No One Knows More About Preheating PCB's Than
Zephyrtronics!
ZT-1
HIS PRE-HEATING AIRBATH™ SYSTEMS
Bottom-Side Convection PCB Pre-Heat: Thru-Hole, SMD,
SMT, QFN & BGA Rework & Repair. Our Heavy Industrial
Series!
Effective, Powerful 800 Watts
With 25 CFM AIR SUPPLY (710 Liters per Minute)
Zephyrtronics' AirBath “bathes the circuit board in warm
air to reduce thermal stresses
to the board and its components.”-- NASA Report, January
9, 2004
Internationally acclaimed, award-winning and patent-protected,
the
ZT-1-HIS
(Heavy Industrial) AirBath™
preheat systems are the effective solution
for preheating PCB's during low-volume prototyping
or in rework.
Two Models! Our
ZT-1-HISAirBaths™
are available in with either analog or digitalcontrol. Both
models have a powerful 25 CFM (710 Liters/Minute) of air
supply. With
our greater volume of air supply, you can pre-heat at far lower
temps than with other ineffective preheating devices
limited by low air volume outputs, which require higher
temps and that burn your boards. Not a
"preheating toy," this is a preheating tool.
800 Watts of Power:
Coupled with our ample air output is
our 800 Watts of preheating capacity. This is effective
preheating by design!
Chosen By Boeing
for the
International Space Station Project.
ZT-1-HIS HEAVY INDUSTRIAL AIRBATH PREHEATERS
DESCRIPTION
MODEL
BUY NOW
DIGITAL
AIRBATH
25 CFM
Air Power
(710 Liter/Min) 800 Watt Power
ZT-1-HIS-DPU-120
120 Volt for the U.S., Canada & Mexico
$1,395
ZT-1-HIS-DPU-230
230 Volt for
Our International
Customers
$1,395
ANALOG
AIRBATH
25 CFM
Air Power
(710 Liter/Min)
800 Watt Power
ZT-1-HIS-MIL-120
120 Volt for the U.S., Canada & Mexico
$999
* The
HIS Series is our mid-range capacity of preheaters
in our extensive
AirBath Preheater Product Line.
Nothing beats a Zephyrtronics AirBath at repairing
Smartphones, Tablets or Flat Screen televisions.
Quality, twenty years on the market and a 1 year
warranty (see details below).
Preheat Power:
Our
ZT-1-HIS AirBaths™
ample air supply
from the AirCone™ delivers its forced-convection preheat
power for even the most challenging PCB's.
Beware of imitative
pre-heaters with less than 13CFM (360 liters/minute) that
crudely attempt to compensate for wimpy air volume
through
higher temp settings.
Remember: the glass transition of a FR-4 PCB is only
170°C. You don't want higher preheat temps, you want
higher volume of safe preheat (100°C-170°C).
So
Many Features:
The AirBaths™get into a PCB's nooks and crannies where hot plates
and IR preheaters can't go (see videos below). Fabricated from steel, not plastic
for industrial use and long production life,
they
are RoHS Compliant, ESD-safe, exceed U.S.
Military Specs and uniquely feature indicator lights
(blue: cooling;
red: preheating).
All AirBaths™ have
internal air supply so you do not need
compressed air hook ups.
Thermal
Ramping: AllAirBaths™ have the
industry standard, temperature ramp of 2°-4°C per
second "built-in"
to prevent
thermal shock
to semiconductors, sensitive chips, ceramic caps and glass diodes.
Indeed, our integrated ramping was essential to Motorola®
and Boeing®
with their space applications. And they are essential for
high-quality smartphone, tablet, pc and flat screen
television soldering and desoldering repair.
