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SMD & SMT Rework Pre-heater        Bottom-Side Pre-heating       Ramping & Preheating for Soldering & De-Soldering

OUR HEAVY INDUSTRIAL PRE-HEATING SERIES

 ZT-1 HIS PRE-HEATING AIRBATHS
Effective, Bottom-Side Convection Pre-Heating for PCB, Thru-Hole, SMD, SMT, QFN & BGA Rework & Repair

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 Securely
 On-Line.

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 Securely
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Powerful 800 Watts With  Ample 25 CFM AIR SUPPLY (710 Liters per Minute)


All Zephyrtronics Equipment is Designed, Engineered, and Manufactured in the United States of America.

1994
The "early days" of the company as David Jacks & Randy Walston lay ground work, engineer, R&D, test & evaluate & apply for patents on their new, milestone low temp approach to benchtop soldering & rework.

1995
The Company introduces world’s first stand-alone, bottom-side preheating system, The AirBath™. 

1996
Zephyrtronics awarded the "Vision Award" for Best New Product of the Year at the SMTA Int'l Expo in Silicon Valley.

1997
SMT Magazine's editorial staff calls Zephyrtronics one of the three most innovative companies  that year. Boeing chooses our AirBaths for the International Space Station Project.

1998
 U.S. Department of Defense selects Zephyrtronics as supplier. Boeing tests
& approves Zephyrtronics AirBath™ & DeSolder for
SMD removal

1999
Raytheon recommends Zephyrtronics in written report. National Semiconductor recommends  Zephyrtronics
in published paper for
BGA rework

2000
Zephyrtronics continues
 3-year string as fastest growing soldering equipment manufacturer in the U.S.A. Also: Introduction of     dispensing product line.

2001
  Zephyrtronics saves Raytheon
$1 Million in rework scrap after Six Sigma Study.

2002
Our ZT-7-MIL is selected by The J.P.L. Mars Rover Project for BGA tasks.

2003
 International Rectifier recommends
Zephyrtronics
for BGA rework.

2004
After smashing success of the Mars Rovers, NASA issues 39-page touting Zephyrtronics for making "mounting & removal of thru-hole and SMT/BGA easier than routine bench methods"

2005
Zephyrtronics expands its leadership in preheating
 with our
MegaGrid
™ AirBath.

2006
Introduction of ZeroLead® branded lead-free solder paste and ZeroLead® LowMelt® DeSolder Wire.  Both are RoHS Compliant.

2007
Zephyrtronics launches
 e-commerce site for the convenience of
our customers
all over the world.


1996 "Vision Award" Awarded to Zephyrtronics in Recognition of Its Breakthrough
"AirBath Device"
 for Preheating at
 the Benchtop



The Zephyrtronics
 AirBath is Featured
in Ray Prasad's
 Definitive Text
"Surface Mount Technology"


"Innovative...simpler, safer way to remove and repair sensitive devices" The Editorial Staff, SMT MAGAZINE


The Zephyrtronics' AirBath “bathes the circuit board in warm air to reduce thermal stresses to the board and components.”-- NASA Report Jan '04

 

The Zephyrtronics' AirBath “bathes the circuit board in warm air to reduce thermal stresses to the board and its components.”-- NASA Report, January 9, 2004

   
zt-1-his-dpu-large

Here are our award winning and patent protected ZT-1-HIS (Heavy Industrial) AirBath Pre-heating Systems, your  effective solution for pre-heating PCB assemblies during low-volume or prototyping tasks, and in rework and repair.

Two Models: Digital & Analog!  Our ZT-1-HIS AirBaths™ are available in two popular models: Digital and Analog. Both models feature a powerful 25 CFM (710 Liters/Minute) of air supply. And because of our greater volume of air supply, you can pre-heat at far lower temps than with other ineffective preheating devices limited by their low air volume outputs and which require higher temps and which will burn your boards. Not an imitative, "preheating toy", this is your preheating tool.

