All Zephyrtronics Equipment is Designed, Engineered, and Manufactured in the United States of America.

1994
The "early days" of the company as David Jacks & Randy Walston lay ground work, engineer, R&D, test & evaluate & apply for patents on their new, milestone low temp approach to benchtop soldering & rework.

1995
The Company introduces world’s first stand-alone, bottom-side preheating system, The AirBath™. 

1996
Zephyrtronics awarded the "Vision Award" for Best New Product of the Year at the Surface Mount Int'l Expo in Silicon Valley.

1997
SMT Magazine's editorial staff calls Zephyrtronics one of the three most innovative companies  that year. Boeing chooses our AirBaths for the International Space Station Project.

1998
 U.S. Department of Defense selects Zephyrtronics as supplier. Boeing tests & approves Zephyrtronics AirBath™
& DeSolder for
SMD removal

1999
Raytheon recommends Zephyrtronics in written report. National Semiconductor recommends  Zephyrtronics
in published paper for
BGA rework

2000
Zephyrtronics continues
 3-year string as fastest growing soldering equipment manufacturer in the U.S.A. Also: Introduction of     dispensing product line.

2001
  Zephyrtronics saves Raytheon $1 Million in rework scrap after Six Sigma Study.

2002
Our ZT-7-MIL is selected by The J.P.L. Mars Rover Project for BGA tasks.

2003
 International Rectifier recommends
 Zephyrtronics
for BGA rework.

2004
After smashing success of the Mars Rovers, NASA issues 39-page touting Zephyrtronics for making "mounting & removal of thru-hole and SMT/BGA easier than routine bench methods"

2005
 Zephyrtronics expands its leadership in preheating
 with our
MegaGrid™ AirBath.

2006
 Introduction of ZeroLead® branded lead-free solder paste and ZeroLead® LowMelt® DeSolder Wire.  both are RoHS Compliant.

2007
Zephyrtronics launches
 e-commerce site for the convenience of
our customers
all over the world.

 

XBOX REWORK & REPAIR KIT
Soldering and De-Soldering the GPU, CPU & the Samsung "Memory Chip"

Here's our ZLK-XBOX PCB Rework Kit which comes included at no extra charge with our ZT-7-XBOX Comprehensive Hot Air Bench Top Reflow System.

The ZLK-XBOX PCB Rework Kit is packed with the essentials you need for reworking the X-Box 360 PCB's. Each kit includes the fundamental small bench top tools, high quality cleaning and preparation materials, including our popular premium ZeroLead® LowMelt® Desolder wire, along with the four most critical hot air reflow nozzles for your ZT-7-XBOX Comprehensive Hot Air Bench Top Reflow System and more all into a convenient, durable and space saving storage case. In this very helpful kit you will also find and assortment of foam swabs, alignment probes, no-clean flux, non-flammable flux remover and much, much more!! The chart below provides the itemized contents of the kit that also includes our popular ball-to-pad interface tapes to position the new chips back to the exact location before soldering!

  

The ZLK-XBox Rework Kit Includes Four Hot Air Nozzles for the Microsoft® & Samsung® Memory Chips, the GPU & CPU Chips, Helpful Ball to Pad Interface Tapes to Position the Chip to the PCB pads, Lead-Free LowMelt® DeSolder Wire, No Clean Flux, Non-Flammable Flux Remover, Swabs & more

The ZLK-XBOX KIT AND ITS CONTENTS
DESCRIPTION

ZLK-XBOX

REWORK KIT
lmk-2000_small

DURABLE  PLASTIC STORAGE
CASE PACKED WITH ALL OF THE ITEMS BELOW!

YES

CLICK  ON PHOTO LINKS BELOW FOR MORE DETAILS OR TO ENLARGE PHOTO ON SPECIFIC PRODUCT

RoHS COMPLIANT LEAD-FREE ZEROLEAD® LOWMELT® DESOLDER WIRE

975 cm/ 16 ft in Tube

Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 GPU Component (35mm x 35mm BGA Nozzle)

Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 CPU Component (31mm x 31mm BGA Nozzle)


Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 Microsoft® Memory Chip (23mm x 23mm BGA Nozzle)

Included

Hot Air Nozzle for the ZT-7-XBOX Reflow System for X-Box 360 Samsung® Memory Chip (11mm x 14mm BGA Nozzle

Included

Pad-to-Ball Interface Tape: Double-Sided Adhesive for Positioning Ball Grid Arrays to the PCB's Pads. Kit Includes the Interface Tapes for 4 of the X-Box 360's BGA's (GPU, CPU, Microsoft® Memory Chip, and the Samsung® Memory Chip. Quick and Easy to Use!