ABC SERIES OF ADJUSTABLE BOARD CRADLES
DESCRIPTION
MODEL
BUY NOW
ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX)
ABC-1
$235
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX)
ABC-2
$275
ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX)
ABC-1-Q
$295
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX)
ABC-2-Q
$315
More
Details
For
Thru-Hole, SMT & BGA Preheating Tasks: TheHIS Series AirBath Preheating Systems
is ideal for all PCB challenges from low-volume production
runs, prototyping during design or during rework with all
SMD packages such as
BGA, CSP, QFP, QFN,
TSOP, PLCC, SOIC, SOL, LCC, Flip Chip and Glob Top
components. Still, the AirBath
is not limited to only SMD devices: Don't overlook the
superb benefit the
AirBath preheating boost brings to your
tough through-hole (PTH) soldering and de-soldering tasks!
Plus, it easily handles all substrates including FR-4,
polyimide, composites, flex circuits and ceramic boards.
The Many
Benefits of Preheating Your PCB:
The
benefits of preheat
are multiple and compounding. 1.) Preheating or
"soaking" the assembly before reflow activates the flux that
removes oxides and surface films thereby enhancing the
wetting process and solder joint quality. 2.) Preheat
permits lower soldering reflow temperatures. 3.) Preheat
reduces "dwell time" at the final reflow stage. 4.) Preheat
reduces thermal stresses to the PC substrate and components
if localized reflow is made with soldering irons,
de-soldering tools or hot air tools. 5.) Preheat gives a
thermal boost for RoHS lead-free solders without
damaging the work!
The HIS Series of AirBaths™
is
available in two models: Analog and Digital. Both models
feature variable temp selection from ambient up to 205°C and feature
closed-loop feedback temperature sensing control. The digital model
incorporates a digital set/read lighted display that permits single
digit/degree incremental temperature selection in the "set" mode and
tracks real time temperature at the air exit point above the grids.
Our Analog Model provides the two most common preheat settings:
100°C and 150°C.
Model ZT-1-HIS-DPU
Features
Digital Temp Display With Temp Set & Read
Functions
on Front Panel.
Model ZT-1-HIS-MIL
Features the 2 Most Common Preheat Temps:
100°C & 150°C By Rocker Switch.
Your Lead-Free Solution: Working with
lead-free, RoHS solder alloys --- all have higher
melting points --- makes preheat essential to PCB
work at a bench. Don't raise temperatures higher on your
soldering irons, desoldering tools, hot air tools or thermal
tweezers!
If you just briefly preheat the bottom of your PCB before
reflow, can perform your soldering or desoldering on the top
side of the board at traditional, lower temperatures.
The
RoHS Lead-Free Solder Mandate:
Learn more about the
European Lead-Free
Mandate & Preheating.
AirBath™ preheaters are your RoHS
solution and make lead-free soldering a breeze.
Utilities
& Applications
All Pre-Heaters Are Not Created Equally:
1. Achieve
High-End Superb Thermal
Profiles at the Bench with industry standard
2°-4°C ramp to preheat!
The ramp is
"built in" to every AirBath™ preventing thermal shock to
ceramic capacitors, glass diodes and temperature
sensitive chips. Ramping helps prevent "pop-corning"
moisture within I.C.'s. Preheat allows flux
activation and lower temps on the PCB's topside
with soldering tools. Effective preheat prevents
damaging substrates, pads and chips during rework
or prototyping.
2. New
Rework Paradigm:
Remove SMD's under 150°C (300°F) with just the AirBath™
and LowMelt®DeSolder
through co-metalization. No nozzles! No
lifting pads! No burning PCB's! Your
AirBath™
puts this nifty rework option at your fingertips.
Video: SMD Removal With LowMelt®.
3.
Non-Contact Hot Air Soldering:AirBath™
preheat permits use of solder "paste" -- as well as
solder wire with only a
Hot AirPencil.
100% non-contact (NASA calls it "non-touch")
method of soldering at the bench. See it done here:
Video: How To Solder SMD's With Solder
Paste.
4. Thru-Hole
Rework:
Heavy ground planes? High copper content, heat sinks? An
AirBath™ makes desoldering thru-hole chips
so easy. Solder comes up like butter even with lower temps on your desoldering tools.