800 Watts of Power: Coupled with our ample air output is our 800 Watts of preheating capacity. This is effective preheating by design!

The ZT-1-HIS AirBath Chosen By Boeing for the International Space Station Project.

More Details:

Preheat Power: Our ZT-1-HIS AirBath Systems, with a generous and powerful 25 CFM (710 Liters/Minute) of air supply from the AirCone™ delivers its forced-convection preheating power for even the most challenging PCB's. Beware of imitative pre-heaters with less than 13CFM (360 liters/minute) that crudely attempt to compensate for their lack of preheat air volume with higher temp settings. Remember: the glass transition of a FR-4 PCB is only 170°C. You don't want higher preheat temps, you want a higher volume of safe preheated (100°C to 170°C) air for your PCB's.

Loaded With Premium Features: The ZT-1-HIS AirBaths get into all the nooks and crannies of the PCB assembly where hot plates and IR pre-heaters can't go (more below).  It is ESD-safe; features illuminated indicator lights (blue: cooling; red: preheating); it is self-contained with an internal air supply (no hookups); all inside a  durable, steel housing for industrial use and long production life.

Critical Thermal Ramping: The ZT-1-HIS AirBaths™ have the industry standard, built-in temperature ramping at 2° to 4°C per second preventing thermal shock to sensitive chips, ceramic caps and glass diodes. The ramp is "built in" by design into every Zephyrtronics AirBath™ Preheating System. Our ramping was essential to Motorola® and Boeing with their space applications.

 

ZT-1-HIS HEAVY INDUSTRIAL AIRBATH PREHEATERS

DESCRIPTION

ITEM #

PRICE

BUY NOW

ZT-1-HIS-DPU_SMALL

 DIGITAL
AIRBATH

25 CFM Air Power
(710 Liter/Min)
800 Watt Power

 

ZT-1-HIS-DPU-120
120 Volt for the U.S., Canada & Mexico)

$1,395

ZT-1-HIS-DPU-230
230 Volt for Our
International Customers

$1395

ZT-1-HIS-MIL_SMALL_copy

 ANALOG
AIRBATH

 25 CFM Air Power
(710 Liter/Min)
800 Watt Power
 

ZT-1-HIS-MIL-120
120 Volt for the
 U.S., Canada & Mexico

$999

* We manufacture many other sizes of AirBaths.  Please note that the HIS Series are our mid-range capacity pre-heaters and you may want to check out our entire AirBath Catalog Directory where we are certain that we have an AirBath Preheater tailored to your company's PCB needs.

 

ABC SERIES OF ADJUSTABLE BOARD CRADLES

DESCRIPTION

ITEM #

PRICE

BUY NOW

cradle 2 small ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX)
ABC-1 $195
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX)
ABC-2 $235
cradle 1 small ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX)
ABC-1-Q $235
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX)
ABC-2-Q $275


The Many Benefits of Preheating Your PCB: The benefits from preheating are multiple and compounding. 1.) Preheating or "soaking" the assembly prior to initiating reflow helps to activate the flux, removing oxides and surface films from the leads and pads to be soldered, thereby enhancing the wetting process and solder joint quality.  2.) Preheating the board permits lower soldering reflow temperatures.  3.) Preheating reduces the final "dwell time" during the final reflow stage.  4.) Preheating reduces thermal stresses to the PCB substrate and its components when localized reflow is made with soldering irons, de-soldering tools and hot air systems. 5.) Preheating provides the thermal boost needed when working with RoHS lead-free solders without damaging the work!

For Thru-Hole, SMT & BGA Preheating Tasks:
The
HIS Series AirBath Preheating Systems is ideal for all PCB challenges from low-volume production runs, prototyping during design or during rework with all component packages such as BGA, CSP, QFP, QFN, TSOP, PLCC, SOIC, SOL, LCC, Flip Chip and Glob Top components. And it easily handles all substrates including FR-4, polyimide, composites, flex circuits and ceramic boards.


