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Hot
Air Nozzles
Rework Nozzles
BGA, CSP, SMD, CSP, QFN Nozzles |
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SMD & QFN
HOT AIR
NOZZLES |
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For All Zephyrtronics ZT-7
Hot Air Systems |
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Below are the 13
most common Hot Air Nozzles used for Surface Mount
Components in prototyping PCB's, reworking and repair and in
low volume production runs. Please note that all of the
nozzle below are open box style which means that the package
and the leads heat simultaneously which is required for
QFN's and BGA's, but also helps provide lower reflow
temperatures even for SMD's such as QFP's, PLCC's, SOIC's,
LCC's, SOL's, SOJ's and the full range of SMT chips. And if
you can handle your own BGA alignment manually, then these
nozzles are superb even for your BGA, CSP and even Micro BGA
soldering and desoldering. |
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THE SMT NOZZLE CHART
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Your Chip Size
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Nozzle Opening Size
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Component Suggestion
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Zephyrtronics Part Number
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0.40” X 0.40” (11mm X 11mm)
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0.50” X 0.50” 12.7mm X 12.7mm
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PLCC 20, JEDI 20 TQFP 44, PLCC 18 Low Profile QFP 64,80
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ZT-7-4001
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0.49” X 0.49” (13mm X 13mm)
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0.60” X 0.60” 15.2mm X 15.2mm
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PLCC 28, FLAT PACK 16 TQFP 64
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ZT-7-4002
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0.54” X 0.54” (14mm X 14mm)
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0.67” X 0.67” 17mm X 17mm
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QFP 44, TQFP 80 CHERPACK 24
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ZT-7-4003
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0.69” X 0.69” (17mm X 17mm)
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0.80” X 0.80” 20.3mm X 20.3mm
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PLCC 44, JEDI 44 TQFP 500, UT QFP 52
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ZT-7-4005
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0.79” X 0.79” (20mm X 20mm)
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0.90” X 0.90” 23mm X 23mm
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PLCC 52 QFP 64, QFP 80, QFP 52
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ZT-7-4010
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0.99” X 0.99” (25mm X 25mm)
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1.10” X 1.10” 28mm X 28mm
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PLCC 68, TFQ 144
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ZT-7-4006
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1.07” X 1.07” (27mm X 27mm)
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1.20” X 1.20” 30.5mm X 30.5mm
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BQFP 132, QFP 132 TFQ 160, 176
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ZT-7-4011
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1.19” X 1.19” (30mm X 30mm)
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1.30” X 1.30” 33mm X 33mm
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PLCC 84, QFP 208
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ZT-7-4007
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1.22” X 1.22” (31mm X 31mm)
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1.33” X 1.33” 33.7mm X 33.7mm
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QFP 120, QFP 128 QFP 144, QFP 160
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ZT-7-4008
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0.70” X 0.95” (18mm X 24mm)
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0.79” X 1.10” 20mm X 26mm
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QFP 100, QFP 64 QFP 80
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ZT-7-4009
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0.43” X 0.51” (11mm X 13mm)
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0.51” X 0.61” 13mm X 15.5mm
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SOL 20, SOL 16J, SOL 18J, SOM 16, SOLIC 16, SILIC 20, SOIC 14, SO 14, TANT CAPS, D-PAK
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ZT-7-4012
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0.43” X 0.63” (11mm X 16mm)
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0.51” X 0.71” 13mm X 18mm
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SOL 28, TSSOP 8, SOIC 16, SOM 16, SOL 4, TANT CAPS
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ZT-7-4013
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0.47” X 0.75” (12mm X 19mm)
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0.57” X 0.82” 14.5mm X 21mm
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DUAL TSOP 24-28 DUAL TSOP 40-44
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ZT-7-4014
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All Zephyrtronics Nozzles feature our unique, world-first thin-wall construction permitting nozzle penetration into those densely packed PCB’s. All Zephyrtronics Nozzles are designed to work only with the
ZT-7-MIL BGA, CSP & SMT System.
Choose any of the above SMT Nozzles for our amazingly affordable price of only $99.00 each.
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A $292.00 SAVINGS! EQUIVALENT TO 3 (THREE) FREE NOZZLES: NEW! SPECIAL 13 SMT NOZZLE VALUE PACK
 Here’s the best deal going! Purchase our special Selection Pack of 13 popular SMT Nozzles for extra versatility so that you never need to search for that special nozzle again. One item number buys them all (ZT-7-SMTPK) for use with your
ZT-7-MIL BGA, CSP & SMT System.