No
lifting pads. You'll
never de-solder thru-hole without preheat again.
5. Heat Shrink Tubing: Where heat guns burn and tear
insulation or shrink tubing, the
AirBath™
is temp controlled. Try it. It's fantastic!
6. BGA,
QFN Soldering & DeSoldering. The AirBath™ is
stand-alone, yet also a modular part of the comprehensive ZT-7BGA
Hot
Air System.
The AirBath™
is essential for BGA processing:
industry standard ramp rate; "post-cooling" rapid
cool-down (critical for BGA work); and 25CFM (710
Liters/Minute)
of preheat
power permitting lower soldering temps. See BGA rework:
Video: BGA & SMD De-Soldering in 3
Minutes.
Remove Chip Quickly Below 150°C with AirBath™ &
LOWMELT®
"Never Lift A Pad"
Preheating at the Bench Duplicates the
Quality
Thermal
Profiles of
High Volume Production
Thru-Hole Desoldering
Is Easier & At Lower Temps With AirBath™ Preheat. Heavy
Ground Planes? No Problem!
100% Non Contact SMT Hot Air Soldering With the AirBath™
&
a
Hot AirPencil™.
Highest Quality Joints.
AirBath™
Preheat
Compliments the ZT-7-MIL
SMD/BGA
Station Perfectly.
Ideal
For Heat Shrink Tubing Applications.
Superior To Non-Regulated Heat Guns!
Comparing The 4
Methods of Preheating
Preheating PC Boards falls into four categories:
hot plates, ovens, IR systems and
forced convection (warm air).
The short video at the right compares all four
methods.
While any preheat of your PCB prior to solder reflow is
better than none, an objective analysis of the
various methods of preheating reveals that
all preheating methods are not equally effective or
beneficial:
1.) The Oven:Using ovens to pre-heat a PCB before
rework, soldering,
removing or replacing components can yield the
most uniform temperature profile as it warms the
board's top and bottom like high
volume conveyor ovens and
wave solder machines. It's just a wee bit problematic to
crawl inside an oven with your PCB to preheat while you
perform selective soldering or desoldering tasks on one
side of the board. Of course, one could preheat a PCB
within an oven, and then afterward, rush it back to your
bench, but it's hardly practical solution either.
3.)
The Hot Plate:
The obvious
limitation to the hot plate is that not all PCB
assemblies are single sided. In today's world of
hybrid and mixed technologies, the PCB that is
entirely flat or plane on one side is an exotic
and rare creature indeed. PC board
assemblies are never the same from one to
another. They can be populated with many
disparate devices such as heat-sinks,
connectors, relays, and transformers on on
both sides. These uneven surfaces on the PCB
present an indirect path of heat conduction from
hot plates to the board.
"Hot
air is more versatile than a hot plate due to
non-uniform parts on the bottom of the PC Board." Glen Dody, Motorola Lab National Journal of SMT, '96
4.) Superior AirBath™
Forced Convection Preheat™The PC board assembly market
has long spoken with regards to the
distinct advantages and superiority of a
warm air
bath in the pre-heating
process. It is why most all high
reliability governmental and quality
commercial PCB production, design and
rework/repair groups stick to and with
forced convection preheating: it is
superior.
Forced convection completely disregards
the topography (or bottomography) of the
PCB, allowing immediate, direct access
of the warm air into all of the nooks
and crannies of the PCB assembly. And
much like the newer, popular forced
convection commercial ovens, the
circulating warmed air is far more
effective than static warm air.
And unlike IR "systems", there's
still one tremendous advantage
with forced convection systems:
temperature control is already "built-in", as with
Zephyrtonics AirBaths™. This is no small
distinction! Technicians do not have to
fumble with and try to tape
thermocouples on top of a PCB. Forced convection
preheaters provide temp control
either by dial or push button yielding accuracy,
repeatability saving time, hassle, scrap and
money.