Two AirBath™ HIS Models: 
Our
HIS Series of AirBaths are available in two models: Analog and Digital. Both models feature variable temperature selection between ambient (room temp) and up to 205°C. Both models feature closed-loop feedback temperature sensing control. The analog model has a dial for temp selection on the front panel. The digital model incorporates a digital set/read lighted display that permits single digit/degree incremental temperature selection in the "set" mode and tracks real time temperature at the air exit point above the grids. Our Analog Model provides the two most common preheat settings: 100°C and 150°C.

Model ZT-1-HIS-DPU Features Digital  Temp Display With Temp Set
& Read Functions
 on Front Panel.

 

Model ZT-1-HIS-MIL Features the Two Most Common Preheat Temps: 100°C & 150°C By Rocker Switch.

airbathPic10
 

Your Lead-Free Solution: Working with the newer lead-free, RoHS compliant solder alloys --- all having higher melting points --- makes preheating more essential to any PCB work at the bench. Don't raise temperatures higher on your soldering irons, desoldering tools, hot air nozzles, thermal tweezers, or hot air pencils! If you just briefly preheat the bottom  of your PCB before reflow, can perform your soldering or desoldering on the top side of the board at traditional, lower temperatures.

 

About the RoHS Lead-Free Solder Mandate: Learn more here about the European Lead-Free Mandate & Preheating. Zephyrtronics AirBath™ preheating systems are your Lead-Free, RoHS soldering solutions radically reducing the elevated solder reflow temps that without preheat are needed with lead-free alloys. No need to burn your PCB's when you have an AirBath™.

 

Allow Us to Show Off A Bit:
Here are a few of the helpful applications and utilities of the ZT-1-HIS AirBaths

         

airbathPic2

1.  Achieve High-End Superb Thermal Profiles at the Bench with the required industry standard 2°-4°C ramping to preheat!  The 2°-4°C ramp is "built in" to every Zephyrtronics AirBath™ and prevents thermal shock of ceramic capacitors, glass diodes and temperature sensitive components, plus ramping helps prevent "pop-corning" of moisture within I.C.'s. Importantly, preheating allows flux activation and the ability to work at lower temps on the  topside of the PCB with your soldering tools. Effective preheating prevents scorching substrates, damaging pads and components during rework or prototyping.

2.  A New Rework Paradigm:   Another benefit of preheating is that it allows you the option to remove your SMD's below 150°C with only an AirBath and  our LOWMELT® De-Solder through the proven process of co-metalization. No nozzles! No lifting pads! No more burning PCB's! Your AirBath puts this extra rework option right at your fingertips.

3.  Non-Contact Hot Air Soldering: One of the more popular benefits of the AirBath is that you can now also use solder "paste" -- as well as solder wire --- as is used in high volume soldering production with a Hot AirPencil just your AirBath™. This is a 100% non-contact (NASA calls it "non-touch") method of soldering at the bench and is, without a doubt, the closest mirror to conveyor oven reflow yielding showcase solder joints complete with fillets at both the toe and the heel of the component, but preheating is mandatory.

4. Thru-Hole Rework: Heavy ground planes? High copper content? Big heat sinks? No problem! Your AirBath™ makes desoldering thru-hole chips a breeze! Place your PCB over the AirBath, turn down temp settings on your desoldering tools and stop lifting pads. This is your preheat boost! You'll never de-solder thru-hole without preheat again.

5. Heat Shrink Tubing: The AirBath is ideal for your shrink tubing. Superior to heat guns that can burn and tear your wire insulation or heat-shrink tubing, the AirBath is temperature controlled.