If purchased individually: $1,287.00. Order ZT-7-SMTPK for
only $995.00.
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Back to the ZT-7 Main Page |
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©1996 - 2010 Zephyrtronics®. All rights reserved. The information you receive online from Zephyrtronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners. |
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SMD Rework,
SMT Rework
AirBath Air Bath,
SMD Rework Stations,
Hot
Air Pencil Soldering,
BGA
Rework Stations,
CSP
Rework Stations,
Preheating Systems,
PCB Preheaters,
Pre-Heat SMT/ SMD,
Low Temp Rework,
SMT DeSoldering Tools,
Vacuum Pickup Tools,
Circuit Board Holders,
PCB Fixtures,
Board Cradles,
Rework Solder Paste,
No-Clean Solder Paste,
Low Melt®
De-Solder Wire,
DeSolder Wire,
Hot Air
Rework Stations,
Fume
Extractors,
SMT Dental Probes,
SMT, SMD Rework Kit,
BGA Rework Kit,
LMK Kit,
BGA Re-Balling Kit,
SMD Tweezers,
Power Palm Plunger
How To - SMT, CSP, BGA
Rework
How To - BGA Alignment;
How To - SMT Rework;
How To
- PCB Preheating,
How To
- BGA & CSP Rework;
How To
- Quickly Solder SMD Packages Effectively;
How To - CSP Alignment;
How To - Lead-Free Rework;
How To - SMD Removal Economical;
How To - SMD Removal Professional;
How To - Hot Air Pencil / AirPencil Soldering;
How To - SMD Quick Chip Removal;
How To - BGA Re-Balling;
How To - Rework PLCC, QFP, QFN, LCC, SOIC, SOL, Shielded SMD, TSOP;
How To - Solder & Rework Ceramic Capacitors;
How To - Solder & Rework Glass Diodes
Soldering,
De-Soldering
Soldering Accessories,
Solder Wire,
No-Clean Solder Wire,
Eutectic Solder Wire,
Solder Wire Dispenser,
Solder Paste,
Flux,
Solder Paste Dispensers,
Low
Melt®
DeSolder Wire,
De-Solder Wire,
Soldering Irons,
Digital Soldering Station,
MIL-Spec Soldering Station,
ESD Soldering Station,
Soldering Tips,
Thru-Hole DeSoldering Tools,
DeSoldering Tips,
Tips for DeSoldering,
De-Solder Wick,
Smoke Extractors,
Fume
Extractor Filters,
Carbon
Activated Filters,
SolderMill™,
Pre-heating Systems,
Preheat Thru-Hole,
PCB Pre-heaters,
Flux Solvent,
How To - Connector Rework;
How To - PC/104 Soldering and Rework;
How To - Thru-Hole / Through Hole Desolder /
De-Solder;
How
To - Low Melt®
Desolder Wire;
How To- Stop Lifting Pads;
How To- Desolder / De-Solder Heavy Ground
Planes;
How To - Lead-Free Soldering and De-Soldering;
Pre-Heaters for
Lead-Free Rework and Soldering
Dispensing
Dispensing Systems,
Dispensing Syringes,
Dispensing Barrels,
Tapered Dispensing Tips,
Blunt Needles,
Stainless Steel Needles,
Dispensing Needles,
Industrial Needles,
Dispensing Tips,
Dispensing Accessories,
Solder Paste in Syringe,
Paste Rack Solder Paste Holder™,
Dispensing Supplies,
Power Palm Plunger,
Manual Dispensing,
Automatic Dispensing
Benchtop Accessories,
Bench Supplies,
Benchtop Tools
SMD Solder Paste,
Solder Wire,
LowMelt®,
No-Clean Flux,
BGA Flux,
Rework Tack Flux,
Non-Flammable Flux Remover,
Inspection Equipment,
Magnification Equipment,
Magnifying Worklight,
ESD Magnifier,Pen
Vac,
SMT Tweezers,
Fume Extraction,
SMD Tweezers,
PC Board Fixtures,
Hot Air Tips,
AirTips,
Replacement Soldering Sponges,
Iron Plated Soldering Tips,
Foam Swabs,
Anti-Static Foam Swabs,
Thru-Hole Brushes,
LMK Rework Kits,
X-BOX 360 Repair |
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