

ZT-7-3082 Precision Hot Air Nozzle
for the ZT-7-XBOX Reflow System
for X-Box 360 Samsung® Memory Chip
(11mm x 14mm BGA Nozzle

$149.00

YES
Included

Pad-to-Ball Interface Tape: Double-Sided Adhesive for Positioning Ball Grid Arrays to the PCB's Pads. Kit Includes the Interface Tapes for 4 of the X-Box 360's BGA's (GPU, CPU, Microsoft® Memory Chip, and the Samsung® Memory Chip. Quick and Easy to Use!

ZT-8-001
35mm x 35mm BGA

$14

YES
Included

ZT-8-002
31mm x 31mm BGA

$14

ZT-8-003
23mm x 23mm BGA

$14

ZT-8-004
11mm x 14mm BGA

$14