6.  BGA, CSP Soldering & DeSoldering.  Your AirBath™ is also a modular component to to our comprehensive  ZT-7-ML BGA HOT AIR REFLOW SYSTEM. So even if you are not yet working with BGA's, should you do so in the future, your AirBath™ will already have you half the way there! Because, the AirBath™ has all the essential features for BGA processing incorporated in its design: industry standard ramp rate to preheat; "post-cooling" for rapid cool-down which is critical to the BGA reflow process;  a generous and powerful 25CFM (710 Liters/Minute) of preheat power from the AirCone™ which allows a lower final reflow temperature from your nozzles above.

 

airbathPic1

 

Remove Chip Quickly at Less Than 150°C with  AirBath & LOWMELT® "Never Lift A Pad"

 

Preheating PCB at Benchtop  Mimics High Quality Thermal Profiles on Production Floor

 
       
  airbathPic3  

airbathPic4

 

100% Non Contact , SMT Hot Air Solder Reflow With the AirBath and a  Hot AirPencil. Yields Highest Quality  Joints.

 

Thru-Hole  Desoldering Made Easier & At Lower Temps With The AirBath Preheat Heavy Ground Planes? No Problem!

       
  airbathPic5  
 

 Ideal For Heat Shrink Tube Applications...Far Superior To Uncontrolled Heat Guns!

 

The  AirBath Works Perfectly with the
 
ZT-7-MIL BGA, CSP, SMT &  Thru-Hole Hot Air Reflow Center.

       

Comparing The 4 Methods of Preheating Pre-heating PCB assemblies falls into four categories: Use of hot plates, use of ovens, IR systems, and the use of forced convection (warm air) up under the PCB:. While any preheating of your PCB's prior to solder reflow is certainly better than none, an objective analysis of the various methods of preheating quickly reveals that all preheating methods are not equally effective or beneficial:

 

The Oven: The use of an oven to pre-heat the substrate before reworking and initiating solder reflow for either removal and/or replacement of components can yield the most uniform temperature profile as it warms both the top and bottom of the PCB assembly as ovens also do in high volume production equipment such as conveyor ovens and wave solder machines. It's just a little problematic to crawl inside an oven with your PCB to preheat while your perform selective soldering or desoldering tasks on one side of the board. Of course, one can preheat in an oven and then race with it in your high-gloved hands back to the bench, but it's hardly a solution either.

The Hot Plate: The obvious limitation to the hot plate is that not all PCB assemblies are single sided. In fact, in today's world of hybrid and mixed technologies, the PCB that is entirely flat or plane on one side is an exotic and rare creature indeed. PCB's typically can carry heat sinks, connectors, jumpers and transformers on both sides of the substrate. These uneven surfaces on the board present an indirect path of heat conduction from the hot plate to the board assembly.

The IR Plate Preheater: There are many drawbacks to IR which is why it really never completely caught on. That is not to say that, as with hot plates,  there are some applications that work with IR pre-heaters.  Some of drawbacks which have been enumerated in articles in SMT Magazine, Circuits Assembly and in white papers at electronic conventions are the difficulty in ramping temps (some are better than others); shadowing caused by high profile components on PCB's; and if the IR preheat grid is very large it can make working on small PCB's very uncomfortable for the technician (this is a very common complaint). Still another great disadvantage to IR preheaters is that they can not ever truly be "temperature controlled" without the technician having to always pre-assemble an external thermocouple into every board before working on it. And that's a continuous hassle and headache replete with quality pitfalls and problems with inconsistent results. There are more, but these are some of the key setbacks.

Forced Convection Preheat, The AirBathThe market has long spoken with regards to the distinct advantages and superiority of a warm air bath in the pre-heating process. Forced convection completely disregards the topography (or bottomography) of the PCB, allowing immediate, direct access of the warm air into all of the nooks and crannies of the PCB assembly. And much like the newer, popular forced convection commercial ovens, the circulating warmed air is far more effective than static warm air. 

newAirBath_VS_HotPlate
   

The Picture Tells the Story:
 A Comparison of Two Popular PCB Preheating Methods

 
       

nozzle_theta_copy

Post-Cooling™ By The AirBath™:  Further, an another clear advantage of a Zephyrtronics AirBath™ is that with the flip of a switch the unit immediately becomes a post-cooler™ cooling down your PCB and its components and most importantly, your solder joints. Post-Cooling™ is essential to any soldering of BGA's because hot air nozzles must not be lifted from above the BGA until all the balled joints have cooled so as not to cause unwanted bridging. It's important to point out the obvious: hot plates, static ovens and IR plates do not provide the critical post-cooling™ feature standard on every Zephyrtronics AirBath™. Again, our engineers introduced the concept of post-cooling™ to the benchtop clear back in 1994.