Included
flux_remover_small

NON-FLAMMABLE FLUX
REMOVER
 2 OZ. BOTTLE

Included
bga_flux_small

BGA  FLUX - RMA SERIES
 2 OZ.  BOTTLE

Included
tweez1_SMALL

STAINLESS  STEEL SMT PROBES
 (SET OF 4 DENTAL STYLE)

Included
SWABS_203

ANTI-STATIC  FOAM SWABS
 (20 LARGE & 10 SMALL ESD SAFE.  20 ECONO WHITE)

Included
VARIETY PACK OF DISPENSING NEEDLES
 (15 HALF-INCH AND 15 ONE-INCH BLUNT STAINLESS STEEL NEEDLES.  6 TAPERED TIPS AND 1 HUB CAP)		 Included
WICK_SMALL

DESOLDERING  BRAID / WICK, Qty of 2
 (152 cm / 5 ft)

Included
Loupe_small

INSPECTION / JEWELER’S LOOP
 (10X MAGNIFICATION IN
21mm LENS, CHROME PLATED)

Included
magnifyer_small

SMT TWEEZERS WITH
ADJUSTABLE MAGNIFIER
(4X MAGNIFIER LENS, STAINLESS
STEEL TWEEZERS)

Included
brushes_small_copy

THRU-HOLE  BRUSHES
 (10  BRUSHES)

Included
sucker_small

DESOLDERING  PUMP /
SOLDER SUCKER

Included
zt7_stuff_small

BGA TRAINING PRACTICE TEST BOARD & CHIPS.

Included

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©1996 - 2008 Zephyrtronics®. All rights reserved. The information you receive online from Zephyrtronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners.

CLICK HERE to go directly to our easy-to-navigate and illustrated Product Directory.

SMD Rework, SMT Rework
AirBath Air Bath, SMD Rework Stations, Hot Air Pencil Soldering, BGA Rework Stations, CSP Rework Stations, Preheating Systems, PCB Preheaters, Pre-Heat SMT/ SMD, Low Temp Rework, SMT DeSoldering Tools, Vacuum Pickup Tools, Circuit Board Holders, PCB Fixtures, Board Cradles, Rework Solder Paste, No-Clean Solder Paste, Low Melt® De-Solder Wire, DeSolder Wire, Hot Air Rework Stations, Fume Extractors, SMT Dental Probes, SMT, SMD Rework Kit, BGA Rework Kit, LMK Kit, BGA Re-Balling Kit, SMD Tweezers, Power Palm Plunger

How To - SMT, CSP, BGA Rework
 How To - BGA Alignment; How To - SMT Rework; How To - PCB Preheating, How To - BGA & CSP Rework; How To - Quickly Solder SMD Packages Effectively; How To - CSP Alignment; How To - Lead-Free Rework; How To - SMD Removal Economical; How To - SMD Removal Professional; How To - Hot Air Pencil / AirPencil Soldering; How To - SMD Quick Chip Removal; How To - BGA Re-Balling; How To - Rework PLCC, QFP, QFN, LCC, SOIC, SOL, Shielded SMD, TSOP; How To - Solder & Rework Ceramic Capacitors; How To - Solder & Rework Glass Diodes

Soldering, De-Soldering
 Soldering Accessories, Solder Wire, No-Clean Solder Wire, Eutectic Solder Wire, Solder Wire Dispenser, Solder Paste, Lead-Free Solder Paste, Flux, Solder Paste Dispensers, Low Melt® DeSolder Wire, De-Solder Wire, Soldering Irons, Digital Soldering Station, MIL-Spec Soldering Station, ESD Soldering Station, Soldering Tips, Thru-Hole DeSoldering Tools, DeSoldering Tips, Tips for DeSoldering, De-Solder Wick, Smoke Extractors, Fume Extractor Filters, Carbon Activated Filters, SolderMill™, Pre-heating Systems, Preheat Thru-Hole, PCB Pre-heaters, Flux Solvent, How To - Connector Rework; How To - PC/104 Soldering and Rework; How To - Thru-Hole / Through Hole Desolder / De-Solder; How To - Low Melt® Desolder Wire; How To- Stop Lifting Pads; How To- Desolder / De-Solder Heavy Ground Planes; How To - Lead-Free Soldering and De-Soldering; Pre-Heaters for Lead-Free Rework and Soldering

Dispensing
 Dispensing Systems, Dispensing Syringes, Dispensing Barrels, Tapered Dispensing Tips, Blunt Needles, Stainless Steel Needles, Dispensing Needles, Industrial Needles, Dispensing Tips, Dispensing Accessories, Solder Paste in Syringe, Paste Rack Solder Paste Holder™, Dispensing Supplies, Power Palm Plunger, Manual Dispensing, Automatic Dispensing

Benchtop Accessories, Bench Supplies, Benchtop Tools
SMD Solder Paste, Solder Wire, LowMelt®, No-Clean Flux, BGA Flux, Rework Tack Flux, Non-Flammable Flux Remover, Inspection Equipment, Magnification Equipment, Magnifying Worklight, ESD Magnifier,Pen Vac, SMT Tweezers, Fume Extraction, SMD Tweezers, PC Board Fixtures, Hot Air Tips, AirTips, Replacement Soldering Sponges, Iron Plated Soldering Tips, Foam Swabs, Anti-Static Foam Swabs, Thru-Hole Brushes, LMK Rework Kits, X-BOX 360 Repair