Finally, forced convection preheaters can
multi-task for cooling down PCB's
after soldering which is critical to
solder joint integrity as the
next section explains.
2.)
The IR Preheater: There are
many drawbacks to infrared which is why it has
really never completely caught on. Some of
drawbacks (enumerated in articles and white
papers at electronic conventions) are the
difficulty in ramping temps (some are better
than others) and shadowing caused by high
profile devices on PCB's. If the IR preheat grid
is very large, it makes working on small PCB's
very uncomfortable for a technician (a very
common complaint).
Another quality disadvantage
of IR preheaters is they cannot ever truly be
"temperature controlled" without to taping an
external thermocouple onto each board before
working on it. This is a hassle and headache for
the technician and filled with quality pitfalls,
especially inconsistent results. There are more
drawbacks, but these are some of the worst. NASA & JPL: 'IR Preheaters Are Risky':
Addressing the preheating rework
process for heat sensitive chips in a
49-page published report, two JPL engineers, Dr.
Rajenshuni Ramesham and Dr. R. David Gerke,
wrote "Hot
plates and infrared preheaters are not
recommended for this type of rework. The
reason that they should not be used is that the
thermal reaction times, energy transfer rates
and efficiency are never consistent. However,
they can be used for large metal and
ground-plane boards in limited applications,
e.g., where the size of the board matches that
of the preheater in area."
Citing the late
William Scheu, the authors point to the
superiority of preheating by bottom-side forced
convection systems. The NASA Survey by JPL
spotlighted still more of the deficiencies of IR
preheating devices: "They have little
capacity to ramp and soak to perform properly
engineered repair scenarios or to support the
creation and application of complicated thermal
profiles. They also are limited in their ability
to preheat beyond the physical dimensions of the
heating surface. Hot-air preheating can be
ramped, soaked and, on some systems,
synchronized with the reflow process, permitting
duplication of the actual profile used in
manufacturing the assemblies. BGAs and
photoelectrical parts are sensitive to higher
temperatures and
any
attempt to preheat with marginally controllable
sources is risky."-- NASA & JPL: Survey
of Rework Methods & Equipment for Various
Packaging Technologies"
Aug.'05
Post-Cooling™ Feature Built Into The
AirBaths™
Post-Cooling™ Mode Cools Down BGA's After Reflow
Within 8 Seconds Allowing Quicker Lifting Hot
Air Nozzles Preventing Bridges
Another real advantage of the AirBath™ is that
with by flipping a switch the unit transforms
into a post-cooler™ cooling down your PCB,
components and your solder joints.
Post-Cooling™ is essential to soldering of BGA's
because hot air nozzles must not be lifted from
above the BGA until all the balled joints have
cooled so as not to cause unwanted bridging.
It's important to point out the obvious: hot
plates, static ovens and IR plates do not
provide the critical post-cooling™ feature
standard on every Zephyrtronics AirBath™. Again,
our engineers introduced the concept of
post-cooling™ to the benchtop clear back in
1994.
Our
AirBaths™ cool BGA's enough within only 8 second
permitting the hot air nozzle to be lifted
without fear of bridging. Without post-cooling™
a technician must wait for the ball/pad
interface to solidify completely before lifting
the nozzle to inspect. The PostCooling™ feature
remedies this problem allowing rapid lifting of
a hot air nozzle from the BGA after soldering.
The AirBaths™
Established
the Standard for PCB Preheating.
Our
AirBaths™
inspired a lot of cheesy imitations which are little more
than hair dryers in a box, but we're still the
pioneers who understand thermodynamics and preheat better
than anyone else. Our
AirBaths™
are the intelligent solution to stop burning up your PCB's by preventing thermal degradation,
thermal shock, lifted pads or traces, substrate
delamination, measling and warping.
It is
no wonder for nearly twenty years, these Zephyrtronics
AirBaths™
have been the pre-heater of choice by most major
aerospace and semiconductor manufacturers. It truly is the one
single tool that belongs on every bench. This is the
"Science of Zephyrtronics." We have an
AirBath™
for you.