Typically, our AirBaths™ can cool BGA's after reflow within only 8 second permitting the hot air nozzle to be lifted without fear of bridging. Without post-cooling™ the technician has to wait for the ball/pad interface to solidify completely before lifting the nozzle to inspect or to move on to another chip. The Post-Cooling™ feature remedies this problem allowing rapid lifting of your hot air nozzles from over the BGA after soldering.
 

The Post-Cooling™ Mode of the  AirBath™ Cools Down BGA's After Soldering Within 8 Seconds Allowing Quicker Lifting Hot Air Nozzles Preventing Bridging.

 
 
   

Zephyrtronics Led and Leads the World in Preheating PCB's: Judged "Best New Product of the Year" and winner of the prestigious "Vision Award" at the Surface Mount International Expo in Silicon Valley in 1996 for its milestone contribution to the global production of printed circuit cards , Zephyrtronics' AirBath was recognized and spotlighted by SMT Magazine in 1997 as a "safer and simpler method for removing and repairing sensitive devices."

True, our AirBaths have inspired a lot of cheesy imitations which are little more than hair dryers in a box, but that aside, we are still the pioneers and understand the thermodynamics of preheating better than anyone else.  Our
AirBaths are the intelligent solution to stop burning up your printed circuit board assemblies by preventing thermal degradation, thermal  shock, lifting pads & traces, substrate delamination, measling and warping of your boards.

I
t is no wonder for over a decade now, these Zephyrtronics AirBaths have become the pre-heater of choice of nearly every major aerospace and semiconductor manufacturer. It truly is the one single tool that belongs on every bench.  This is the "Science of Zephyrtronics."  We have an AirBath for you.

      Fully MIL-Spec Compliant and Approved for Space Applications!        

The ZT-HIS-DPU Digital AirBath™, Established the Standard for Preheating. Suprisingly Compact in Footprint, It Delivers 25CFM (710 Liters/Minute) and 800 Watts of Pre-heat Power.

 
 

ZT-1-BGS BIG-GRID™ DIGITAL AIRBATH PREHEATER

DESCRIPTION

ITEM #

PRICE

BUY NOW

ZT-1-HIS-DPU_SMALL

 DIGITAL
AIRBATH PREHEATING SYSTEM

 25 CFM Air Power
800 Watt Power
 

ZT-1-HIS-DPU-120
(120 Volt for the U.S., Canada & Mexico)

$1,395

ZT-1-HIS-DPU-230
(230 Volt For All
Int'l Customers)

$1,395

ZT-1-HIS-MIL_SMALL_copy

 ANALOG
AIRBATH PREHEATING SYSTEM

 25 CFM Air Power
800 Watt Power
 

ZT-1-HIS-MIL-120
(120 Volt for the U.S., Canada & Mexico)

$999

*  We manufacture many other sizes of AirBaths.  Please note that the HIS Series are our mid-range capacity pre-heaters and you may want to check out our entire AirBath Catalog Directory where we are certain that we have an AirBath Preheater tailored to your company's PCB needs.

 

ABC SERIES OF ADJUSTABLE BOARD CRADLES

DESCRIPTION

ITEM #

PRICE

BUY NOW

cradle 2 small ADJUSTABLE BOARD CRADLE
3-RAIL (10” X 18” MAX)
ABC-1 $195
ADJUSTABLE BOARD CRADLE
3-RAIL (20” X 18” MAX)
ABC-2 $235
cradle 1 small ADJUSTABLE BOARD CRADLE
QUATRO (10” X 18” MAX)
ABC-1-Q $235
ADJUSTABLE BOARD CRADLE
QUATRO (20” X 18” MAX)
ABC-2-Q $275
 

TECHNICAL DATA & SPECS

  Models:
  ZT-1-HIS-DPU-120:
120 VAC (U.S., Canada & Mexico) Digital Model
 
ZT-1-HIS-DPU-230: 230 VAC International Digital Mode
  ZT-1-HIS-MIL-120:  120 VAC (U.S., Canada & Mexico) Analog Model

  Other: (All Models)
  Power:  800 Watts
  Electrical Construction:  3-Wire Input with Earth Safety Ground

 
 W x H x D:
  12" x 4.5" x 7.2" (30 cm x 11 cm x 18 cm)
  Weight:   5.3 lbs (2.41 Kg)
  Air Volume:   25CFM or 710 Liters/Minute
  Temperature Modes:   Preheating & Cooling from AirCone™
  Preheat Temp Range: Ambient (Room Temp) to 205°C (400°F)

 
Preheat Ramp Rate:   2-4° C per second
 
Cooling Temp:  Ambient (Room Temp)
  Temperature Stability:  
± 3°C (± 5 °F) at Idle.
  Absolute Temperature Stability:  
Meets or Exceeds ANSI-J-STD
  Air Supply:  Self-Contained Internal Supply (No Air Hookups)
  Construction:   All Metal ESD Safe Construction
  Recommended:   Use With ABC Series of Board Cradles / Fixtures

FEATURES & BENEFITS


The Preheating System Used By Boeing on International Space Station
Prevents Thermal Shock of Components
Permits Lower Soldering & DeSoldering Reflow Temperatures
Ideal for the Heaviest PCB's & Lead-Free Applications
Helps Prevent Warping Substrates & Damaging Pads
Superior Forced Convection Preheating
800  Watts of Preheat Power
Powerful 25 CFM (710
Liters/Minute) Air Volume
Digital & Analog Models
Illuminated Indicator Lights.  Pre-Heating:  Red.   Cooling:  Blue.
Analog Preheating Model:  Dual Settings 100°C & 150°C
Digital Preheating Model:  Variable Temp From Room Temp to 205°C
Preheating Ramp Rate at Industry Standard 2°-4°C Per Second
Self-Contained (No Air Hook-Ups Required)
Small, Compact Construction Respects Benchtop Space
ESD Safe

Every Unit is Individually Calibrated at Zephyrtronics' California Factory
 

OPTIONAL ACCESSORIES

DESCRIPTION

ITEM #

PRICE

BUY NOW

EXTRA/REPLACEMENT POSTS (SET OF 4)
2-POST AND 8-POST POSITIONING
(8 POSTS ALLOW PCB INSIDE OF ABC TO BE FLIPPED UP & DOWN DURING THRU-HOLE DESOLDERING)

ABC-LG

$49.85

“Z” HEIGHT ADJUSTMENT POSTS
 (SET OF 4)

ABC-ZP

$100.00

 

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©1996 - 2008 Zephyrtronics®. All rights reserved. The information you receive online from Zephyrtronics® is protected by the copyright laws of the United States. The copyright laws prohibit any copying, redistributing, retransmitting, or repurposing of any copyright-protected material. Zephyrtronics is the registered trademark property of JTI, Inc. "The Science of Zephyrtronics" and "Simplicity Through Innovation" and "Zephlux" and "ZeroLead" and "Zero Balling" and "Zero Residue" and "Post Cooling" are the protected trademark property of JTI, Inc. "Zephyrtronics" and "Low Melt" and "Air Fountain" and "Fountainhead" are the registered trademark properties of JTI Inc. *The above names are the registered property of their respective owners.

 

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