TECHNICAL DATA & SPECS
Models: ZT-1-HIS-DPU-120
120 VAC (US, Canada & Mexico)
Digital Model ZT-1-HIS-DPU-230
230 VAC International Digital Model ZT-1-HIS-MIL-120
120 VAC (U.S., Canada & Mexico)
Analog
Model
Other: (All Models)
Power:800
Watts Electrical Construction: 3-Wire
Input with Earth Safety Ground W x H x D:12" x 4.5" x 7.2" (30 cm x 11 cm x
18 cm)
Weight:5.3 lbs (2.41 Kg) Air
Volume: 25CFM or 710 Liters/Minute Temperature Modes:
Preheating & Cooling from AirCone™ Preheat
Temp Range: Ambient (Room Temp) to 205°C (400°F) Preheat Ramp Rate:
2-4° C per second Cooling Temp:
Ambient
(Room Temp)
Temperature Stability:± 3°C
(± 5 °F) at Idle.
Absolute Temperature Stability:Meets
or Exceeds ANSI-J-STD
Air Supply: Self-Contained Internal Supply (No
Air Hookups)
Construction: All Metal ESD Safe
Construction
Warranty:
One Year Limited
Warranty Parts & Labor
Recommended: Use With ABC Series of Board Cradles
/ Fixtures
FEATURES & BENEFITS
The Preheating System Used By Boeing on Int'l Space Station
Prevents Thermal Shock of Components
Permits Lower Soldering & DeSoldering Reflow Temperatures
Ideal for the Heaviest PCB's & Lead-Free Applications
Helps Prevent Warping Substrates & Damaging Pads
Superior Forced Convection Preheating
800
Watts of Preheat Power
Powerful 25 CFM (710
Liters/Minute) Air Volume
Digital & Analog Models
Indicator Lights.
Red:
Preheat. Blue: Cooling
Analog Preheating Model: Dual Settings 100°C & 150°C
Digital Preheating Model: Variable from Room Temp to 205°C
Preheating Ramp Rate at Industry Standard 2°-4°C Per Second
Self-Contained (No Air Hook-Ups Required)
Small, Compact Construction Saves Benchtop Space
ESD Safe
One Year Limited Warranty Parts & Labor
Every Unit is Calibrated at Zephyrtronics' California
Factory
ZT-1-HIS HEAVY INDUSTRIAL
AIRBATH PREHEATERS
Description
Model
Price
Buy Now
DIGITAL
AIRBATH PREHEATING SYSTEM
25 CFM Air Power 800 Watt Power
ZT-1-HIS-DPU-120
120 Volt
for the U.S., Canada & Mexico
$1,395
ZT-1-HIS-DPU-230
230 Volt
For All
Int'l Customers
$1,395
ANALOG
AIRBATH PREHEATING SYSTEM
25 CFM Air Power 800 Watt Power
ZT-1-HIS-MIL-120
120 Volt
for the U.S., Canada & Mexico
$999
* We manufacture
many other sizes of
AirBaths. Note that
the HIS Series is our
mid-range capacity of
pre-heaters
within our extensive
AirBath Catalog.
We have an AirBath Preheater
tailored to your company's
PCB needs.
ABC SERIES OF ADJUSTABLE
BOARD CRADLES
Description
Model
Price
Buy Now
ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX)
ABC-1
$235
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX)
ABC-2
$275
ADJUSTABLE
BOARD CRADLE
QUATRO (10” X 18” MAX)
ABC-1-Q
$295
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX)
ABC-2-Q
$315
OPTIONAL ACCESSORIES
Description
Model
Price
Buy Now
EXTRA/REPLACEMENT
POSTS
(SET
OF
4)
2-POST
AND
8-POST
POSITIONING
(8
Posts
Allow
PCB
&
ABC
to
Be
Flipped
Up &
Down
For
Thru-Hole
De-Soldering)